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BR24G128FJ-3GTE2

Description
EEPROM I2C BUS(2-Wre) 128K SOP-J8 EEPROM
Categorystorage   
File Size582KB,37 Pages
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
Environmental Compliance
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BR24G128FJ-3GTE2 Overview

EEPROM I2C BUS(2-Wre) 128K SOP-J8 EEPROM

BR24G128FJ-3GTE2 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerROHM Semiconductor
Product CategoryEEPROM
RoHSDetails
Mounting StyleSMD/SMT
Package / CaseSOP-J-8
Memory Size128 kbit
Organization16 k x 8
Interface TypeSerial, 2-Wire, I2C
Data Retention40 Year
Maximum Clock Frequency400 kHz
Supply Current - Max2.5 mA
Supply Voltage - Min1.6 V
Supply Voltage - Max5.5 V
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 85 C
PackagingCut Tape
PackagingMouseReel
PackagingReel
Operating Supply Current2.5 mA
Operating Supply Voltage1.6 V to 5.5 V
Factory Pack Quantity2500
Unit Weight0.030018 oz
Datasheet
Serial EEPROM Series Standard EEPROM
I
2
C BUS EEPROM (2-Wire)
BR24G128-3
General Description
BR24G128-3 series is a serial EEPROM of I
2
C BUS Interface Method
Features
Completely conforming to the world standard I
2
C
BUS.
All controls available by 2 ports of serial clock
(SCL) and serial data (SDA)
Other devices than EEPROM can be connected to
the same port, saving microcontroller port
1.6V to 5.5V Single Power Source Operation most
suitable for battery use
1.6V to 5.5V wide limit of operating voltage, possible
FAST MODE 400kHz operation
Page Write Mode useful for initial value write at
factory shipment
Self-timed Programming Cycle
Low Current Consumption
Prevention of Write Mistake
Write (Write Protect) Function Added
Prevention of Write Mistake At Low Voltage
More than 1 million write cycles
More than 40 years data retention
Noise filter built in SCL / SDA terminal
Initial delivery state FFh
Packages
W(Typ) x D(Typ) x H(Max)
DIP-T8
9.30mm x 6.50mm x 7.10mm
TSSOP-B8
3.00mm x 6.40mm x 1.20mm
SOP8
5.00mm x 6.20mm x 1.71mm
TSSOP-B8J
3.00mm x 4.90mm x 1.10mm
SOP- J8
4.90mm x 6.00mm x 1.65mm
MSOP8
2.90mm x 4.00mm x 0.90mm
SSOP-B8
3.00mm x 6.40mm x 1.35mm
VSON008X2030
2.00mm x 3.00mm x 0.60mm
Figure 1.
BR24G128-3
Capacity
Bit Format
Type
BR24G128-3
BR24G128F-3
BR24G128FJ-3
BR24G128FV-3
128Kbit
16K×8
BR24G128FVT-3
BR24G128FVJ-3
BR24G128FVM-3
BR24G128NUX-3
1.6V to 5.5V
TSSOP-B8
TSSOP-B8J
MSOP8
VSON008X2030
Power Source
Voltage
Package
DIP-T8
SOP8
SOP-J8
SSOP-B8
○Product
structure:Silicon monolithic integrated circuit
www.rohm.com
©2013 ROHM Co., Ltd. All rights reserved.
TSZ22111½14½001
○This
product has no designed protection against radioactive rays
1/33
TSZ02201-0R2R0G100230-1-2
04.Jul.2013 Rev.004

BR24G128FJ-3GTE2 Related Products

BR24G128FJ-3GTE2 BR24G128-3 BR24G128FV-3GTE2 BR24G128NUX-3TTR BR24G128F-3GTE2 BR24G128FVM-3GTTR
Description EEPROM I2C BUS(2-Wre) 128K SOP-J8 EEPROM EEPROM Schottky Barrier Diodes EEPROM I2C BUS(2-Wre) 128K SSOP-B8 EEPROM EEPROM I2C BUS(2-Wre) 128K VSON008X2030 EEPROM EEPROM, 16KX8, Serial, CMOS, PDSO8, SOP-8 EEPROM, 16KX8, Serial, CMOS, PDSO8, MSOP-8
Is it Rohs certified? - conform to conform to - conform to conform to
package instruction - DIP, DIP8,.3 LSSOP, TSSOP8,.25 - SOP-8 MSOP-8
Reach Compliance Code - compliant compliant - compliant compliant
Maximum clock frequency (fCLK) - 0.4 MHz 0.4 MHz - 0.4 MHz 0.4 MHz
Data retention time - minimum - 40 40 - 40 40
Durability - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C control byte - 1010DDDR 1010DDDR - 1010DDDR 1010DDDR
JESD-30 code - R-PDIP-T8 R-PDSO-G8 - R-PDSO-G8 R-PDSO-G8
length - 9.3 mm 4.4 mm - 5 mm 2.9 mm
memory density - 131072 bit 131072 bit - 131072 bit 131072 bit
Memory IC Type - EEPROM EEPROM - EEPROM EEPROM
memory width - 8 8 - 8 8
Number of functions - 1 1 - 1 1
Number of terminals - 8 8 - 8 8
word count - 16384 words 16384 words - 16384 words 16384 words
character code - 16000 16000 - 16000 16000
Operating mode - SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature - 85 °C 85 °C - 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C - -40 °C -40 °C
organize - 16KX8 16KX8 - 16KX8 16KX8
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - DIP LSSOP - SOP VSSOP
Encapsulate equivalent code - DIP8,.3 TSSOP8,.25 - SOP8,.25 TSSOP8,.16
Package shape - RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form - IN-LINE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH - SMALL OUTLINE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Parallel/Serial - SERIAL SERIAL - SERIAL SERIAL
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
Certification status - Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height - 4.21 mm 1.35 mm - 1.71 mm 0.9 mm
Serial bus type - I2C I2C - I2C I2C
Maximum standby current - 0.000002 A 0.000002 A - 0.000002 A 0.000002 A
Maximum slew rate - 0.0025 mA 0.0025 mA - 0.0025 mA 0.0025 mA
Maximum supply voltage (Vsup) - 5.5 V 5.5 V - 5.5 V 5.5 V
Minimum supply voltage (Vsup) - 1.6 V 1.6 V - 1.6 V 1.6 V
Nominal supply voltage (Vsup) - 2.5 V 2.5 V - 2.5 V 2.5 V
surface mount - NO YES - YES YES
technology - CMOS CMOS - CMOS CMOS
Temperature level - INDUSTRIAL INDUSTRIAL - INDUSTRIAL INDUSTRIAL
Terminal form - THROUGH-HOLE GULL WING - GULL WING GULL WING
Terminal pitch - 2.54 mm 0.65 mm - 1.27 mm 0.65 mm
Terminal location - DUAL DUAL - DUAL DUAL
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width - 7.62 mm 3 mm - 4.4 mm 2.8 mm
Maximum write cycle time (tWC) - 5 ms 5 ms - 5 ms 5 ms
write protect - HARDWARE HARDWARE - HARDWARE HARDWARE
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