MKE02Z32VLC4 datasheet, PDF - EEWORLD Datasheet

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MKE02Z32VLC4: DescriptionARM Microcontrollers - MCU MKE02Z32VLC4/LQFP32///STANDARD MARKING * TRAY DRY; CategoryThe embedded processor and controller Microcontrollers and processors; File Size785KB，37 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MKE02Z32VLC4 Overview

ARM Microcontrollers - MCU MKE02Z32VLC4/LQFP32///STANDARD MARKING * TRAY DRY

MKE02Z32VLC4 Parametric

Parameter Name	Attribute value
Brand Name	Freescale
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Reach Compliance Code	compliant
ECCN code	3A991.A.2
Samacsys Description	MCU 32-bit ARM Cortex M0+ RISC 32KB Flash 3.3V/5V 32-Pin LQFP Tray
JESD-609 code	e3
Humidity sensitivity level	3
Peak Reflow Temperature (Celsius)	260
technology	CMOS
Terminal surface	MATTE TIN
Maximum time at peak reflow temperature	40
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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NXP Semiconductors

Data Sheet: Technical Data

Document Number MKE02P64M40SF0

Rev. 4, 07/2016

KE02 Sub-Family Data Sheet

Supports the following:

MKE02Z16VLC4(R),

MKE02Z32VLC4(R),

MKE02Z64VLC4(R),

MKE02Z16VLD4(R),

MKE02Z32VLD4(R),

MKE02Z64VLD4(R),

MKE02Z32VLH4(R),

MKE02Z64VLH4(R),

MKE02Z32VQH4(R),

MKE02Z64VQH4(R),

MKE02Z16VFM4(R),

MKE02Z32VFM4(R), and

MKE02Z64VFM4(R)

MKE02P64M40SF0

Key features

• Operating characteristics

– Voltage range: 2.7 to 5.5 V

– Flash write voltage range: 2.7 to 5.5 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 40 MHz ARM® Cortex-M0+ core and up to

20 MHz bus clock

– Single cycle 32-bit x 32-bit multiplier

– Single cycle I/O access port

• Memories and memory interfaces

– Up to 64 KB flash

– Up to 256 B EEPROM

– Up to 4 KB RAM

• Clocks

– Oscillator (OSC) - supports 32.768 kHz crystal or 4

MHz to 20 MHz crystal or ceramic resonator; choice

of low power or high gain oscillators

– Internal clock source (ICS) - internal FLL with

internal or external reference, 31.25 kHz pre-

trimmed internal reference for 32 MHz system clock

(able to be trimmed for up to 40 MHz system clock)

– Internal 1 kHz low-power oscillator (LPO)

• System peripherals

– Power management module (PMC) with three power

modes: Run, Wait, Stop

– Low-voltage detection (LVD) with reset or interrupt,

selectable trip points

– Watchdog with independent clock source (WDOG)

– Programmable cyclic redundancy check module

(CRC)

– Serial wire debug interface (SWD)

– Bit manipulation engine (BME)

• Security and integrity modules

– 64-bit unique identification (ID) number per chip

• Human-machine interface

– Up to 57 general-purpose input/output (GPIO)

– Two up to 8-bit keyboard interrupt modules (KBI)

– External interrupt (IRQ)

• Analog modules

– One up to 16-channel 12-bit SAR ADC, operation in

Stop mode, optional hardware trigger (ADC)

– Two analog comparators containing a 6-bit DAC

and programmable reference input (ACMP)

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ordering parts.......................................................................................4

1.1 Determining valid orderable parts............................................... 4

2 Part identification................................................................................. 4

2.1 Description...................................................................................4

2.2 Format.......................................................................................... 4

2.3 Fields............................................................................................4

2.4 Example....................................................................................... 5

3 Parameter classification........................................................................5

4 Ratings..................................................................................................6

4.1 Thermal handling ratings............................................................. 6

4.2 Moisture handling ratings............................................................ 6

4.3 ESD handling ratings................................................................... 6

4.4 Voltage and current operating ratings..........................................7

5 General................................................................................................. 7

5.1 Nonswitching electrical specifications........................................ 7

5.1.1

5.1.2

5.1.3

DC characteristics.......................................................... 7

Supply current characteristics........................................ 14

EMC performance..........................................................15

5.2.2

FTM module timing....................................................... 17

5.3 Thermal specifications................................................................. 18

5.3.1

5.3.2

Thermal operating requirements.................................... 18

Thermal characteristics.................................................. 19

6 Peripheral operating requirements and behaviors................................ 20

6.1 Core modules............................................................................... 20

6.1.1

SWD electricals .............................................................20

6.2 External oscillator (OSC) and ICS characteristics.......................21

6.3 NVM specifications..................................................................... 23

6.4 Analog..........................................................................................24

6.4.1

6.4.2

ADC characteristics....................................................... 25

Analog comparator (ACMP) electricals.........................27

6.5 Communication interfaces........................................................... 28

6.5.1

SPI switching specifications.......................................... 28

7 Dimensions...........................................................................................31

7.1 Obtaining package dimensions.................................................... 31

8 Pinout................................................................................................... 32

8.1 Signal multiplexing and pin assignments.................................... 32

8.2 Device pin assignment................................................................. 34

9 Revision history....................................................................................36

5.2 Switching specifications.............................................................. 16

5.2.1

Control timing................................................................ 16

KE02 Sub-Family Data Sheet, Rev. 4, 07/2016

NXP Semiconductors

MKE02Z32VLC4 Related Products

	MKE02Z32VLC4	MKE02Z32VLH4	MKE02Z32VLD4R	MKE02Z32VLC4R	MKE02Z64VFM4	MKE02Z32VLD4	MKE02Z16VFM4
Description	ARM Microcontrollers - MCU MKE02Z32VLC4/LQFP32///STANDARD MARKING * TRAY DRY	RISC MICROCONTROLLER	ARM Microcontrollers - MCU Kinetis KE02: 40MHz Cortex-M0+ 5V/Robust MCU, 32KB Flash, 4KB SRAM, 44-LQFP	ARM Microcontrollers - MCU MKE02Z32VLC4/LQFP32///REEL 13 Q2/T3 *STANDARD MAR	RISC MICROCONTROLLER	ARM Microcontrollers - MCU MKE02Z32VLD4/LQFP44///STANDARD MARKING * TRAY DRY	ARM Microcontrollers - MCU MKE02Z16VFM4/HVQFN32///STANDARD MARKING * TRAY DRY
Is it Rohs certified?	conform to	conform to	-	-	conform to	conform to	conform to
Reach Compliance Code	compliant	compliant	-	-	compliant	compliant	compliant
ECCN code	3A991.A.2	3A991.A.2	-	-	3A991.A.2	3A991.A.2	-
JESD-609 code	e3	e3	-	-	e3	e3	-
Humidity sensitivity level	3	3	-	-	3	3	-
Peak Reflow Temperature (Celsius)	260	260	-	-	260	260	-
technology	CMOS	CMOS	-	-	CMOS	CMOS	-
Terminal surface	MATTE TIN	Tin (Sn)	-	-	Tin (Sn)	MATTE TIN	-
Maximum time at peak reflow temperature	40	40	-	-	40	40	-
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	-	-	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	-

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