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89H64H16G2ZCBLG

Description
PCI Interface IC PCIE GEN2 SWITCH
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size344KB,57 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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89H64H16G2ZCBLG Overview

PCI Interface IC PCIE GEN2 SWITCH

89H64H16G2ZCBLG Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeFCBGA
package instructionFCBGA-1156
Contacts1156
Manufacturer packaging codeBLG1156
Reach Compliance Codecompliant
ECCN codeEAR99
Address bus width
Bus compatibilityI2C; ISA; PCI; SMBUS; VGA
maximum clock frequency125 MHz
Maximum data transfer rate64000 MBps
External data bus width
JESD-30 codeS-PBGA-B1156
JESD-609 codee1
length35 mm
Humidity sensitivity level4
Number of terminals1156
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA1156,34X34,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)245
power supply1,2.5/3.3 V
Certification statusNot Qualified
Maximum seat height3.42 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width35 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
64-Lane 16-Port PCIe® Gen2
System Interconnect Switch
®
89HPES64H16G2
Data Sheet
Device Overview
The 89HPES64H16G2 is a member of the IDT PRECISE™ family of
PCI Express® switching solutions. The PES64H16G2 is a 64-lane, 16-
port system interconnect switch optimized for PCI Express Gen2 packet
switching in high-performance applications, supporting multiple simulta-
neous peer-to-peer traffic flows. Target applications include servers,
storage, communications, embedded systems, and multi-host or intelli-
gent I/O based systems with inter-domain communication.
Per lane SerDes configuration
• De-emphasis
• Receive equalization
• Drive strength
Switch Partitioning
IDT proprietary feature that creates logically independent
switches in the device
Supports up to 16 fully independent switch partitions
Configurable downstream port device numbering
Supports dynamic reconfiguration of switch partitions
• Dynamic port reconfiguration — downstream, upstream
• Dynamic migration of ports between partitions
• Movable upstream port within and between switch partitions
Initialization / Configuration
Supports Root (BIOS, OS, or driver), Serial EEPROM, or
SMBus switch initialization
Common switch configurations are supported with pin strap-
ping (no external components)
Supports in-system Serial EEPROM initialization/program-
ming
Quality of Service (QoS)
Port arbitration
• Round robin
Request metering
• IDT proprietary feature that balances bandwidth among
switch ports for maximum system throughput
High performance switch core architecture
• Combined Input Output Queued (CIOQ) switch architecture
with large buffers
Multicast
Compliant to the PCI-SIG multicast ECN
Supports arbitrary multicasting of Posted transactions
Supports 64 multicast groups
Independent multicast support within each switch partition
Clocking
Supports 100 MHz and 125 MHz reference clock frequencies
Flexible clocking modes
• Common clock
• Non-common clock
Hot-Plug and Hot Swap
Hot-plug controller on all ports
• Hot-plug supported on all downstream switch ports
Features
High Performance Non-Blocking Switch Architecture
64-lane 16-port PCIe switch
• Eight x8 ports switch ports each of which can bifurcate to two
x4 ports (total of sixteen x4 ports)
Integrated SerDes supports 5.0 GT/s Gen2 and 2.5 GT/s
Gen1 operation
Delivers up to 64 GBps (512 Gbps) of switching capacity
Supports 128 Bytes to 2 KB maximum payload size
Low latency cut-through architecture
Supports one virtual channel and eight traffic classes
Standards and Compatibility
PCI Express Base Specification 2.0 compliant
Implements the following optional PCI Express features
• Advanced Error Reporting (AER) on all ports
• End-to-End CRC (ECRC)
• Access Control Services (ACS)
• Power Budgeting Enhanced Capability
• Device Serial Number Enhanced Capability
• Sub-System ID and Sub-System Vendor ID Capability
• Internal Error Reporting ECN
• Multicast ECN
• VGA and ISA enable
• L0s and L1 ASPM
• ARI ECN
Compatible with IDT 89HPES64H16 PCIe Gen1 switch
Port Configurability
x4 and x8 ports
• Ability to merge adjacent x4 ports to create a x8 port
Automatic per port link width negotiation
(x8
x4
x2
x1)
Crosslink support
Automatic lane reversal
Autonomous and software managed link width and speed
control
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 57
2011 Integrated Device Technology, Inc.
November 28, 2011

89H64H16G2ZCBLG Related Products

89H64H16G2ZCBLG 89H64H16G2ZCBL
Description PCI Interface IC PCIE GEN2 SWITCH PCI Interface IC PCIE GEN2 SWITCH
Brand Name Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Contains lead
Is it Rohs certified? conform to incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code FCBGA FCBGA
package instruction FCBGA-1156 FCBGA-1156
Contacts 1156 1156
Manufacturer packaging code BLG1156 BL1156
Reach Compliance Code compliant not_compliant
ECCN code EAR99 EAR99
Bus compatibility I2C; ISA; PCI; SMBUS; VGA I2C; ISA; PCI; SMBUS; VGA
maximum clock frequency 125 MHz 125 MHz
Maximum data transfer rate 64000 MBps 64000 MBps
JESD-30 code S-PBGA-B1156 S-PBGA-B1156
JESD-609 code e1 e0
length 35 mm 35 mm
Humidity sensitivity level 4 4
Number of terminals 1156 1156
Maximum operating temperature 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Encapsulate equivalent code BGA1156,34X34,40 BGA1156,34X34,40
Package shape SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 245 225
power supply 1,2.5/3.3 V 1,2.5/3.3 V
Certification status Not Qualified Not Qualified
Maximum seat height 3.42 mm 3.42 mm
Maximum supply voltage 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 35 mm 35 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI

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