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BCM20730A1KMLGT

Description
RF System on a Chip - SoC Single-Chip BT
CategoryWireless rf/communication    Telecom circuit   
File Size757KB,50 Pages
ManufacturerCypress Semiconductor
Environmental Compliance
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BCM20730A1KMLGT Overview

RF System on a Chip - SoC Single-Chip BT

BCM20730A1KMLGT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerCypress Semiconductor
package instructionQFN-40
Reach Compliance Codecompliant
JESD-30 codeS-XQCC-N40
length6 mm
Number of functions1
Number of terminals40
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialUNSPECIFIED
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height1 mm
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width6 mm
CYW20730
Single-Chip Bluetooth Transceiver for
Wireless Input Devices
The Cypress CYW20730 is a Bluetooth 3.0-compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver. It is
ideal for wireless input device applications including game controllers, keyboards, 3D glasses, remote controls, gestural input devices,
and sensor devices. Built-in firmware adheres to the Bluetooth Human Interface Device (HID) profile and Bluetooth Device ID profile
specifications.
The CYW20730 radio has been designed to provide low power, low cost, and robust communications for applications operating in the
globally available 2.4 GHz unlicensed ISM band. It is fully compliant with Bluetooth Radio Specification 3.0.
The single-chip Bluetooth transceiver is a monolithic component implemented in a standard digital CMOS process and requires
minimal external components to make a fully compliant Bluetooth device. The CYW20730 is available in three package options: a 32-
pin, 5 mm × 5 mm QFN, a 40-pin, 6 mm × 6 mm QFN, and a 64-pin, 7 mm × 7 mm BGA.
Cypress Part Numbering Scheme
Cypress is converting the acquired IoT part numbers from Broadcom to the Cypress part numbering scheme. Due to this conversion,
there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The table provides
Cypress ordering part number that matches an existing IoT part number.
Table 1. Mapping Table for Part Number between Broadcom and Cypress
Broadcom Part Number
BCM20730
BCM20730A2KML2GT
BCM20730A1KML2G
BCM20730A1KMLG
BCM20730A1KFBGT
BCM20730A2KFBG
BCM20730A1KFBG
BCM20730A1KML2GT
BCM20730A2KML2G
BCM20730A1KMLGT
BCM20730A2KFBGT
CYW20730
CYW20730A2KML2GT
CYW20730A1KML2G
CYW20730A1KMLG
CYW20730A1KFBGT
CYW20730A2KFBG
CYW20730A1KFBG
CYW20730A1KML2GT
CYW20730A2KML2G
CYW20730A1KMLGT
CYW20730A2KFBGT
Cypress Part Number
Acronyms and Abbreviations
In most cases, acronyms and abbreviations are defined on first use.
For a comprehensive list of acronyms and other terms used in Cypress documents, go to
http://www.cypress.com/glossary.
Applications
Wireless pointing devices: mice, trackballs, gestural controls
Wireless keyboards
3D glasses
Remote controls
Game controllers
Point-of-sale (POS) input devices
Remote sensors
Home automation
Personal health and fitness monitoring
Cypress Semiconductor Corporation
Document Number: 002-14824 Rev. *J
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised April 25, 2017

BCM20730A1KMLGT Related Products

BCM20730A1KMLGT BCM20730A1KFBGT BCM20730A2KFBGT
Description RF System on a Chip - SoC Single-Chip BT RF System on a Chip - SoC Single-Chip BT RF System on a Chip - SoC Single-Chip BT
Is it lead-free? Lead free - Lead free
Is it Rohs certified? conform to - conform to
Maker Cypress Semiconductor - Cypress Semiconductor
package instruction QFN-40 - FBGA-64
Reach Compliance Code compliant - compliant
JESD-30 code S-XQCC-N40 - S-PBGA-B64
length 6 mm - 7 mm
Number of functions 1 - 1
Number of terminals 40 - 64
Maximum operating temperature 70 °C - 70 °C
Package body material UNSPECIFIED - PLASTIC/EPOXY
encapsulated code HVQCCN - VFBGA
Package shape SQUARE - SQUARE
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED
Maximum seat height 1 mm - 1 mm
Nominal supply voltage 1.2 V - 1.2 V
surface mount YES - YES
technology CMOS - CMOS
Telecom integrated circuit types TELECOM CIRCUIT - TELECOM CIRCUIT
Temperature level COMMERCIAL - COMMERCIAL
Terminal form NO LEAD - BALL
Terminal pitch 0.5 mm - 0.8 mm
Terminal location QUAD - BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED
width 6 mm - 7 mm
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