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89HPES4T4ZBBCG8

Description
PCI Interface IC PCI EXPRESS SWITCH
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size334KB,30 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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89HPES4T4ZBBCG8 Overview

PCI Interface IC PCI EXPRESS SWITCH

89HPES4T4ZBBCG8 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeCABGA
package instructionLBGA, BGA144,12X12,40
Contacts144
Manufacturer packaging codeBCG144
Reach Compliance Codecompliant
ECCN codeEAR99
Samacsys DescriptionCHIP ARRAY BGA 13 X 13 X 1.4 MM 1.0MM P
Address bus width
Bus compatibilityPCI; SMBUS
External data bus width
JESD-30 codeS-PBGA-B144
JESD-609 codee1
length13 mm
Humidity sensitivity level3
Number of terminals144
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA144,12X12,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)260
power supply1,3.3 V
Certification statusNot Qualified
Maximum seat height1.5 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width13 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
4-Lane 4-Port
PCI Express® Switch
®
89HPES4T4
Data Sheet
The 89HPES4T4 is a member of IDT’s PRECISE™ family of PCI
Express switching solutions. The PES4T4 is a 4-lane, 4-port peripheral
chip that performs PCI Express Base switching. It provides connectivity
and switching functions between a PCI Express upstream port and up to
four downstream ports and supports switching between downstream
ports.
Device Overview
Features
High Performance PCI Express Switch
– Four 2.5 Gbps PCI Express lanes
– Four switch ports
– x1 Upstream port
– Three x1 Downstream ports
– Low latency cut-through switch architecture
– Support for Max payload sizes up to 256 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic lane reversal on all ports
– Automatic polarity inversion on all lanes
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates four 2.5 Gbps embedded SerDes with 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
Power Management
– Utilizes advanced low-power design techniques to achieve low
typical power consumption
– Supports PCI Power Management Interface specification (PCI-
PM 1.2)
– Unused SerDes are disabled.
– Supports Advanced Configuration and Power Interface Speci-
fication, Revision 2.0 (ACPI) supporting active link state
Testability and Debug Features
– Built in Pseudo-Random Bit Stream (PRBS) generator
– Numerous SerDes test modes
– Ability to bypass link training and force any link into any mode
– Provides statistics and performance counters
Block Diagram
4-Port Switch Core / 4 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
(Port 3)
(Port 4)
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 30
2014 Integrated Device Technology, Inc.
June 12, 2014

89HPES4T4ZBBCG8 Related Products

89HPES4T4ZBBCG8 89HPES4T4ZBBCGI 89HPES4T4ZBBCI8
Description PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Contains lead
Is it Rohs certified? conform to conform to incompatible
Parts packaging code CABGA CABGA CABGA
package instruction LBGA, BGA144,12X12,40 CABGA-144 CABGA-144
Contacts 144 144 144
Manufacturer packaging code BCG144 BCG144 BC144
Reach Compliance Code compliant compliant not_compliant
ECCN code EAR99 EAR99 EAR99
Bus compatibility PCI; SMBUS PCI PCI; SMBUS
JESD-30 code S-PBGA-B144 S-PBGA-B144 S-PBGA-B144
JESD-609 code e1 e1 e0
length 13 mm 13 mm 13 mm
Humidity sensitivity level 3 3 3
Number of terminals 144 144 144
Maximum operating temperature 70 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA
Encapsulate equivalent code BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) 260 260 225
power supply 1,3.3 V 1,3.3 V 1,3.3 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.5 mm 1.5 mm 1.5 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED 30 NOT SPECIFIED
width 13 mm 13 mm 13 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) -
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