EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-B0202AG-00-2371-K

Description
Resistor Networks & Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics
Download Datasheet Parametric View All

WBC-B0202AG-00-2371-K Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-B0202AG-00-2371-K - - View Buy Now

WBC-B0202AG-00-2371-K Overview

Resistor Networks & Arrays

WBC-B0202AG-00-2371-K Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics
Product CategoryResistor Networks & Arrays
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
stvd Cosmic CxSTM8 compilation error
Compiling main.c...cxstm8 +mods0 +debug -pxp -no -pp -l -i"C:\Program Files\COSMIC\CXSTM8_32K\Hstm8" -i"D:\Program Files\COSMIC\CXSTM8_32K" -clDebug\ -coDebug\ main.c#error cpstm8 C:\Program Files\COS...
xxya6868 stm32/stm8
Intersil Launches New Three-Channel Video Analog Front-End Integrated Circuit
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 19:58[/i]...
lorant Mobile and portable
Instruction Difference
I would like to ask: Is add r2,pc,#-(8+.-CInitData) equivalent to ldr r2,=CInitData? (I can execute it normally when simulating) The reason is that I saw a brother explaining the meaning of the former...
x700xt Embedded System
Single chip 12864 LCD graphic menu display control system program
Single chip 12864 LCD graphic menu display control system program...
lxt2006 MCU
Design of I2C Bus Controller Core Based on VHDL
[b]Abstract: [/b]From the perspective of state machine, this paper introduces a VHDL design method for I2C control core. It is embedded in FPGA to realize the interface with TMS320C6000 series DSP, an...
maker FPGA/CPLD
Do air purifiers work? Are they worth the money?
[i=s]This post was last edited by Sur on 2014-11-1 22:45[/i] [color=#333333][font=宋体, tahoma, arial] Air purifiers are mainly composed of micro fans, air filters (filters), water tanks, intelligent mo...
Sur Integrated technical exchanges

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2413  713  1205  1080  1998  49  15  25  22  41 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号