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BZX84C6V2S-7

Description
Zener Diodes 6.2V 200mW
CategoryDiscrete semiconductor    diode   
File Size91KB,4 Pages
ManufacturerDiodes Incorporated
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BZX84C6V2S-7 Overview

Zener Diodes 6.2V 200mW

BZX84C6V2S-7 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerDiodes Incorporated
package instructionULTRA SMALL, PLASTIC PACKAGE-6
Contacts6
Reach Compliance Codenot_compliant
ECCN codeEAR99
ConfigurationSEPARATE, 2 ELEMENTS
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum forward voltage (VF)0.9 V
JESD-30 codeR-PDSO-G6
JESD-609 codee0
Humidity sensitivity level1
Number of components2
Number of terminals6
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)235
polarityUNIDIRECTIONAL
Maximum power dissipation0.2 W
Certification statusNot Qualified
Nominal reference voltage6.2 V
Maximum reverse current3 µA
Reverse test voltage4 V
surface mountYES
technologyZENER
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature10
Maximum voltage tolerance6.45%
Working test current5 mA
BZX84C2V4S - BZX84C39S
DUAL 200mW SURFACE MOUNT ZENER DIODE
Please click here to visit our online spice models database.
Features
Planar Die Construction
200mW Power Dissipation
Zener Voltages from 2.4V - 39V
Ultra-Small Surface Mount Package
Lead Free/RoHS Compliant (Note 2)
"Green" Device (Note 3 and 4)
Mechanical Data
Case: SOT-363
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Polarity: See Diagram
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.006 grams (approximate)
C
1
A
1
NC
NC
A
2
C
2
Top View
Device Schematic
Maximum Ratings
Forward Voltage
@T
A
= 25°C unless otherwise specified
Symbol
@ I
F
= 10mA
V
F
Value
0.9
Unit
V
Characteristic
Thermal Characteristics
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
Notes:
1.
2.
3.
4.
Symbol
(Note 1)
(Note 1)
P
D
R
θ
JA
T
J,
T
STG
Value
200
625
-65 to +150
Unit
mW
°C/W
°C
Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
No purposefully added lead.
Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BZX84C2V4S - BZX84C39S
Document number: DS30108 Rev. 17 - 2
1 of 4
www.diodes.com
May 2008
© Diodes Incorporated
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