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89H12T3BG2ZBBC

Description
PCI Interface IC
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size436KB,30 Pages
ManufacturerIDT (Integrated Device Technology)
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89H12T3BG2ZBBC Overview

PCI Interface IC

89H12T3BG2ZBBC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeBGA
package instructionBGA, BGA324,18X18,40
Contacts324
Reach Compliance Codenot_compliant
ECCN codeEAR99
Address bus width
Bus compatibilityPCI
maximum clock frequency125 MHz
Drive interface standardsIEEE 1149.6AC; IEEE 1149.1
External data bus width
JESD-30 codeS-PBGA-B324
JESD-609 codee0
length19 mm
Humidity sensitivity level3
Number of terminals324
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA324,18X18,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
power supply1,2.5,3.3 V
Certification statusNot Qualified
Maximum seat height1.72 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width19 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
12-Lane 3-Port
Gen2 PCI Express® Switch
®
89HPES12T3BG2
Data Sheet
Preliminary Information*
Device Overview
The 89HPES12T3BG2 is a member of IDT’s PRECISE™ family of
PCI Express® switching solutions. The PES12T3BG2 is a 12-lane, 3-
port Gen2 peripheral chip that performs PCI Express Base switching
with a feature set optimized for high performance applications such as
servers, storage, and communications/networking. It provides connec-
tivity and switching functions between a PCI Express upstream port and
two downstream ports and supports switching between downstream
ports.
Features
High Performance PCI Express Switch
– Twelve 5 Gbps Gen2 PCI Express lanes
– Three switch ports
• One x4 upstream port
• Two x4 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Implements the following optional PCI Express features
• Advanced Error Reporting (AER) on all ports
• End-to-End CRC (ECRC)
• Access Control Services (ACS)
• Power Budgeting Enhanced Capability
• Device Serial Number Enhanced Capability
• Sub-System ID and Sub-System Vendor ID Capability
• VGA and ISA enable
• L0s and L1 ASPM
• ARI ECN
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
On-Die Temperature Sensor
– Range of 0 to 127.5 degrees Celsius
– Three programmable temperature thresholds with over and
under temperature threshold alarms
– Automatic recording of maximum high or minimum low
temperature
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Incorporates on-chip internal memory for packet buffering and
queueing
Block Diagram
3-Port Switch Core / 12 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
Figure 1 Internal Block Diagram
(Port 4)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 30
©
2010 Integrated Device Technology, Inc.
*Notice: The information in this document is subject to change without notice
February 2, 2010

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