|
IRF841FI |
IRF840FI |
IRF841 |
| Description |
8 A, 500 V, 0.85 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB |
8 A, 500 V, 0.85 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB |
8 A, 500 V, 0.85 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
| Maker |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
| Parts packaging code |
SFM |
SFM |
SFM |
| package instruction |
TO-220, 3 PIN |
TO-220, 3 PIN |
TO-220, 3 PIN |
| Contacts |
3 |
3 |
3 |
| Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
| Other features |
HIGH VOLTAGE, FAST SWITCHING |
HIGH VOLTAGE, FAST SWITCHING |
HIGH VOLTAGE, FAST SWITCHING |
| Avalanche Energy Efficiency Rating (Eas) |
510 mJ |
510 mJ |
510 mJ |
| Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
| Minimum drain-source breakdown voltage |
450 V |
500 V |
450 V |
| Maximum drain current (Abs) (ID) |
4.5 A |
4.5 A |
8 A |
| Maximum drain current (ID) |
4.5 A |
4.5 A |
8 A |
| Maximum drain-source on-resistance |
0.85 Ω |
0.85 Ω |
0.85 Ω |
| FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
| Maximum feedback capacitance (Crss) |
110 pF |
110 pF |
110 pF |
| JEDEC-95 code |
TO-220AB |
TO-220AB |
TO-220AB |
| JESD-30 code |
R-PSFM-T3 |
R-PSFM-T3 |
R-PSFM-T3 |
| JESD-609 code |
e3 |
e3 |
e3 |
| Number of components |
1 |
1 |
1 |
| Number of terminals |
3 |
3 |
3 |
| Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
| Maximum operating temperature |
150 °C |
150 °C |
150 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
FLANGE MOUNT |
FLANGE MOUNT |
FLANGE MOUNT |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
| Maximum power consumption environment |
40 W |
40 W |
125 W |
| Maximum power dissipation(Abs) |
40 W |
40 W |
125 W |
| Maximum pulsed drain current (IDM) |
32 A |
32 A |
32 A |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| surface mount |
NO |
NO |
NO |
| Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal location |
SINGLE |
SINGLE |
SINGLE |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| transistor applications |
SWITCHING |
SWITCHING |
SWITCHING |
| Transistor component materials |
SILICON |
SILICON |
SILICON |
| Maximum off time (toff) |
125 ns |
125 ns |
125 ns |
| Maximum opening time (tons) |
93 ns |
93 ns |
93 ns |
| Base Number Matches |
1 |
1 |
1 |
| Is it lead-free? |
Lead free |
- |
Lead free |
| Shell connection |
ISOLATED |
ISOLATED |
- |