SMBJ180e3/TR13 datasheet, PDF - EEWORLD Datasheet

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SMBJ180e3/TR13: DescriptionESD Suppressors / TVS Diodes Transient Voltage Suppressor; CategoryCircuit protection; File Size135KB，5 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com; Environmental Compliance

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SMBJ180e3/TR13 Overview

ESD Suppressors / TVS Diodes Transient Voltage Suppressor

SMBJ180e3/TR13 Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	Microsemi
Product Category	ESD Suppressors / TVS Diodes
RoHS	Details
Packaging	Cut Tape
Packaging	Reel
Factory Pack Quantity	3000
Unit Weight	0.003386 oz

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SMBJ5.0 thru SMBJ170A, CA, e3

and SMBG5.0 thru SMBG170A, CA, e3

SCOTTSDALE DIVISION

SURFACE MOUNT 600 Watt

Transient Voltage Suppressor

DESCRIPTION

This SMBJ5.0-170A or SMBG5.0-170A series of surface mount 600 W

Transient Voltage Suppressors (TVSs) protects a variety of voltage-sensitive

components from destruction or degradation. It is available in J-bend design

(SMBJ) with the DO-214AA package for greater PC board mounting density or

in a Gull-wing design (SMBG) in the DO-215AA for visible solder connections.

It is also available in both unidirectional and bidirectional configurations with a

C or CA suffix part number as well as RoHS Compliant with an e3 suffix. Their

response time is virtually instantaneous. As a result, they can be used for

protection from ESD or EFT per IEC61000-4-2 and IEC61000-4-4, or for

inductive switching environments and induced RF protection. They can also

protect from secondary lightning effects per IEC61000-4-5 and class levels

defined herein. Microsemi also offers numerous other TVS products to meet

higher and lower power demands and special applications.

IMPORTANT:

For the most current data, consult

MICROSEMI’s

website:

http://www.microsemi.com

APPEARANCE

WWW .

Microsemi

NOTE: All SMB series are

equivalent to prior SMS package

identifications.

FEATURES

•

Available in both unidirectional and bidirectional

construction (add C or CA suffix for bidirectional)

•

Selections for 5.0 to 170 volts standoff voltages (V

)

•

Optional 100%

screening for avionics grade

is available

by adding MA prefix to part number for 100% temperature

cycle -55

C to +125

C (10X) as well as surge (3X) and 24

hours HTRB with post test V

& I

(in operating direction

for unidirectional or both directions for bidirectional)

•

Options for screening in accordance with MIL-PRF-19500

for JANTX are available by adding MX prefix to the part

number.

•

Axial-lead equivalent packages for thru-hole mounting

available as P6KE6.8 to P6KE200CA (consult factory for

other surface mount options)

•

Moisture classification is Level 1 with no dry pack required

per IPC/JEDEC J-STD-020B

•

RoHS compliant devices available by adding an “e3” suffix

•

APPLICATIONS / BENEFITS

Economical surface mount design in both J-bend or

Gull-wing terminations

Protects sensitive components such as IC’s, CMOS,

Bipolar, BiCMOS, ECL, DTL, T L, etc.

Protection from switching transients & induced RF

Compliant to IEC61000-4-2 and IEC61000-4-4 for

ESD and EFT protection respectively

Secondary lightning protection per IEC61000-4-5 with

42 Ohms source impedance:

Class 1: SMB 5.0 to SMB 120A or CA

Class 2: SMB 5.0 to SMB 60A or CA

Class 3: SMB 5.0 to SMB 30A or CA

Class 4: SMB 5.0 to SMB 15A or CA

Secondary lightning protection per IEC61000-4-5 with

12 Ohms source impedance:

Class 1: SMB 5.0 to SMB 36A or CA

Class 2: SMB 5.0 to SMB 18A or CA

•

MAXIMUM RATINGS

•

Peak Pulse Power dissipation at 25

C: 600 watts at

10/1000

μs

(also see Fig 1,2, and 3).

•

Impulse repetition rate (duty factor): 0.01%

•

clamping

(0 volts to

(BR)

min.): < 100 ps theoretical for

unidirectional and < 5 ns for bidirectional

•

Operating and Storage temperature: -65

C to +150

•

Thermal resistance: 25

C/W junction to lead, or 90

C/W

junction to ambient when mounted on FR4 PC board (1oz

Cu) with recommended footprint (see last page)

•

Steady-State Power dissipation: 5 watts at T

= 25 C, or

1.38 watts at T

= 25

C when mounted on FR4 PC board

with recommended footprint

•

Forward Surge at 25ºC: 100 Amps peak impulse of 8.3

ms half-sine wave (unidirectional only)

•

Solder temperatures: 260

C for 10 s (maximum)

2009

SA3-37, REV J, 5-24-2009

MECHANICAL AND PACKAGING

•

CASE: Void-free transfer molded thermosetting

epoxy body meeting UL94V-0

TERMINALS: Gull-wing or C-bend (modified J-bend)

tin-lead or RoHS compliant annealed matte-tin plating

solderable per MIL-STD-750, method 2026

POLARITY: Cathode indicated by band. No marking

on bi-directional devices

MARKING: Part number without standard prefix (e.g.

5.0, 5.0A, 5.0CA, 5.0Ae3, 36, MX36A, 36CAe3, etc.)

TAPE & REEL option: Standard per EIA-481-1-A with

12 mm tape, 750 per 7 inch reel or 2500 per 13 inch

reel (add “TR” suffix to part number)

WEIGHT: 0.1 grams

See package dimension on last page

SMB5.0– 170AC, e3

•

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

Page 1

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