EEWORLDEEWORLDEEWORLD

Part Number

Search

TAZH226K020LRMB0845

Description
Tantalum Capacitors - Solid SMD
CategoryPassive components   
File Size382KB,14 Pages
ManufacturerAVX
Download Datasheet Parametric View All

TAZH226K020LRMB0845 Online Shopping

Suppliers Part Number Price MOQ In stock  
TAZH226K020LRMB0845 - - View Buy Now

TAZH226K020LRMB0845 Overview

Tantalum Capacitors - Solid SMD

TAZH226K020LRMB0845 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerAVX
Product CategoryTantalum Capacitors - Solid SMD
TAZ Series
CWR09 - MIL-PRF-55365/4
Established Reliability, COTS-Plus & Space Level
All 4V to 50V ratings are qualified to
MIL-PRF-55365 Weibull “B”, “C”, “D” and “T”
levels, with all surge options (“A”, “B” & “C”)
available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table
for part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF-
55365). In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
This is the original high reliability molded
tantalum chip series and the case sizes still
represent the most flexible of surface mount
form factors. TAZ offers nine case sizes, eight of
which (A through H) are fully qualified to MIL-
PRF-55365/4, and also includes the original
sub-miniature R case (non-QPL).
This series is fully interchangeable with CWR06
conformal types, while offering the advantages of
molded body/compliant termination construction
(ensuring no TCE mismatch with any substrate).
This construction is compatible with a wide range
of SMT board assembly processes including
wave or reflow solder, conductive epoxy or com-
pression bonding techniques.
The parts also carry full polarity and
capacitance / voltage marking. The five smaller
cases are characterized by their low profile
construction, with the A case being the world’s
smallest molded military tantalum chip.
CASE DIMENSIONS:
Case
Length (L)
Width (W)
Height (H)
Code ±0.38 (0.015) ±0.38 (0.015) ±0.38 (0.015)
Term. Width (W
1
)
1.27±0.13
(0.050±0.005)
1.27±0.13
(0.050±0.005)
1.27±0.13
(0.050±0.005)
2.41+0.13/-0.25
(0.095+0.005/-0.010)
2.41+0.13/-0.25
(0.095+0.005/-0.010)
3.30±0.13
(0.130±0.005)
2.67±0.13
(0.105±0.005)
3.68+0.13/-0.51
(0.145+0.005/-0.020)
1.0±0.10
(0.039±0.004)
millimeters (inches)
Term. Length (A)
+0.25/-0.13
(+0.010/-0.005)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
1.27 (0.050)
1.27 (0.050)
0.50 (0.020)
+0.30 (0.012)
-0.20 (0.008)
S min
0.38
(0.015)
1.65
(0.065)
2.92
(0.115)
1.65
(0.065)
2.92
(0.115)
3.43
(0.135)
3.56
(0.140)
4.06
(0.160)
0.71
(0.028)
Typical
Weight (g)
0.016
0.025
0.035
0.045
0.065
0.125
0.205
0.335
0.010
MARKING
(White marking on black body)
Polarity Stripe (+)
Capacitance Code
Rated Voltage
A
B
C
D
E
F
G
H
R
2.54 (0.100)
3.81 (0.150)
5.08 (0.200)
3.81 (0.150)
5.08 (0.200)
5.59 (0.220)
6.73 (0.265)
7.24 (0.285)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
2.54 (0.100)
2.54 (0.100)
3.43 (0.135)
2.79 (0.110)
3.81 (0.150)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.78 (0.070)
2.79 (0.110)
2.79 (0.110)
1.20 (0.047)
max
1.30 (0.051)
2.05 (0.081) +0.20 (0.008)
±0.20 (0.008) -0.10 (0.004)
CWR09 MIL-PRF-55365/4
CAPACITANCE AND RATED VOLTAGE, V
R
(VOLTAGE CODE) RANGE (LETTER DENOTES CASE SIZE)
Capacitance
μF
Code
0.10
104
0.15
154
0.22
224
0.33
334
0.47
474
0.68
684
1.0
105
1.5
155
2.2
225
3.3
335
4.7
475
6.8
685
10
106
15
156
22
226
33
336
47
476
68
686
100
107
4V (C)
6V (D)
10V (F)
Rated Voltage DC (V
R
) at 85ºC
15V (H)
20V (J)
25V (K)
35V (M)
50V (N)
A
A
B
B
C
D
E
F
F
G
H
A
R
R
R
A
A/R
A
A/R
B
C
D
E
F
G
H
G
H
B
C
D
E
F
G
H
B
C
D
E
F
G
H
B
C
D
E
F
G
H
A
A
B
B
C
D
E
F
B
C
D
E
F
G
G
H
B
C
D
E
F
G
H
8
Infineon Coolset switching power supply chip design information sharing
As the title says, share the information that I think is good...
elvike Power technology
Experts or experienced beginners please come in,
Does anyone have a well-adjusted 51 program for nrf24l01, or an enhanced microcontroller 12c5a60s2?...
魔尊123 RF/Wirelessly
HyperLynx High-Speed Circuit Design and Simulation (IX) Research on Single-Line Differential Line of Four-Layer Board Stacking Structure
# HyperLynx High-speed Circuit Design and Simulation (IX) Exploration of Single-line Differential Line of Four-layer Board Stacking Structure##1. Four-layer Board Stacking Structure###For the commonly...
bqgup Creative Market
Mid-Autumn Moon
The weather was very good at night, and the moon was big and round. I found my bird-watching tool and took a few photos to share with those who can't see the moon....
dcexpert Talking
My opinion on the current status of the CORTEX nuclear power plant
[b] My opinion on the current status of CORTEX core When ARM launched the CORTEX core, Luminary was the first to apply it to chips, but it did not do a good job in product promotion and its performanc...
ddllxxrr MCU
【Design Tools】Simplify the debugging process of Xilinx and Altera FPGA
Introduction As design size and design complexity continue to grow, verification and validation of field programmable gate array (FPGA) based system designs become a critical part of the process. Limi...
GONGHCU FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1861  1650  825  2250  1895  38  34  17  46  39 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号