BCM20733A3KML1GT datasheet, PDF

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BCM20733A3KML1GT: DescriptionRF System on a Chip - SoC Single-Chip BT; CategoryTopical application Wireless rf/communication; File Size2MB，67 Pages; ManufacturerCypress Semiconductor; Environmental Compliance

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RF System on a Chip - SoC Single-Chip BT

BCM20733A3KML1GT Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	Cypress Semiconductor
Product Category	RF System on a Chip - SoC
RoHS	Details
Packaging	Cut Tape
Packaging	Reel
Factory Pack Quantity	2500

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CYW20733

Single-Chip Bluetooth Transceiver

Wireless Input Devices

The Cypress CYW20733 is a Bluetooth 3.0 + EDR compliant, stand-alone baseband processor with an integrated 2.4 GHz trans-

ceiver. The device is ideal for applications in wireless input devices including game controllers, keyboards, and joysticks. Built-in

firmware adheres to the Bluetooth Human Interface Device (HID) profile and Bluetooth Device ID profile specifications. The

CYW20733 radio has been designed to provide low power, low cost, and robust communications for applications operating in the

globally available 2.4 GHz unlicensed ISM band. It is fully compliant with the Bluetooth Radio Specification 3.0 + EDR. The single-

chip Bluetooth transceiver is a monolithic component implemented in a standard digital CMOS process and requires minimal exter-

nal components to make a fully compliant Bluetooth device. The CYW20733 is available in three package options: a 81-pin, 8 mm ×

8 mm FBGA, a 121-pin, 9 mm × 9 mm FBGA, and a 56-pin, 7 mm x 7 mm QFN.

Cypress Part Numbering Scheme

Cypress is converting the acquired IoT part numbers from Broadcom to the Cypress part numbering scheme. Due to this conversion,

there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The table provides

Cypress ordering part number that matches an existing IoT part number.

Table 1. Mapping Table for Part Number between Broadcom and Cypress

Broadcom Part Number

BCM20733

BCM20733A3KFB1G

BCM20733A3KFB2G

BCM20733A3KML1G

Cypress Part Number

CYW20733

CYW20733A3KFB1G

CYW20733A3KFB2G

CYW20733A3KML1G

Features

Integrated LDO to reduce BOM cost

■

Bluetooth specification 3.0 + EDR compatible

■

Bluetooth HID profile version 1.1 compliant

■

Bluetooth Device ID profile version 1.3 compliant

■

Supports AFH

■

Excellent receiver sensitivity

■

On-chip support for common keyboard and mouse inter-

faces eliminates external processor

■

Infrared (IR) modulator

■

IR learning

■

Integrated 200 mW filterless Class-D audio amplifier

■

Triac control

■

Triggered Broadcom Fast Connect

■

One I/O capable of sinking 100 mA for high- current drive

applications

■

Programmable key scan matrix interface, up to 8 × 20 key-

scanning matrix

■

Three-axis quadrature signal decoder

■

On-chip support for serial peripheral interface (master and

slave modes)

■

Broadcom Serial Communications Interface (compatible

with Philips® I2C slaves)

■

Two independent half-duplex PCM/I2S interfaces

■

Real-time clock supported with 32.768 kHz oscillator

■

Programmable output power control meets Class 2 or

Class 3 requirements

■

On-chip PA with a maximum output power of +10dBm with-

out external component

■

Integrated ARM7TDMI-S™-based microprocessor core

■

On-chip power on reset (POR)

■

On-chip software control power management unit

■

Three package types available:

❐

81-pin FBGA package (8 mm × 8 mm)

❐

121-pin FBGA package (9 mm × 9 mm)

❐

56-pin QFN package (7 mm x 7 mm)

■

RoHS compliant

■

Applications

■

Game controllers

Wireless pointing devices: mice, trackballs

Wireless keyboards

Joysticks

Point-of-sale (POS) input devices

Remote controls

Home automation

3D glasses

Cypress Semiconductor Corporation

Document No. 002-14859 Rev. *S

•

198 Champion Court

•

San Jose

CA 95134-1709

•

408-943-2600

Revised November 9, 2017

CYW20733

1. Functional Description

1.1 Integrated Radio Transceiver

The CYW20733 has an integrated radio transceiver that has been optimized for use in 2.4 GHz Bluetooth wireless systems. It has

been designed to provide low power, low cost, robust communications for applications operating in the globally available 2.4 GHz

unlicensed ISM band. It is fully compliant with Bluetooth Radio Specification 3.0 + EDR and meets or exceeds the requirements to

provide the highest communication link quality of service.

1.1.1 Transmitter Path

The CYW20733 features a fully integrated zero IF transmitter. The baseband transmit data is GFSK modulated in the modem block

and upconverted to the 2.4 GHz ISM band. The transmit path consists of signal filtering,

I/Q upconversion, output power amplification, and RF filtering. It also incorporates the

/4-DQPSK

and 8-DPSK modulation schemes,

which support the 2 Mbps and 3 Mbps enhanced data rates, respectively.

Digital Modulator

The digital modulator performs the data modulation and filtering required for the GFSK,

/4-DQPSK,

and

8-DPSK signals. The fully digital modulator minimizes any frequency drift or anomalies in the modulation characteristics of the

transmitted signal and is much more stable than direct VCO modulation schemes.

