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89HPES16T4AG2ZCAL

Description
PCI Interface IC PCI EXPRESS SWITCH
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size264KB,32 Pages
ManufacturerIDT (Integrated Device Technology)
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89HPES16T4AG2ZCAL Overview

PCI Interface IC PCI EXPRESS SWITCH

89HPES16T4AG2ZCAL Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeFCBGA
package instructionFCBGA-324
Contacts324
Manufacturer packaging codeAL324
Reach Compliance Codenot_compliant
ECCN codeEAR99
Address bus width
Bus compatibilityPCI
maximum clock frequency100 MHz
External data bus width
JESD-30 codeS-PBGA-B324
JESD-609 codee0
length19 mm
Humidity sensitivity level4
Number of terminals324
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA324,18X18,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
power supply1,2.5,3.3 V
Certification statusNot Qualified
Maximum seat height3.42 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width19 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
16-Lane 4-Port
Gen2 PCI Express® Switch
®
89HPES16T4AG2
Data Sheet
Device Overview
The 89HPES16T4AG2 is a member of IDT’s PRECISE™ family of
PCI Express® switching solutions. The PES16T4AG2 is a 16-lane, 4-
port Gen2 peripheral chip that performs PCI Express Base switching
with a feature set optimized for high performance applications such as
servers, storage, and communications/networking. It provides connec-
tivity and switching functions between a PCI Express upstream port and
up to three downstream ports and supports switching between down-
stream ports.
Features
High Performance PCI Express Switch
– Sixteen 5 Gbps Gen2 PCI Express lanes
– Four switch ports
• One x8 or x4 upstream port
• Up to three x4 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates sixteen 5 Gbps embedded SerDes with 8b/10b
encoder/decoder (no separate transceivers needed)
• Receive equalization (RxEQ)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
– Supports Hot-Swap
Block Diagram
4-Port Switch Core / 16 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 1)
(Port 2)
(Port 3)
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 32
2015 Integrated Device Technology, Inc.
June 2, 2015
DSC 6928

89HPES16T4AG2ZCAL Related Products

89HPES16T4AG2ZCAL 89HPES16T4AG2ZCAL8 89HPES16T4AG2ZCALI 89HPES16T4AG2ZBAL8
Description PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code FCBGA FCBGA FCBGA FCBGA
package instruction FCBGA-324 FCBGA-324 19 X 19 MM, 1 MM PITCH, FCBGA-324 FCBGA-324
Contacts 324 324 324 324
Manufacturer packaging code AL324 AL324 AL324 AL324
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Bus compatibility PCI PCI; SMBUS PCI PCI; SMBUS
maximum clock frequency 100 MHz 100 MHz 100 MHz 100 MHz
JESD-30 code S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609 code e0 e0 e0 e0
length 19 mm 19 mm 19 mm 19 mm
Humidity sensitivity level 4 4 4 4
Number of terminals 324 324 324 324
Maximum operating temperature 70 °C 70 °C 85 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA
Encapsulate equivalent code BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 225 225 225 225
power supply 1,2.5,3.3 V 1,2.5,3.3 V 1,2.5,3.3 V 1,2.5,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.42 mm 3.42 mm 3.42 mm 3.42 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 NOT SPECIFIED 30 NOT SPECIFIED
width 19 mm 19 mm 19 mm 19 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
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