MC10H124
Quad TTL‐to‐MECL
Translator With
TTL Strobe Input
Description
The MC10H124 is a quad translator for interfacing data and control
signals between a saturated logic section and the MECL section of
digital systems. The 10H part is a functional/pinout duplication of the
standard MECL 10K™ family part, with 100% improvement in
propagation delay, and no increase in power-supply current.
Features
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•
Propagation Delay, 1.5 ns Typical
•
Improved Noise Margin 150 mV
16
1
PDIP−16
P SUFFIX
CASE 648−08
20 1
PLLC−20
FN SUFFIX
CASE 775−02
(Over Operating Voltage and Temperature Range)
•
Voltage Compensated
•
MECL 10K Compatible
•
These Devices are Pb-Free, Halogen Free and are RoHS Compliant
5
6
7
4
2
3
1
10
12
15
11
GND = PIN 16
V
CC
( +5.0 VDC) = PIN 9
V
EE
( -5.2 VDC) = PIN 8
13
14
1
16
MARKING DIAGRAMS*
1 20
MC10H124P
AWLYYWWG
10H124G
AWLYYWW
A
WL, L
YY, Y
WW, W
G or
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb-Free Package
Figure 1. Logic Diagram
*For additional marking information, refer to
Application Note
AND8002/D.
ORDERING INFORMATION
Device
MC10H124FNG
MC10H124FNR2G
MC10H124PG
Package
PLCC−20
(Pb-Free)
PLCC−20
(Pb-Free)
PDIP−16
(Pb-Free)
Shipping
†
46 Units/Tube
500/Tape & Reel
25 Units/Tube
†For information on tape and reel specifications, in-
cluding part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure,
BRD8011/D.
©
Semiconductor Components Industries, LLC, 2016
August, 2016
−
Rev. 12
1
Publication Order Number:
MC10H124/D
MC10H124
GND C
OUT
D
OUT
D
OUT
Exposed Pad (EP)
B
OUT
A
OUT
B
OUT
A
OUT
A
IN
COMMON
STROBE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
C
OUT
D
OUT
D
OUT
C
OUT
D
IN
C
IN
V
CC
B
OUT
A
OUT
B
OUT
A
OUT
1
2
16
15
14
13
12
11
C
OUT
D
IN
C
IN
V
CC
MC10H124
3
4
5
6
7
8
10
9
B
IN
V
EE
Pin assignment is for Dual-in-Line Package.
For PLCC pin assignment, see Table 1.
A
IN
COMMON B
IN
V
EE
STROBE
Pin assignment for QFN16 Package.
Figure 2. Pin Assignment
Table 1. DIP CONVERSION TABLE
16-Pin DIL to 20-Pin PLCC
16 PIN DIL
20 PIN PLCC
1
2
2
3
3
4
4
5
5
7
6
8
7
9
8
10
9
12
10
13
11
14
12
15
13
17
14
18
15
19
16
20
Table 2. MAXIMUM RATINGS
Symbol
V
EE
V
CC
V
I
I
out
Power Supply (V
CC
= 5.0 V)
Power Supply (V
EE
=
−5.2
V)
Input Voltage (V
CC
= 5.0 V) TTL
Output Current
Continuous
Surge
Operating Temperature Range
Storage Temperature Range
Plastic
Ceramic
Characteristic
Rating
−8.0
to 0
0 to +7.0
0 to V
CC
50
100
0 to +75
−55
to +150
−55
to +165
Unit
Vdc
Vdc
Vdc
mA
T
A
T
stg
°C
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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2
MC10H124
Table 3. ELECTRICAL CHARACTERISTICS
(V
EE
=
−5.2
V
±5%,
V
CC
= 5.0 V
±
5.0%)
0°
Symbol
I
E
I
CCH
I
CCL
I
R
Characteristic
Negative Power
Supply Drain Current
Positive Power
Supply Drain Current
Reverse Current
Pin 6
Pin 7
Forward Current
Pin 6
Pin 7
Input Breakdown Voltage
Input Clamp Voltage
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
Min
−
−
−
−
−
−
−
5.5
−
−1.02
−1.95
2.0
−
Max
72
16
25
200
50
−12.8
−3.2
−
−1.5
−0.84
−1.63
−
0.8
Min
−
−
−
−
−
−
−
5.5
−
−0.98
−1.95
2.0
−
25°
Max
66
16
25
200
50
−12.8
−3.2
−
−1.5
−0.81
−1.63
−
0.8
Min
−
−
−
−
−
−
−
5.5
−
−0.92
−1.95
2.0
−
75°
Max
72
18
25
200
50
−12.8
−3.2
−
−1.5
−0.735
−1.60
−
0.8
Unit
mA
mA
mA
I
F
mA
V
(BR)in
V
I
V
OH
V
OL
V
IH
V
IL
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained.
Outputs are terminated through a 50
W
resistor to
−2.0
V.
Table 4. AC CHARACTERISTICS
0°
Symbol
t
pd
t
r
t
f
Rise Time
Fall Time
Characteristic
Propagation Delay
Min
0.55
0.5
0.5
Max
2.5
1.5
1.5
Min
0.55
0.5
0.5
25°
Max
2.65
1.6
1.6
Min
0.85
0.5
0.5
75°
Max
3.1
1.7
1.7
Unit
ns
ns
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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MC10H124
APPLICATIONS INFORMATION
The MC10H124 has TTL-compatible inputs and MECL
complementary open-emitter outputs that allow use as an
inverting/non-inverting translator or as a differential line
driver. When the common strobe input is at the low-logic
level, it forces all true outputs to a MECL low-logic state and
all inverting outputs to a MECL high-logic state.
An advantage of this device is that TTL-level information
can be transmitted differentially, via balanced twisted pair
lines, to MECL equipment, where the signal can be received
by the MC10H115 or MC10H116 differential line receivers.
The power supply requirements are ground, +5.0 V, and
−5.2
V.
Resource Reference of Application Notes
AN1405/D
AN1406/D
AN1503/D
AN1504/D
AN1568/D
AN1672/D
AND8001/D
AND8002/D
AND8020/D
AND8066/D
AND8090/D
−
ECL Clock Distribution Techniques
−
Designing with PECL (ECL at +5.0 V)
−
ECLinPSt I/O SPiCE Modeling Kit
−
Metastability and the ECLinPS Family
−
Interfacing Between LVDS and ECL
−
The ECL Translator Guide
−
Odd Number Counters Design
−
Marking and Date Codes
−
Termination of ECL Logic Devices
−
Interfacing with ECLinPS
−
AC Characteristics of ECL Devices
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MC10H124
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE F
B
−N−
Y BRK
D
−L−
−M−
W
D
V
Z
0.007 (0.180)
U
M
T L-M
M
S
N
S
S
0.007 (0.180)
T L-M
N
S
20
1
X
VIEW D−D
G1
0.010 (0.250)
S
T L-M
S
N
S
A
Z
R
0.007 (0.180)
0.007 (0.180)
M
T L-M
T L-M
S
N
N
S
M
S
S
H
K1
0.007 (0.180)
M
T L-M
S
N
S
C
E
0.004 (0.100)
G
G1
0.010 (0.250)
S
T L-M
J
−T−
VIEW S
S
SEATING
PLANE
K
F
VIEW S
0.007 (0.180)
M
T L-M
S
N
S
N
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS
−L−, −M−,
AND
−N−
DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM
−T−,
SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.021
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−−
0.020
2
_
10
_
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.53
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2
_
10
_
7.88
8.38
1.02
−−−
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