EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-B0202AG-02-2000-G

Description
Resistor Networks & Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics
Download Datasheet Parametric View All

WBC-B0202AG-02-2000-G Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-B0202AG-02-2000-G - - View Buy Now

WBC-B0202AG-02-2000-G Overview

Resistor Networks & Arrays

WBC-B0202AG-02-2000-G Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics
Product CategoryResistor Networks & Arrays
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
[Group Purchase] XDS-Mini——Performance is close to XDS510! (05.16-06.15)
Group leader record number: EEWORLD_004 (This group purchase activity is initiated by blacksword and is exclusively organized by EEWORLD) Group leader promise: I have read the forum spontaneous group ...
soso Buy&Sell
How to use xmodem protocol for serial transmission under vxworks
As the title says... In order to prevent data loss, I want to use the xmodem protocol to transfer data. What should I do? What is the process? Is there any relevant information? Thank you...
rainchencxy Real-time operating system RTOS
NF-03: Communication is not possible at a slightly longer distance
[backcolor=rgb(222, 240, 251)][size=14px]NF-03 cannot communicate properly when the distance is a little far (more than 5 meters). There is no wiring at the bottom of the antenna, and it has been adju...
刘文月 RF/Wirelessly
A question that has troubled me for a long time during the ARM learning process
Question 1: Regarding the execution and loading address of the image file. The input part of the image file is the code segment and the data segment, which are compiled to generate the RO segment and ...
北上清云 ARM Technology
Human body induction switch design
[i=s]This post was last edited by Gong Suiqiang008 on 2015-3-18 19:35[/i] [media=x,500,375]http://www.tudou.com/programs/view/C0HtnKQrW_s/[/media] Human body induction switch design...
弓虽强008 Analog electronics
[Transfer]Precision Differential Output Instrumentation Amplifier
[p=15, null, left][color=rgb(0, 0, 0)][font=Arial, Helvetica, sans-serif][size=12px]作者:Moshe Gerstenhaber,Stephen Lee[/size][/font][/color][/p][hr][p=15, null, left][color=rgb(0, 0, 0)][font=Arial, He...
dontium ADI Reference Circuit

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1344  1571  1898  2422  2417  28  32  39  49  10 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号