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10112684-G03-25ULF

Description
Headers & Wire Housings MINITEK HEADER
CategoryThe connector   
File Size191KB,7 Pages
ManufacturerFCI / Amphenol
Environmental Compliance
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10112684-G03-25ULF Overview

Headers & Wire Housings MINITEK HEADER

10112684-G03-25ULF Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerFCI / Amphenol
Product CategoryHeaders & Wire Housings
RoHSDetails
ProductHeaders
TypePin Strip
Number of Positions25 Position
Pitch2 mm
Number of Rows1 Row
Mounting Style-
Termination StyleSMD/SMT
Mounting AngleRight Angle
Contact PlatingGold
Mating Post Length4 mm
PackagingTube
Current Rating2 A
Housing MaterialThermoplastic
Voltage Rating650 V
Contact MaterialPhosphor Bronze
Insulation Resistance1000 MOhms
Maximum Operating Temperature+ 125 C
Minimum Operating Temperature- 40 C
Factory Pack Quantity11
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-0804
REVISION
MINITEK
TM
Header SMT HORIZONTAL
1 of 7
AUTHORIZED BY
DATE
A
11 Jan 2011
JM COMPAGNON
CLASSIFICATION
UNRESTRICTED
1.0
OBJECTIVE
This specification defines the performance, test, quality, and reliability requirements of the Minitek
2.0 millimeters centerline SMT R/A.
TM
Header
2.0
SCOPE
This specification is applicable to the termination characteristics of the Minitek Header, when mated with
TM
FCI Minitek terminals or other 0.51mm pin compatible receptacles, 2mm centerline. This product provides
board to board, board to cable, board to discrete wire capabilities in horizontal one or two row configurations.
TM
3.0
REQUIREMENTS
3.1
MATERIAL
3.1.1 Pins: Pins shall be Phosphor Bronze Alloy UNS C51000 drawn wire in accordance with
ASTMB159
3.1.2 Insulator: High temperature Glass-filled polymer with a flame retardant rating of UL-94-V0
3.2
FINISH
The finish of the pins shall be as specified herein.
3.2.1 Solder tails: 2-6µm pure matte Tin over 1.27µm nickel MIN under plating.
3.2.2 Contact areas: As defined by product drawings, will be plated with the specified thickness
Class II -
0.76µm Gold/GXT over 1.27µm nickel MIN under plating.
Class III
Gold flash over 1.27µm nickel MIN under plating
2µm MIN full Tin MIN over 1.27µm nickel MIN under plating
3.2.3 All other areas will be plated with 1.27µm min of nickel.
3.3
Copyright FCI
Form E-3334
Rev E
DESIGN AND CONSTRUCTION
GS-01-001

10112684-G03-25ULF Related Products

10112684-G03-25ULF 10112690-G03-23ULF
Description Headers & Wire Housings MINITEK HEADER Headers & Wire Housings MINITEK HEADER
Product Attribute Attribute Value Attribute Value
Manufacturer FCI / Amphenol FCI / Amphenol
Product Category Headers & Wire Housings Headers & Wire Housings
RoHS Details Details
Product Headers Headers
Type Pin Strip Pin Strip
Number of Positions 25 Position 46 Position
Pitch 2 mm 2 mm
Number of Rows 1 Row 2 Row
Termination Style SMD/SMT SMD/SMT
Mounting Angle Right Angle Right Angle
Contact Plating Gold Gold
Mating Post Length 4 mm 4 mm
Packaging Tube Tube
Current Rating 2 A 2 A
Housing Material Thermoplastic Thermoplastic
Voltage Rating 650 V 650 V
Contact Material Phosphor Bronze Phosphor Bronze
Insulation Resistance 1000 MOhms 1000 MOhms
Maximum Operating Temperature + 125 C + 125 C
Minimum Operating Temperature - 40 C - 40 C
Factory Pack Quantity 11 12
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