(Note) Basically, mount ICs to the printed circuit board for use. (If the ICs are not mounted to the printed circuit board, the characteristics of ICs may not be fully
demonstrated.)
Mount 0.1µF capacitors in the vicinity of the IC PINs between PIN 1 (VDD2) and PIN 2 (VSS2), PIN 5 (AVDD) and PIN 6 (AVSS), PIN 11 (DVSS) and PIN 12
(DVDD), respectively.
Depending on the conditions of the printed circuit board, mount an additional electrolytic capacitor between the power supply and GND terminal.
For EMI protection, it is effective to put ferrite beads in the origin of power to be supplied to the BU2363FV from the board or to insert a capacitor (of not more
than 1), which bypasses high frequency desired, between the power supply and the GND.
(Note 1) In the case of exceeding at Ta = 25°C, 4.5mW should be reduced per 1°C
(Note) Operating is not guaranteed.
(Note) Power dissipation is measured when the IC is mounted to the printed circuit board.
Caution:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
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