EEWORLDEEWORLDEEWORLD

Part Number

Search

MIC4123YME

Description
Gate Drivers Improved 3A Dual High Speed MOSFET Driver (Inverting)
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size358KB,11 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
Download Datasheet Parametric Compare View All

MIC4123YME Online Shopping

Suppliers Part Number Price MOQ In stock  
MIC4123YME - - View Buy Now

MIC4123YME Overview

Gate Drivers Improved 3A Dual High Speed MOSFET Driver (Inverting)

MIC4123YME Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrochip
package instructionHLSOP, SOP8,.24
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time7 weeks
Built-in protectionTRANSIENT
high side driverNO
Interface integrated circuit typeBUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.89 mm
Humidity sensitivity level2
Number of functions1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output current flow directionSINK
Nominal output peak current3 A
Package body materialPLASTIC/EPOXY
encapsulated codeHLSOP
Encapsulate equivalent codeSOP8,.24
Package shapeRECTANGULAR
Package formSMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.68 mm
Maximum slew rate3.5 mA
Maximum supply voltage20 V
Minimum supply voltage4.5 V
surface mountYES
technologyBCDMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
Disconnect time0.1 µs
connection time0.1 µs
width3.9 mm
Base Number Matches1
MIC4123/4124/4125
Micrel, Inc.
MIC4123/4124/4125
Dual 3A-Peak Low-Side MOSFET Driver
Bipolar/CMOS/DMOS Process
General Description
The MIC4123/4124/4125 family are highly reliable BiC-
MOS/DMOS buffer/driver/MOSFET drivers. They are higher
output current versions of the MIC4126/4127/4128, which
are improved versions of the MIC4426/4427/4428. All three
families are pin-compatible. The MIC4123/4124/4125 driv-
ers are capable of giving reliable service in more demanding
electrical environments than their predecessors. They will
not latch under any conditions within their power and voltage
ratings. They can survive up to 5V of noise spiking, of either
polarity, on the ground pin. They can accept, without either
damage or logic upset, up to half an amp of reverse current
(either polarity) forced back into their outputs.
The MIC4123/4124/4125 series drivers are easier to use, more
flexible in operation, and more forgiving than other CMOS
or bipolar drivers currently available. Their BiCMOS/DMOS
construction dissipates minimum power and provides rail-to-
rail voltage swings.
Primarily intended for driving power MOSFETs, the
MIC4123/4124/4125 drivers are suitable for driving other loads
(capacitive, resistive, or inductive) which require low-imped-
ance, high peak currents, and fast switching times. Heavily
loaded clock lines, coaxial cables, or piezoelectric transducers
are some examples. The only known limitation on loading is
that total power dissipated in the driver must be kept within
the maximum power dissipation limits of the package.
Features
Reliable, low-power bipolar/CMOS/DMOS construction
Latch-up protected to >200mA reverse current
Logic input withstands swing to –5V
High 3A-peak output current
Wide 4.5V to 20V operating range
Drives 1800pF capacitance in 25ns
Short <50ns typical delay time
Delay times consistent with in supply voltage change
Matched rise and fall times
TTL logic input independent of supply voltage
Low equivalent 6pF input capacitance
Low supply current
3.5mA with logic-1 input
350µA with logic-0 input
Low 2.3Ω typical output impedance
Output voltage swings within 25mV of ground or V
S
.
‘426/7/8-, ‘1426/7/8-, ‘4426/7/8-compatible pinout
Inverting, noninverting, and differential configurations
Exposed backside pad packaging reduces heat
ePAD SOIC-8L (θ
JA
= 58°C/W)
4mm x 4mm MLF™-8L (θ
JA
= 45°C/W)
Functional Diagram
V
S
0.6mA
0.1mA
INV ERT ING
Integrated Component Count:
4 Resistors
4 Capacitors
52 Transistors
OUTA
INA
2kΩ
NONINV ERTING
0.6mA
0.1mA
INV ERT ING
OU TB
INB
2kΩ
NONINV ERTING
GND
Ground Unused Inputs
Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
May 2005
1
M9999-052405

MIC4123YME Related Products

MIC4123YME MIC4123YME-TR MIC4124YME-TR MIC4124YML-TR MIC4123YML-TR MIC4125YME
Description Gate Drivers Improved 3A Dual High Speed MOSFET Driver (Inverting) Gate Drivers Gate Drivers Gate Drivers Gate Drivers Gate Drivers Improved 3A Dual High Speed MOSFET Driver (Inverting/Non-Inverting)
Is it Rohs certified? conform to conform to conform to - conform to conform to
Maker Microchip Microchip Microchip - Microchip Microchip
package instruction HLSOP, SOP8,.24 SOIC-8 HLSOP, - VDFN-8 HLSOP,
Reach Compliance Code compliant unknown compliant - compliant compliant
ECCN code EAR99 - EAR99 - EAR99 EAR99
Factory Lead Time 7 weeks 7 weeks 14 weeks - 13 weeks 7 weeks
Built-in protection TRANSIENT - TRANSIENT - TRANSIENT TRANSIENT
Interface integrated circuit type BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED PERIPHERAL DRIVER - BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 - S-XDSO-N8 R-PDSO-G8
JESD-609 code e3 - e3 - e4 e3
length 4.89 mm 4.89 mm 4.93 mm - 4 mm 4.93 mm
Number of functions 1 1 2 - 1 2
Number of terminals 8 8 8 - 8 8
Maximum operating temperature 125 °C 125 °C 125 °C - 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C - -40 °C -40 °C
Output current flow direction SINK - SOURCE AND SINK - SINK SINK
Nominal output peak current 3 A 3 A 3 A - 3 A 3 A
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - UNSPECIFIED PLASTIC/EPOXY
encapsulated code HLSOP HLSOP HLSOP - HVSON HLSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - SQUARE RECTANGULAR
Package form SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE - SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
Peak Reflow Temperature (Celsius) 260 - 260 - 260 260
Maximum seat height 1.68 mm 1.68 mm 1.68 mm - 0.9 mm 1.68 mm
Maximum supply voltage 20 V 20 V 20 V - 20 V 20 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V - 4.5 V 4.5 V
surface mount YES YES YES - YES YES
technology BCDMOS BCDMOS BCDMOS - BCDMOS BCDMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
Terminal surface Matte Tin (Sn) - annealed - Matte Tin (Sn) - annealed - Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) - annealed
Terminal form GULL WING GULL WING GULL WING - NO LEAD GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm - 0.65 mm 1.27 mm
Terminal location DUAL DUAL DUAL - DUAL DUAL
Maximum time at peak reflow temperature 40 - 30 - 40 40
width 3.9 mm 3.9 mm 3.94 mm - 4 mm 3.94 mm

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 254  2902  1650  1271  1711  6  59  34  26  35 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号