803-43-040-10-001000 datasheet, PDF

Datasheet> All Categories > The connector> The connector> 803-43-040-10-001000

803-43-040-10-001000: DescriptionHeaders & Wire Housings; CategoryThe connector The connector; File Size127KB，3 Pages; ManufacturerMill-Max; Websitehttps://www.mill-max.com; Environmental Compliance

Download Datasheet Parametric View All

803-43-040-10-001000 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	803-43-040-10-001000	-	-	View	Buy Now

803-43-040-10-001000 Overview

Headers & Wire Housings

803-43-040-10-001000 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
package instruction	ROHS AND REACH COMPLIANT
Reach Compliance Code	compliant
ECCN code	EAR99
Body/casing type	SOCKET
Connector type	BOARD CONNECTOR
Contact to complete cooperation	GOLD (30) OVER NICKEL (100)
Contact completed and terminated	Tin (Sn)
Contact point gender	FEMALE
Contact material	NOT SPECIFIED
DIN compliance	NO
Filter function	NO
IEC compliance	NO
JESD-609 code	e3
MIL compliance	NO
Plug information	MULTIPLE MATING PARTS AVAILABLE
Mixed contacts	NO
Installation method	STRAIGHT
Installation type	BOARD
Number of rows loaded	2
Options	GENERAL PURPOSE
Terminal pitch	2.54 mm
Termination type	SOLDER
Total number of contacts	40
Base Number Matches	1

Preview

Download Datasheet

View All

Product Number: 803-43-040-10-001000

Description:

Interconnect Socket

Standard Solder Tail Socket

Accepts .025"- .037" (0,635 - 0,94

mm)dia leads

Double Row

Through Hole

Plating Code:

Shell Plating:

200 μ" Tin (matte finish) over 100

μ" Nickel

Inner Contact Plating:

30 μ" Gold over 50 μ" Nickel

Pins

Mill-Max

Part

Number

803-43-040-10-001000

RoHS

Compliant

CONTACT:

Contact Used: #47, Standard 6 Finger Contact

Current Rating =

4.5 Amps

BERYLLIUM COPPER ALLOY

172 (UNS C17200) per ASTM B 194

Properties of BERYLLIUM COPPER:

Chemical composition: Cu 98.1%, Be 1.9%

Temper as stamped: TD01

Properties after heat treatment (TH01):

Hardness: 36-43 Rockwell C

Mechanical Life: 1000 Cycles Min.

Density: .298 lbs/in3

Electrical Conductivity: 22% IACS*

Resistance: 10 miliohms Max

Operating Temperature: -55°C/+125°C

Melting point: 980°C/865°C (liquidus/solidus)

Stress Relaxation†: 96% of stress remains after 1,000 hours @ 100 °C; 70% of stress remains after 1,000 hours

@ 200 °C

*International Annealed Copper Standard, i.e. as a % of pure copper.

†Since BeCu loses its spring properties over time at high temperatures; it is rated for continuous use up to 150°C. For

applications up to 300°C, Mill-Max offers many contacts in Beryllium Nickel. Contact Tech Support for more info.

Mill-Max Mfg. Corp. Datasheet — Last Modified 1/10/2017

Page 1 of 3

LOOSE PIN:

Pin Used: 1304 (Brass Alloy)

BRASS ALLOY

360 per ASTM B 16, or 385 per ASTM B455

Properties of BRASS ALLOY 360 ASTM B 16:

Chemical composition: Cu 63% (max), Pb 3.7% (max)†, Fe .35% (max), Zn remainder

Temper as machined: H02/H04

Yield Strength: 25-45 ksi

Tensile strength: 57-80 ksi

Hardness as machined: 80-90 Rockwell B

Electrical conductivity: 26% IACS*

Melting point: 1000°C/840°C (liquidus/solidus)

Properties of BRASS ALLOY 385 ASTM B 455:

Chemical composition: Cu 60% (max), Pb 3.5% (max)†, Fe .35% (max), Zn remainder

Temper as machined: H02/H04

Yield Strength: 16 ksi(min)

Tensile strength: 48 ksi(min)

Hardness as machined: 80-90 Rockwell B

Electrical conductivity: 28% IACS*

Melting point: 1000°C/840°C (liquidus/solidus)

After machining, brass parts are often annealed (softened) for subsequent bending, swaging or crimping. A partial anneal

down to 60±10 RB is recommended for 90° bends, a full anneal down to 35±15 RB is recommended for pins or terminals

that are swaged (riveted) to a circuit board or crimped to a wire.