Power Amplifier

The integrated power amplifier (PA) for the CYW20733 can transmit at a maximum power of +4 dBm for class 2 operation. The transmit

power levels are for basic rate and EDR. Due to the linear nature of the PA, combined with some integrated filtering, no external filters

are required for meeting Bluetooth and regulatory harmonic and spurious requirements.

The CYW20733 internal PA can deliver a maximum output power of +10 dBm for basic rate and +8 dBm for EDR with a flexible supply

range of 2.5V to 3.0V.

1.1.2 Receiver Path

The receiver path uses a low-IF scheme to downconvert the received signal for demodulation in the digital demodulator and bit

synchronizer. The receiver path provides a high degree of linearity, an extended dynamic range, and high-order on-chip channel

filtering to ensure reliable operation in the noisy 2.4 GHz ISM band. The front-end topology with built-in out-of-band attenuation

enables the CYW20733 to be used in most applications without off-chip filtering.

Digital Demodulator and Bit Synchronizer

The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency tracking and bit

synchronization algorithm.

Receiver Signal Strength Indicator

The radio portion of the CYW20733 provides a receiver signal strength indicator (RSSI) to the baseband. This enables the controller

to take part in a Bluetooth power-controlled link by providing a metric of its own receiver signal strength to determine whether the

transmitter should increase or decrease its output power.

1.1.3 Local Oscillator

The local oscillator (LO) provides fast frequency hopping (1600 hops/second) across the 79 maximum available channels. The LO

subblock employs an architecture for high immunity to LO pulling during PA operation. The CYW20733 uses an internal RF and IF

loop filter.

1.1.4 Calibration

The CYW20733 radio transceiver features an automated calibration scheme that is self-contained in the radio. No user interaction is

required during normal operation or during manufacturing to provide the optimal performance. Calibration will optimize the gain and

phase performance of all the major blocks within the radio to within 2% of optimal conditions. Calibrated blocks include filters, the

matching networks between key components, and key gain blocks. The calibration process corrects for both process and temperature

variations. It occurs transparently during normal operation and the setting time of the hops and will calibrate for temperature variations

as the device cools and heats during normal operation in its environment.

1.1.5 Internal LDO Regulator

To reduce the external BOM, the CYW20733 has an integrated 1.2V LDO regulator to provide power to the digital and RF circuits and

system components. The 1.2V LDO regulator operates from a 1.62V to 3.63V input supply with a 60 mA maximum load current.

In noisy environments, a ferrite bead may be needed between the digital and RF supply pins to isolate noise coupling and suppress

noise into the RF circuits.

Note:

Always place the decoupling capacitors near the pins as close together as possible.

Document No. 002-14859 Rev. *S

Page 4 of 67

CYW20733

1.2 Microprocessor Unit

The CYW20733 microprocessor unit (µPU) runs software from the link control (LC) layer up to the Human Interface Device (HID). The

microprocessor is based on an ARM7™ 32-bit RISC processor with embedded ICE-RT debug and JTAG interface units. The µPU

has 320 KB of ROM for program storage and boot-up, 80 KB of RAM for scratch-pad data, and patch RAM code.

The internal boot ROM allows for flexibility during power-on reset to enable the same device to be used in various configurations,

including UART, and with an external serial EEPROM or with an external flash memory. At power-up, the lower layer protocol stack

is executed from the internal ROM memory.

External patches may be applied to the ROM-based firmware to provide flexibility for bug fixes and feature additions. The device can

also support the integration of user applications.

1.2.1 EEPROM Interface

The CYW20733 provides the BSC (Broadcom Serial Control) master interface; the BSC is programmed by the CPU to generate four

different types of BSC transfers on the bus: read-only, write-only, combined read/write, and combined write/read. BSC supports both

low-speed and fast mode devices. The BSC is compatible with a Philips® I

C slave device, except that master arbitration (multiple

C masters contending for the bus) is not supported. Native support for Microchip® 24LC128, Microchip 24AA128, and STMicroelec-

tronics® M24128-BR is included.

The EEPROM can contain customer application configuration information, including: application code, configuration data, patches,

pairing information, BD_ADDR, baud rate, SDP service record, and file system information used for code.

1.2.2 Serial Flash Interface

The CYW20733 includes an SPI master controller that can be used to access serial flash memory. The SPI master contains an AHB

slave interface, transmit and receive FIFOs, and the SPI core PHY logic.

Devices natively supported include the following:

■

Atmel® AT25BCM512B

MXIC MX25V512ZUI-20G

1.2.3 Internal Reset

The CYW20733 has an integrated power-on reset circuit that resets all circuits to a known power-on state.

Figure 1. Internal Reset Timing

VDDO POR delay

~ 2 ms

VDDO

VDDO POR threshold

VDDO POR

VDDC POR threshold

VDDC

VDDC POR delay

~ 2 ms

VDDC POR

Crystal

warm‐up

delay:

~ 5 ms

Start reading EEPROM and firmware boot.

Baseband Reset

Crystal Enable

Document No. 002-14859 Rev. *S

Page 5 of 67

BCM20733A3KML1GT Related Products

	BCM20733A3KML1GT	BCM20733A1KFB1GT
Description	RF System on a Chip - SoC Single-Chip BT	RF System on a Chip - SoC Single-Chip BT
Product Attribute	Attribute Value	Attribute Value
Manufacturer	Cypress Semiconductor	Cypress Semiconductor
Product Category	RF System on a Chip - SoC	RF System on a Chip - SoC
RoHS	Details	Details
Factory Pack Quantity	2500	3000
Packaging	Reel	Reel

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