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PDIUSBD12D,112

Description
USB Interface IC USB INTRFC W/PARL
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size193KB,41 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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PDIUSBD12D,112 Overview

USB Interface IC USB INTRFC W/PARL

PDIUSBD12D,112 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSOIC
package instructionSOP, SOP28,.4
Contacts28
Reach Compliance Codeunknown
Other featuresALSO OPERATES AT 4 TO 5.5V SUPPLY
Address bus width1
Bus compatibility80C51
maximum clock frequency6 MHz
Maximum data transfer rate1 MBps
External data bus width8
JESD-30 codeR-PDSO-G28
length17.9 mm
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP28,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
power supply3.3/5 V
Certification statusNot Qualified
Maximum seat height2.65 mm
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width7.5 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, UNIVERSAL SERIAL BUS
IMPORTANT NOTICE
Dear customer,
As from August 2
nd
2008, the wireless operations of NXP have moved to a new company,
ST-NXP Wireless.
As a result, the following changes are applicable to the attached document.
Company name - Philips Semiconductors
is replaced with
ST-NXP Wireless.
Copyright
- the copyright notice at the bottom of each page “© Koninklijke Philips
Electronics N.V. 200x. All rights reserved”, shall now read: “© ST-NXP Wireless 200x -
All rights reserved”.
Web site
-
http://www.semiconductors.philips.com
is replaced with
http://www.stnwireless.com
Contact information
- the list of sales offices previously obtained by sending an email
to
sales.addresses@www.semiconductors.philips.com,
is now found at
http://www.stnwireless.com
under Contacts.
If you have any questions related to the document, please contact our nearest sales office.
Thank you for your cooperation and understanding.
ST-NXP Wireless
www.stnwireless.com

PDIUSBD12D,112 Related Products

PDIUSBD12D,112 PDIUSBD12D PDIUSBD12PWDH-T PDIUSBD12PW,112
Description USB Interface IC USB INTRFC W/PARL USB Interface IC USB INTRFC W/PARL BUS USB Interface IC USB INTRFC W/PARL BUS USB interface integrated circuit USB I-FACE
Is it Rohs certified? conform to conform to - conform to
Maker NXP NXP - NXP
Parts packaging code SOIC SOIC - TSSOP
package instruction SOP, SOP28,.4 7.50 MM , PLASTIC, MS-013, SOT-136-1, SOP-28 - 4.40 MM , PLASTIC, MO-153, SOT-361-1, TSSOP-28
Contacts 28 28 - 28
Reach Compliance Code unknown unknown - unknown
Other features ALSO OPERATES AT 4 TO 5.5V SUPPLY ALSO OPERATES AT 4 TO 5.5V SUPPLY - ALSO OPERATES AT 4 TO 5.5V SUPPLY
Address bus width 1 1 - 1
Bus compatibility 80C51 80C51 - 80C51
maximum clock frequency 6 MHz 6 MHz - 6 MHz
Maximum data transfer rate 1 MBps 1 MBps - 1 MBps
External data bus width 8 8 - 8
JESD-30 code R-PDSO-G28 R-PDSO-G28 - R-PDSO-G28
length 17.9 mm 17.9 mm - 9.7 mm
Number of terminals 28 28 - 28
Maximum operating temperature 85 °C 85 °C - 85 °C
Minimum operating temperature -40 °C -40 °C - -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code SOP SOP - TSSOP
Encapsulate equivalent code SOP28,.4 SOP28,.4 - TSSOP28,.25
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260 245 - NOT SPECIFIED
power supply 3.3/5 V 3.3/5 V - 3.3/5 V
Certification status Not Qualified Not Qualified - Not Qualified
Maximum seat height 2.65 mm 2.65 mm - 1.1 mm
Maximum supply voltage 3.6 V 3.6 V - 3.6 V
Minimum supply voltage 3 V 3 V - 3 V
Nominal supply voltage 3.3 V 3.3 V - 3.3 V
surface mount YES YES - YES
technology CMOS CMOS - CMOS
Temperature level INDUSTRIAL INDUSTRIAL - INDUSTRIAL
Terminal form GULL WING GULL WING - GULL WING
Terminal pitch 1.27 mm 1.27 mm - 0.65 mm
Terminal location DUAL DUAL - DUAL
Maximum time at peak reflow temperature 40 40 - NOT SPECIFIED
width 7.5 mm 7.5 mm - 4.4 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, UNIVERSAL SERIAL BUS BUS CONTROLLER, UNIVERSAL SERIAL BUS - BUS CONTROLLER, UNIVERSAL SERIAL BUS
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