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BD88210GUL-E2

Description
Audio Amplifiers Couping Capless Headphone Amp
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size662KB,26 Pages
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
Environmental Compliance
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BD88210GUL-E2 Overview

Audio Amplifiers Couping Capless Headphone Amp

BD88210GUL-E2 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerROHM Semiconductor
Parts packaging codeBGA
package instructionFBGA, BGA14,4X4,20
Contacts14
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time10 weeks
Commercial integrated circuit typesAUDIO AMPLIFIER
JESD-30 codeS-PBGA-B14
Number of functions2
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA14,4X4,20
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum slew rate7.4 mA
surface mountYES
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
Headphone Amplifiers
Coupling Capacitorless
Headphone Amplifiers
BD88200GUL,BD88210GUL,BD88215GUL,BD88220GUL
No.11102EAT04
●Description
BD88xxxGUL is output coupling capacitorless headphone amplifier. This IC has a negative voltage generator of regulated
type built-in and generates the direct regulated negative voltage from the supply voltage. It is possible to drive headphones
in a ground standard with both voltage of the positive voltage (+2.4V) and the negative voltage (-2.4V). Therefore a
large-capacity output coupling capacitor becomes needless and can reduce a cost, a board area, and the height of the part.
In addition, there is not the signal decrement by the low range to happen by output coupling capacitor and output load
impedance and can output a rich low tone.
And, the function “Virtual ground” is embedded. Noise between IC and Headphone jack can be canceled by using “Virtual
ground” function.
●Features
1) 2.4V to 5.5V Single-Supply Operation
2) No Bulky DC-Blocking Capacitors Required
3) No Degradation of Low-Frequency Response Due to Output Capacitors
4) Virtual Ground-Referenced Outputs
5) Gain setting
BD88200GUL: Variable gain with external resistors
BD88210GUL: -1.0V/V
BD88215GUL: -1.5V/V
BD88220GUL: -2.0V/V
6) Low THD+N
7) Low Supply Current
8) Integrated Negative Power Supply
9) Integrated Short-Circuit and Thermal-Overload Protection
10) Small package
VCSP50L2 (2.1mm x 2.1mm)
●Applications
Mobile Phones, Smart Phones, PDAs, Portable Audio Players, PCs, TVs, Digital Cameras, Digital Video Cameras,
Electronic Dictionaries, Voice Recorders, Bluetooth Head-sets, etc
●Line
up
Type
BD88200GUL
BD88210GUL
2.4½5.5
(No signal)
BD88215GUL
BD88220GUL
-1.5
-2.0
2.0
Supply Supply
Voltage Current
[V]
[mA]
Gain
[V/V]
Variable gain
with external
resister
Maximum
Output Power
[mW]
THD+N
[%]
Noise
Voltage
[µVrms]
PSRR
[dB]
Package
-1.0
80
0.006
(VDD=3.3V,RL=16Ω (VDD=3.3V,RL=16Ω
THD+N≦1%,f=1kHz) Po=10mW,f=1kHz)
10
-80
(f=217Hz)
VCSP50L2
(2.1mm x 2.1mm)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
1/22
2011.03 – Rev. A

BD88210GUL-E2 Related Products

BD88210GUL-E2 BD88220GUL-E2 BD88200GUL-E2
Description Audio Amplifiers Couping Capless Headphone Amp Audio Amplifiers Audio Amplifiers Power Management LSI for Mobile Phone
Is it lead-free? Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to
Parts packaging code BGA BGA BGA
package instruction FBGA, BGA14,4X4,20 2.10 X 2.10 MM, ROHS COMPLIANT, VCSP-14 2.10 X 2.10 MM, ROHS COMPLIANT, VCSP-14
Contacts 14 14 14
Reach Compliance Code compliant compliant compliant
ECCN code EAR99 EAR99 EAR99
Factory Lead Time 10 weeks 10 weeks 10 weeks
Commercial integrated circuit types AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER
JESD-30 code S-PBGA-B14 S-PBGA-B14 S-PBGA-B14
Number of functions 2 2 2
Number of terminals 14 14 14
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA FBGA FBGA
Encapsulate equivalent code BGA14,4X4,20 BGA14,4X4,20 BGA14,4X4,20
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum slew rate 7.4 mA 7.4 mA 7.4 mA
surface mount YES YES YES
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL
Terminal pitch 0.5 mm 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Base Number Matches 1 1 1
Maker ROHM Semiconductor - ROHM Semiconductor
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