CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1.
JA
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2.
JC
, the “case temp” location is the center of the package underside.
3. Heat sink may be required for 100k bits/s at +125°C and output short circuit at +125°C.
4. The fuses used for output overvoltage protection may be blown by a fault at each output of greater than ±6.5V relative to GND.
DC Electrical Specifications
Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified.
Temperature limits established by characterization and are not production tested.
CONDITIONS
(Note 5)
No Load (0k to 100k bits/s)
No Load (0k to 100k bits/s)
No Load (0k to 100k bits/s)
No Load (0k to 100k bits/s)
DC PARAMETER
Supply Current +V (Operating)
Supply Current -V (Operating)
Supply Current V
1
(Operating)
Supply Current V
REF
(Operating)
Logic “1” Input Voltage
Logic “0” Input Voltage
Output Voltage High (Output to GND)
Output Voltage Low (Output to GND)
Output Voltage Null
Input Current (Input Low)
Input Current (Input High)
Output Short Circuit Current
(Output High)
Output Short Circuit Current
(Output Low)
Output Impedance
NOTES:
SYMBOL
I
CCOP
(+V)
I
CCOP
(-V)
I
CCOP
(V
1
)
I
CCOP
(V
REF
)
V
IH
V
IL
V
OH
V
OL
V
NULL
I
IL
I
IH
I
OHSC
I
OLSC
Z
O
MIN
-
-16
-
-1.0
2.0
-
MAX
16
-
975
-
-
0.5
V
REF
(+250mV)
-V
REF
(+250mV)
+250
-
10
-80
-
90
UNITS
mA
mA
µA
mA
V
V
No Load (0k to 100k bits/s)
No Load (0k to 100k bits/s)
No Load (0k to 100k bits/s)
V
REF
(-250mV)
-V
REF
(-250mV)
-250
-20
-
mV
mA
mA
mA
mA
Short to GND
Short to GND
T
A
= +25°C
-
80
60
5. +V = +15V ±10%, -V = -15V ±10%, V
1
= V
REF
= 5V ±5%, unless otherwise specified T
A
= -40°C to +85°C for HS-3182-9+ and
T
A
= -55°C to +125°C for HS-3182-8.
FN2963 Rev 3.00
May 30, 2008
Page 3 of 7
HS-3182
AC Electrical Specifications
AC PARAMETER
Rise Time (A
OUT
, B
OUT
)
SYMBOL
t
R
CONDITIONS
(Note 6)
C
A
= C
B
= 75pF, (Note 7)
(at T
A
= -55°C Only)
C
A
= C
B
= 300pF, (Note 7)
Fall Time (A
OUT
, B
OUT
)
t
F
C
A
= C
B
= 75pF, (Note 8)
(at T
A
= -55°C Only)
C
A
= C
B
= 300pF, (Note 8)
Propagation Delay Input to Output
Propagation Delay Input to Output
NOTES:
6. +V = +15V, -V = -15V, V
1
= V
REF
= 5V, unless otherwise specified T
A
= -40°C to +85°C for HS-3182-9+ and T
A
= -55°C to +125°C for
HS-3182-8.
7. t
R
measured 50% to 90% x 2, no load.
8. t
F
measured 50% to 10% x 2, no load.
t
PLH
t
PHL
C
A
= C
B
= 75pF, No Load
C
A
= C
B
= 75pF, No Load
MIN
1
0.9
3
1
0.9
3
-
-
MAX
2
2.4
9
2
2.4
9
3.3
3.3
UNITS
µs
µs
µs
µs
µs
µs
µs
µs
Electrical Specifications
PARAMETER
Input Capacitance
Supply Current +V (Short Circuit)
Supply Current -V (Short Circuit)
NOTES:
9. Limits established by characterization and are not production tested.
SYMBOL
C
IN
I
SC
(+V)
I
SC
(-V)
T
A
= +25°C
Short to GND, T
A
= +25°C
Short to GND, T
A
= +25°C
CONDITIONS
(NOTE 9)
MIN
-
-
-150
MAX
15
150
-
UNITS
pF
mA
mA
Power Specifications
DATA RATE
(k BITS/s)
0 to 100
12.5 to 14
100
NOTES:
No Load
Nominal Power at +25°C, +V = +15V, -V = -15V, V1 = VREF = 5V, Notes 10, 12
LOAD
+V
11mA
24mA
46mA
V-
-10mA
-24mA
-46mA
V
1
600µA
600µA
600µA
CHIP POWER
325mW
660mW
1 Watt
POWER DISSIPATION IN
LOAD
0
60mW
325mW
Full Load, Note 11
Full Load, Note 11
10. Heat sink may be required for 100k bits/s at +125°C and output short circuit at +125°C.
Thermal characteristics: T
(CASE)
= T
(Junction)
-
(Junction - Case)
P
(Dissipation)
.
Where: T
(Junction Max)
= +175°C
(Junction - Case)
= 10.9°C/W (6.1°C/W for LCC)
(Junction - Ambient)
= 73.5°C/W (54.0°C/W for LCC)
11. Full Load for ARINC 429: R
L
= 400 and C
L
= 30,000pF in parallel between A
OUT
and B
OUT
(See “Block Diagram” on page 2).
12. Output Overvoltage Protection: The fuses used for output overvoltage protection may be blown by a fault at each output of greater than
6.5V
relative to GND.
