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346-43-157-41-013000

Description
IC & Component Sockets Interconnect Socket
CategoryThe connector    socket   
File Size409KB,1 Pages
ManufacturerMill-Max
Websitehttps://www.mill-max.com
Environmental Compliance
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346-43-157-41-013000 Overview

IC & Component Sockets Interconnect Socket

346-43-157-41-013000 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMill-Max
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresSIP SOCKET
Contact to complete cooperationGOLD (30) OVER NICKEL (100)
Contact completed and terminatedTin (Sn)
Contact materialNOT SPECIFIED
Device slot typeIC SOCKET
Type of equipment usedSIP57
Shell materialPOLYETHYLENE
JESD-609 codee3
Number of contacts57
Base Number Matches1
INTERCONNECTS
SERIES 304, 346 • .100” GRID SOLDERLESS PRESS
-
FIT •
SINGLE ROW STRIPS
Unique compliant tail pins conform to the
plated through-hole without stressing the
inner layers of a multilayer board
series: .036”-.041” use a 1,1mm drill prior to
plating. Using MM #0477 & #0478 pins. See
page 162 for details
.015-.025
.010 .018
Recommended plated through-hole for 304
.175
.102
.110
.150
.044 DIA.
.025 DIA.
.026
.072
.175
For 346 series: .040”+.003” nished plated
through-hole. Using MM #4612 & #4613 pins.
See page 162 for details. Patent No. 4,799,904
Hi-Rel, 4- nger BeCu #30 contact is rated at
3 amps. See page 253 for details
FIG. 1
.015-.025
.010 .018
Insulators are high temperature thermoplastic
ORDERING INFORMATION
Series 304...770
.175
.102
.110
.150
Solderless Press-Fit
For .062” Thick Boards
.044 DIA.
.025 DIA.
.026
.072
.250
FIG. 1
Series 304...780
304 XX 1_ _ 41 770000
Specify number of pins
01-64
Solderless Press-Fit
For .125” Thick Boards
FIG. 2
.015-.025
.010 * .018
.101
.110
.195
FIG. 2
304 XX 1_ _ 41 780000
Specify number of pins
01-64
.150
Mill-Max recommends plating Code 13 for Series 304...770 and 304...780
.173
Series 346...012
Compliant Solderless Press-Fit
346 XX 1_ _ 41 012000
.045 DIA.
.120
.035 DIA.
.018
SLOT
FIG. 3
For .060”-.100” Thick Boards
Specify number of pins
01-64
FIG. 3
.015-.025
.010 * .018
.101
.110
.195
Series 346...013
Compliant Solderless Press-Fit
PAGE 73 | INTERCONNECTS
346 XX 1_ _ 41 013000
FIG. 4
.173
For .090”-.130” Thick Boards
.150
Specify number of pins
RoHS - 2
01-64
For
Electrical, Mechanical
& Enviromental Data,
See page 264
.045 DIA.
.175
2011/65/EU
.035 DIA.
.018
SLOT
XX=Plating Code
See Below
11
10
µ”
Au
10
µ”
Au
SPECIFY PLATING CODE XX=
13
30
µ”
Au
91
10
µ”
Au
93
99
41
43
44
FIG. 4
Sleeve (Pin)
Contact (Clip)
10
µ”
Au
200
µ”
Sn/Pb 200
µ”
Sn/Pb 200
µ”
Sn/Pb
200
µ”
Sn 200
µ”
Sn 200
µ”
Sn
30
µ”
Au
100
µ”
Sn/Pb
10
µ”
Au
30
µ”
Au 100
µ”
Sn
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
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