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SST39VF1681-70-4C-B3K

Description
NOR Flash 2M X 8 70ns
Categorystorage    storage   
File Size349KB,29 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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SST39VF1681-70-4C-B3K Overview

NOR Flash 2M X 8 70ns

SST39VF1681-70-4C-B3K Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeBGA
package instructionTFBGA,
Contacts48
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time70 ns
Other featuresBOTTOM BOOT BLOCK
startup blockBOTTOM
JESD-30 codeR-PBGA-B48
JESD-609 codee3
length8 mm
memory density16777216 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Programming voltage2.7 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMATTE TIN
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
typeNOR TYPE
width6 mm
16 Mbit (x8) Multi-Purpose Flash Plus
SST39VF1681 / SST39VF1682
SST39VF1681 / 16822.7V 16Mb (x8) MPF+ memories
Preliminary Specifications
FEATURES:
• Organized as 2M x8
• Single Voltage Read and Write Operations
– 2.7-3.6V
• Superior Reliability
– Endurance: 100,000 Cycles (Typical)
– Greater than 100 years Data Retention
• Low Power Consumption (typical values at 5 MHz)
– Active Current: 9 mA (typical)
– Standby Current: 3 µA (typical)
– Auto Low Power Mode: 3 µA (typical)
• Hardware Block-Protection/WP# Input Pin
– Top Block-Protection (top 64 KByte)
for SST39VF1682
– Bottom Block-Protection (bottom 64 KByte)
for SST39VF1681
• Sector-Erase Capability
– Uniform 4 KByte sectors
• Block-Erase Capability
– Uniform 64 KByte blocks
• Chip-Erase Capability
• Erase-Suspend/Erase-Resume Capabilities
• Hardware Reset Pin (RST#)
• Security-ID Feature
– SST: 128 bits; User: 128 bits
• Fast Read Access Time:
– 70 ns
– 90 ns
• Latched Address and Data
• Fast Erase and Byte-Program:
– Sector-Erase Time: 18 ms (typical)
– Block-Erase Time: 18 ms (typical)
– Chip-Erase Time: 40 ms (typical)
– Byte-Program Time: 7 µs (typical)
• Automatic Write Timing
– Internal V
PP
Generation
• End-of-Write Detection
– Toggle Bits
– Data# Polling
• CMOS I/O Compatibility
• JEDEC Standard
– Flash EEPROM Pinouts and Command sets
• Packages Available
– 48-ball TFBGA (6mm x 8mm)
– 48-lead TSOP (12mm x 20mm)
PRODUCT DESCRIPTION
The SST39VF168x devices are 2M x8 CMOS Multi-Pur-
pose Flash Plus (MPF+) manufactured with SST’s propri-
etary, high performance CMOS SuperFlash technology.
The split-gate cell design and thick-oxide tunneling injec-
tor attain better reliability and manufacturability compared
with alternate approaches. The SST39VF168x write (Pro-
gram or Erase) with a 2.7-3.6V power supply. These
devices conform to JEDEC standard pinouts for x8 mem-
ories.
Featuring high performance Byte-Program, the
SST39VF168x devices provide a typical Byte-Program
time of 7 µsec. These devices use Toggle Bit or Data# Poll-
ing to indicate the completion of Program operation. To pro-
tect against inadvertent write, they have on-chip hardware
and Software Data Protection schemes. Designed, manu-
factured, and tested for a wide spectrum of applications,
these devices are offered with a guaranteed typical endur-
ance of 100,000 cycles. Data retention is rated at greater
than 100 years.
The SST39VF168x devices are suited for applications that
require convenient and economical updating of program,
configuration, or data memory. For all system applications,
©2003 Silicon Storage Technology, Inc.
S71243-03-000
11/03
1
they significantly improve performance and reliability, while
lowering power consumption. They inherently use less
energy during Erase and Program than alternative flash
technologies. The total energy consumed is a function of
the applied voltage, current, and time of application. Since
for any given voltage range, the SuperFlash technology
uses less current to program and has a shorter erase time,
the total energy consumed during any Erase or Program
operation is less than alternative flash technologies. These
devices also improve flexibility while lowering the cost for
program, data, and configuration storage applications.
The SuperFlash technology provides fixed Erase and Pro-
gram times, independent of the number of Erase/Program
cycles that have occurred. Therefore the system software
or hardware does not have to be modified or de-rated as is
necessary with alternative flash technologies, whose
Erase and Program times increase with accumulated
Erase/Program cycles.
To meet high density, surface mount requirements, the
SST39VF168x are offered in both 48-ball TFBGA and
48-lead TSOP packages. See Figures 1 and 2 for pin
assignments.
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
MPF is a trademark of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.

SST39VF1681-70-4C-B3K Related Products

SST39VF1681-70-4C-B3K SST39VF1682-70-4C-B3K
Description NOR Flash 2M X 8 70ns NOR Flash 2M X 8 70ns
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Maker Microchip Microchip
Parts packaging code BGA BGA
package instruction TFBGA, 6 X 8 MM, 0.80 MM PITCH, MO-210AB-1, TFBGA-48
Contacts 48 48
Reach Compliance Code compliant compliant
ECCN code EAR99 EAR99
Maximum access time 70 ns 70 ns
Other features BOTTOM BOOT BLOCK TOP BOOT BLOCK
startup block BOTTOM TOP
JESD-30 code R-PBGA-B48 R-PBGA-B48
JESD-609 code e3 e3
length 8 mm 8 mm
memory density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
memory width 8 8
Number of functions 1 1
Number of terminals 48 48
word count 2097152 words 2097152 words
character code 2000000 2000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 2MX8 2MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260
Programming voltage 2.7 V 2.7 V
Certification status Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface MATTE TIN MATTE TIN
Terminal form BALL BALL
Terminal pitch 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 40 40
type NOR TYPE NOR TYPE
width 6 mm 6 mm
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