FN2963 Rev 3.00
May 30, 2008
Page 4 of 7
HS-3182
Driver Waveforms
50%
5V
0V
5V
0V
ADJ. BY
C
B
ADJ. BY
C
A
t
PHL
B
OUT
0V
-V
REF
50%
50%
t
R
t
PLH
2V
REF
HIGH
NULL
-4.75V TO -5.25V
+9.5V TO +10.5V
DATA (A) 0V
DATA (B) 0V
V
REF
A
OUT
0V
50%
+4.75V TO +5.25V
-V
REF
V
REF
-4.75V TO -5.25V
+4.75V TO +5.25V
DIFFERENTIAL
OUTPUT
A
OUT
- B
OUT
0V
-2V
REF
t
F
LOW
NOTE: OUTPUTS UNLOADED
-9.5V TO -10.5V
NOTES:
t
R
measured 50% to 90% x 2
t
F
measured 50% to 10% x 2
V
IH
= 5V
V
IL
= 0V
V
OL
= -4.75V to -5.25V
V
OH
= 4.75V to 5.25V
When the Data (A) input is in the Logic One state and the Data (B)
input is in the Logic Zero state, A
OUT
is equal to V
REF
and B
OUT
is
equal to -V
REF
. This constitutes the Output High state. Data (A) and
Data (B) both in the Logic Zero state causes both A
OUT
and B
OUT
to be equal to 0V which designates the output Null state. Data (A) in
the Logic Zero state and Data (B) in the Logic One state causes
A
OUT
to be equal to -V
REF
and B
OUT
to be equal to V
REF
which is
the Output Low state.
Burn-In Schematic
V
1
DATA (B)
+V
V
IH
C
3
16
1
15
2
14
13 12 11
HS-3182
3
4
5
6
C
2
10
7
9
8
R
C
1
V
IH
B
V
IL
A
V
IL
DATA (A)
-V
GND
NOTES:
R = 400 ± 5%
C
1
= 0.03mF ± 20%
C
2
= C
3
= 500pF, NPO
+V = +15.5V ± 0.5V
-V = -15.5V ± 0.5V
V
1
= +5.5V ± 0.5V
A 0.0mF decoupling capacitor is required on each of the three
supply lines (+V, -V and V
1
) at every 3rd Burn-In socket.
Ambient Temp. Max. = +125°C.
Package = 16 Lead Side Brazed DIP.
Pulse Conditions = A & B = 6.25kHz ±10%. B is delayed one-half
I think some of you have used CC2500 wireless chip? I am using it recently, but I have a lot of questions about its configuration. I hope experts can give me some advice and help me get out of the sea...
[font=Times New Roman] [/font] [font=宋体][size=10.5pt]The electrostatic induction perimeter alarm detector is essentially different from perimeter alarm systems such as microwave radiation, infrared ra...
I tried to make a board with a chip packaged Macrochip microcomputer, but I can't burn the program using the MAX232 serial port. After powering on, a square wave appears on the chip's 27 pin (ALE), an...
Recently, there have been many rumors about the 2G network being phased out, and various news have been flying around, even becoming a hot search topic. How do we interpret the true meaning of this in...
As the number of cars increases, environmental pressures are also increasing. At this time, some people are saying that new energy vehicles are energy-efficient and environmentally friendly, and ar...[Details]
As the main model among new energy vehicles, pure electric vehicles have received strong support and encouragement from the country in recent years, and their development is changing with each pass...[Details]
Based on a survey of more than ten intelligent robot companies, this article sorts out and analyzes the current development status of the intelligent industry and the challenges and differences it ...[Details]
Since the beginning of this year, price wars have intensified, new models have been launched one after another, used cars with zero kilometers have become a hot topic, and the industry's internal c...[Details]
1 Source of creativity
With the further development of electronic technology, electronic pets have gradually entered people's family life. At present, there are two main categories of relative...[Details]
With the development of science, the use of variable frequency technology is becoming more and more widespread, and it is used in both industrial equipment and household appliances. Inverter air co...[Details]
While the current industry consensus is that autonomous vehicles are robots and that their systems are managed using robotics-developed thinking, there are also cases where autonomous driving is ac...[Details]
Industrial computers with GPUs leverage powerful parallel processing to build deep learning models to analyze and respond to optical inputs. The systems develop an understanding of visual data to i...[Details]
MQTT Ethernet I/O modules primarily collect I/O port information and transmit data over the network. In addition to being a TCP server, Ethernet I/O modules can also function as TCP clients. Furthe...[Details]
Common methods for troubleshooting roller press bearing wear include repair welding, thermal spraying, brush plating, and scrapping and replacement. However, these methods are often subject to asse...[Details]
The driving mode is not unfamiliar to vehicles. According to the driving mode of the vehicle, there are front-wheel drive, rear-wheel drive and even four-wheel drive. Four-wheel drive is a major se...[Details]
The range of an electric vehicle is crucial to the driving experience, and range anxiety is a common headache when driving an electric vehicle. Although the latest electric vehicles can achieve a r...[Details]
Summer is the peak season for buying and using air conditioners. Do you pay attention to the energy efficiency of your air conditioner? Did you buy a DC inverter air conditioner? Do you know the re...[Details]
Nascent Micro is launching devices covering a wide range of power applications, including gallium nitride (GaN) drivers, dual-channel automotive drivers, and battery protection MOSFETs.
...[Details]
As a core component of electric vehicles, power batteries, like batteries for other electronic products, inevitably experience degradation after a certain period of use due to their characteristics...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
