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BD5426EFS-E2

Description
Audio Amplifiers 13V 8ohm 10W+10W
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size628KB,20 Pages
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
Environmental Compliance
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Audio Amplifiers 13V 8ohm 10W+10W

BD5426EFS-E2 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
parentfamilyid2400369
MakerROHM Semiconductor
Objectid1756509520
Parts packaging codeTSSOP
package instructionHVSSOP, TSOP44,.36,32
Contacts44
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time10 weeks
compound_id2406899
Nominal bandwidth20 kHz
Commercial integrated circuit typesAUDIO AMPLIFIER
harmonic distortion0.1%
JESD-30 codeR-PDSO-G44
length18.5 mm
Number of channels2
Number of functions1
Number of terminals44
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Nominal output power10 W
Package body materialPLASTIC/EPOXY
encapsulated codeHVSSOP
Encapsulate equivalent codeTSOP44,.36,32
Package shapeRECTANGULAR
Package formSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply12 V
Certification statusNot Qualified
Maximum seat height1 mm
Maximum slew rate50 mA
Maximum supply voltage (Vsup)16.5 V
Minimum supply voltage (Vsup)10 V
surface mountYES
technologyBCDMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.5 mm
Middle Power Class-D Speaker Amplifiers
Analog Input / BTL Output
Class-D Speaker Amplifier
BD5426EFS
No.10075EBT05
●Description
BD5426EFS is a 10W + 10W stereo class-D power amplifier IC, developed for space-saving and low heat-generation
applications such as low-profile TV sets. The IC employs state-of-the-art Bipolar, CMOS, and DMOS (BCD) process
technology that eliminates turn-on resistance in the output power stage and internal loss due to line resistances up to an
ultimate level. With this technology, the IC has achieved high efficiency of 87% (9W + 9W output with 8Ω load). The IC, in
addition, employs a compact back-surface heat radiation type power package to achieve low power consumption and low
heat generation and eliminates necessity of installing an external radiator, up to a total output of 20W. This product satisfies
both needs for drastic downsizing, low-profile structures and powerful, high-quality playback of the sound system.
●Features
1) A high efficiency of 87% (9W + 9W output with 8Ω load), which is the highest grade in the industry and low heat-generation.
2) An output of 10W + 10W (13V, with 8Ω load) is allowed without an external heat radiator.
3) Driving a lowest rating load of 6Ω is allowed.
4) Pop noise upon turning power on/off and power interruption has been reduced.
5) High-quality audio muting is implemented by soft-switching technology.
6) An output power limiter function limits excessive output to speakers.
7) High-reliability design provided with built-in protection circuits against high temperatures, against VCC shorting and
GND shorting, against reduced-voltage, and against applying DC voltage to speaker.
8) A master/slave function allowing synchronization of multiple devices reduces beat noises.
9) Adjustment of internal PWM sampling clock frequencies (250kHz to 400kHz) allows easy protective measures
against unwanted radio emission to AM radio band.
10) A compact back-surface heat radiation type power package is employed.
HTSSOP-A44(5mm × 7.5mm × 1.0mm, pitch 0.8mm )
●Absolute
maximum ratings
A circuit must be designed and evaluated not to exceed absolute maximum rating in any cases and even momentarily, to prevent
reduction in functional performances and thermal destruction of a semiconductor product and secure useful life and reliability.
The following values assume Ta =25℃. For latest values, refer to delivery specifications.
Parameter
Supply voltage
Power dissipation
Input voltage for signal pin
Input voltage for control pin
Input voltage for clock pin
Operating temperature range
Storage temperature range
Maximum junction temperature
Symbol
V
CC
P
d
V
IN
V
CONT
V
OSC
T
opr
T
stg
T
jmax
Ratings
+20
2.0
4.5
-0.2 ~ +7.2
-0.2 ~ Vcc+0.2
-0.2 ~ +7.2
-40 ~ +85
-55 ~ +150
+150
Unit
V
W
W
V
V
V
Conditions
Pin 7, 8, 15, 16, 29, 30, 37, 38, 40
(Note 1, 2)
(Note 3)
(Note 4)
Pin 1, 44 (Note 1)
Pin 20, 24 (Note 1)
Pin 23 (Note 1)
(Note 1) A voltage that can be applied with reference to GND (pins 11, 12, 33, 34, and 43)
(Note 2) Pd and Tjmax=150℃ must not be exceeded.
(Note 3) 70mm × 70mm × 1.6mmFR4 One-sided glass epoxy board (Back copper foil 0%) installed.
If used under Ta=25℃ or higher, reduce 16mW for increase of every 1℃. The board is provided with thermal via.
(Note 4) 70mm × 70mm × 1.6mmFR4 Both-sided glass epoxy board (Back copper foil 100%) installed.
If used under Ta=25℃ or higher, reduce 36mW for increase of every 1℃. The board is provided with thermal via.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
1/16
2010.05 - Rev.B

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