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ZL50019GAG2

Description
Digital Bus Switch ICs Pb Free 2K with rate conversion+S4E DPLL
CategoryWireless rf/communication    Telecom circuit   
File Size710KB,121 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
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ZL50019GAG2 Overview

Digital Bus Switch ICs Pb Free 2K with rate conversion+S4E DPLL

ZL50019GAG2 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Parts packaging codeBGA
package instructionBGA, BGA256,16X16,40
Contacts256
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B256
JESD-609 codee1
length17 mm
Number of functions1
Number of terminals256
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA256,16X16,40
Package shapeSQUARE
Package formGRID ARRAY
power supply1.8,3.3 V
Certification statusNot Qualified
Maximum seat height1.8 mm
Maximum slew rate165 mA
Nominal supply voltage1.8 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesDIGITAL TIME SWITCH
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width17 mm
Base Number Matches1
ZL50019
Enhanced 2 K Digital Switch with
Stratum 4E DPLL
Data Sheet
Features
2048 channel x 2048 channel non-blocking digital
Time Division Multiplex (TDM) switch at 8.192
and 16.384 Mbps or using a combination of ports
running at 2.048, 4.096, 8.192 and 16.384 Mbps
32 serial TDM input, 32 serial TDM output
streams
Integrated Digital Phase-Locked Loop (DPLL)
exceeds Telcordia GR-1244-CORE Stratum 4E
specifications
Output clocks have less than 1 ns of jitter (except
for the 1.544 MHz output)
DPLL provides holdover, freerun and jitter
attenuation features with four independent
reference source inputs
Exceptional input clock cycle to cycle variation
tolerance (20 ns for all rates)
Output streams can be configured as bi-
directional for connection to backplanes
V
DD_CORE
V
DD_IO
V
DD_COREA
V
DD_IOA
September 2011
Ordering Information
ZL50019GAC
256 Ball PBGA
Trays
ZL50019QCG1 256 Lead LQFP* Trays, Bake &
Drypack
ZL50019GAG2
256 Ball PBGA** Trays, Bake &
Drypack
*Pb Free Matte Tin
**Pb Free Tin/Silver/Copper
-40C to +85C
Per-stream input and output data rate conversion
selection at 2.048, 4.096, 8.192 or 16.384 Mbps.
Input and output data rates can differ
Per-stream high impedance control outputs
(STOHZ) for 16 output streams
Per-stream input bit delay with flexible sampling
point selection
Per-stream output bit and fractional bit
advancement
V
SS
RESET
ODE
STi[31:0]
FPi
CKi
MODE_4M0
MODE_4M1
REF0
REF1
REF2
REF3
REF_FAIL0
REF_FAIL1
REF_FAIL2
REF_FAIL3
S/P Converter
Data Memory
P/S Converter
STio[31:0]
Input Timing
Connection Memory
Output HiZ
Control
STOHZ[15:0]
DPLL
Output Timing
FPo[3:0]
CKo[5:0]
FPo_OFF[2:0]
OSC_EN
OSC
Internal Registers &
Microprocessor Interface
Test Port
TDi
OSCo
DS_RD
R/W_WR
Figure 1 - ZL50019 Functional Block Diagram
Zarlink Semiconductor US Patent No. 5,602,884, UK Patent No. 0772912,
France Brevete S.G.D.G. 0772912; Germany DBP No. 69502724.7-08
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2004-2011, Zarlink Semiconductor Inc. All Rights Reserved.
MOT_INTEL
DTA_RDY
D[15:0]
A[13:0]
OSCi
TRST
TMS
TCK
TDo
IRQ
CS

ZL50019GAG2 Related Products

ZL50019GAG2 ZL50019QCG1
Description Digital Bus Switch ICs Pb Free 2K with rate conversion+S4E DPLL Digital Bus Switch ICs Pb Free 2K with+conversion and S4E DPLL
Is it Rohs certified? conform to conform to
Parts packaging code BGA QFP
package instruction BGA, BGA256,16X16,40 LFQFP, QFP256,1.2SQ,16
Contacts 256 256
Reach Compliance Code compliant compliant
JESD-30 code S-PBGA-B256 S-PQFP-G256
JESD-609 code e1 e3
length 17 mm 28 mm
Number of functions 1 1
Number of terminals 256 256
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA LFQFP
Encapsulate equivalent code BGA256,16X16,40 QFP256,1.2SQ,16
Package shape SQUARE SQUARE
Package form GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH
power supply 1.8,3.3 V 1.8,3.3 V
Certification status Not Qualified Not Qualified
Maximum seat height 1.8 mm 1.6 mm
Maximum slew rate 165 mA 165 mA
Nominal supply voltage 1.8 V 1.8 V
surface mount YES YES
technology CMOS CMOS
Telecom integrated circuit types DIGITAL TIME SWITCH DIGITAL TIME SWITCH
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface TIN SILVER COPPER MATTE TIN
Terminal form BALL GULL WING
Terminal pitch 1 mm 0.4 mm
Terminal location BOTTOM QUAD
width 17 mm 28 mm
Base Number Matches 1 1
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