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89HPES8NT2ZBBC8

Description
PCI Interface IC 24LANE,3PORT NT SW
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size392KB,28 Pages
ManufacturerIDT (Integrated Device Technology)
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89HPES8NT2ZBBC8 Overview

PCI Interface IC 24LANE,3PORT NT SW

89HPES8NT2ZBBC8 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Reach Compliance Codenot_compliant
ECCN codeEAR99
Is SamacsysN
JESD-30 codeS-PBGA-B324
JESD-609 codee0
Humidity sensitivity level3
Number of terminals324
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA324,18X18,40
Package shapeSQUARE
Package formGRID ARRAY
power supply1,3.3 V
Certification statusNot Qualified
surface mountYES
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Base Number Matches1
8-Lane 2-Port Non-Transparent
PCI Express® Switch
®
89HPES8NT2
Data Sheet
Device Overview
The 89HPES8NT2 is a member of the IDT PRECISE™ family of PCI
Express® switching solutions offering the next-generation I/O intercon-
nect standard. The PES8NT2 is a 8-lane, 2-port peripheral chip that
provides high-performance switching and non-transparent bridging
(NTB) functions between a PCIe® upstream port and an NTB down-
stream port. The PES8NT2 is a part of the IDT PCIe System Intercon-
nect Products and is intended to be used with IDT PCIe System
Interconnect Switches. Together, the chipset targets multi-host and intel-
ligent I/O applications such as communications, storage, and blade
servers where inter-domain communication is required.
Features
High Performance PCI Express Switch
Eight PCI Express lanes (2.5Gbps), two switch ports
Delivers 32 Gbps (4 GBps) of aggregate switching capacity
Low latency cut-through switch architecture
Support for Max Payload size up to 2048 bytes
Supports one virtual channel and eight traffic classes
PCI Express Base specification Revision 1.0a compliant
Flexible Architecture with Numerous Configuration Options
Supports automatic per port link width negotiation (x8, x4, x2,
or x1)
Static lane reversal on all ports
Automatic polarity inversion on all lanes
Supports locked transactions, allowing use with legacy soft-
ware
Ability to load device configuration from serial EEPROM
Ability to control device via SMBus
Non-Transparent Port
Crosslink support on NTB port
Four mapping windows supported
Each may be configured as a 32-bit memory or I/O window
May be paired to form a 64-bit memory window
Interprocessor communication
Thirty-two inbound and outbound doorbells
Four inbound and outbound message registers
Two shared scratchpad registers
Allows up to sixteen masters to communicate through the non-
transparent port
No limit on the number of supported outstanding transactions
through the non-transparent bridge
Completely symmetric non-transparent bridge operation
allows similar/same configuration software to be run
Supports direct connection to a transparent or non-transparent
port of another switch
Highly Integrated Solution
Requires no external components
Incorporates on-chip internal memory for packet buffering and
queueing
Integrates eight 2.5 Gbps embedded full duplex SerDes, 8B/
10B encoder/decoder (no separate transceivers needed)
Block Diagram
2-Port Switch Core
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Non-
Transparent
Bridge
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
8 PCI Express Lanes
x4 Upstream Port and One x4 Downstream Port
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 28
©
2009 Integrated Device Technology, Inc.
January 5, 2009
DSC 6925

89HPES8NT2ZBBC8 Related Products

89HPES8NT2ZBBC8 89HPES8NT2ZBBC
Description PCI Interface IC 24LANE,3PORT NT SW PCI Interface IC 24LANE,3PORT NT SW
Is it Rohs certified? incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Reach Compliance Code not_compliant not_compliant
ECCN code EAR99 EAR99
Is Samacsys N N
JESD-30 code S-PBGA-B324 S-PBGA-B324
JESD-609 code e0 e0
Humidity sensitivity level 3 3
Number of terminals 324 324
Maximum operating temperature 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA LBGA
Encapsulate equivalent code BGA324,18X18,40 BGA324,18X18,40
Package shape SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY, LOW PROFILE
power supply 1,3.3 V 1,3.3 V
Certification status Not Qualified Not Qualified
surface mount YES YES
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM
Base Number Matches 1 1
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