†RoHS-2 directive 2011/65/EU, exemption 6c allows up to 4% lead as an alloy agent in copper.

*International Annealed Copper Standard, i.e. as a % of pure copper.

INSULATOR INFORMATION:

PCT

Polyester, (Thermx CG933, black)

High Temperature

Properties of PCT Polyester:

Brand: Thermx

Grade: CG-933

Rated voltage: 100 VRMS/150 VDC

Insulation resistance: 10,000 Megaohms min.

Material Heat Deflection Temp (per ASTM D 648): 529°F (276°C) @ 66 psi

Dielectric strength: 1000 VRMS min. (700 VRMS min. for series 117 Shrink DIP)

Note: Materials above 446°F (230°C) are considered suitable for "eutectic" reflow soldering, above 500°F (260°C) for

"lead-free" reflow soldering.

Certificate of Compliance:

This is to Certify that the product described above is manufactured to Mill-Max quality standards in accordance with all

applicable specifications and drawing. Mill-Max certifies this product to be free from defects of materials and workmanship.

This Certificate of Compliance covers the following requirements:

Dimensional (all features verified to be within tolerances described on the applicable drawing).

Raw Material (materials and properties verified to be as described on the applicable drawing).

Plating (platings as required, thickness verified, and performance including solderability per mil-standard).

Performance (insertion extraction or other force requirements as described on the applicable drawing).

Mill-Max Mfg. Corp. Datasheet — Last Modified 1/10/2017

Page 2 of 3

RoHS Compliance Statement for the restriction of lead, mercury, cadmium and hexavalent chromium PBB,

PBDE, including Octa-BDE, Penta-BDE, Deca -BDE, in electronic equipment and use of PFOA

and PFOS in metal plating processes.

Reference:

1. Directive 2002/95/EC of the European Parliament and of the Council of January 27 2003 on the restriction of the use of

certain hazardous substances in electrical and electronic equipment.

2. Directive 2003/11/EC which amends Council Directive 76/769/EC to include pentabromodiphenyl ether and

octabromodiphenyl ether.

3. Directive 2005/618/EC Commission decision of 18 August 2005 amending Directive 2002/95/EC. Establishes threshold

limits for Lead, Mercury, Cadmium, Hexavalent Chromium, PBB, and PBDE.

4. Judgment of the Court (Grand Chamber) 1 April 2008, Directive 2002/95/EC-Electrical and electronic equipment -

Decabromodiphenyl ether (Deca-BDE) Actions for annulment of exemption.

5. EU Directive 2006/122/EC of the European Parliament and of the Council of 12 December 2006, amending Council

Directive 76/769/EEC on the restriction of Perfluorooctanoic Acid (PFOA) and Perfluorooctane Sulfanates (PFOS) used

during metal plating processes.

In reference to the directives described above, MILL-MAX Mfg.Corp. declares that lead, mercury, cadmium, hexavalent

chromium, polybrominated biphenyls, polybrominated diphenyl ethers, including pentabromodiphenyl ether,

octabromodiphenyl ether, decabromodiphenyl ether, Perfluorooctanoic Acid, and Perfluorooctane Sulfanates are not

intentionally added to the raw material or processes used for our certified RoHS compliant products except where described

and allowed under item 6 of the annex; Applications where lead mercury, cadmium, and hexavalent chromium, which are

exempted from the requirements of Article 4 (1) of reference 1. No warranty, liability of indemnification is expressed or

implied with this information.

Compliance Statement for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH)

Reference:

1. Regulation EC No 1907/2006 of the European Parliament and of the Council of 18 December 2006, concerning the

Registration, Evaluation, Authorization and Restriction of Chemicals (REACH)

2. ECHA, Candidate list of Substances of Very High Concern (SVHC)

http://echa.europa.eu/reach_en.asp

Mill-Max is aware of the regulation and the SVHC list the EU published (referenced above). Mill-Max does not produce or

sell any of the listed substances in their homogeneous form. These substances are not intentionally added during the

manufacturing of any Mill-Max products. To our knowledge, our products do not contain the substances described on the

ECHA SVHC list. Testing is not performed for materials and substances that were not intentionally added. No warranty,

liability of indemnification is expressed or implied with this information. Mill-Max maintains surveillance of the ECHA website

to obtain the latest information and periodically reviews the SVHC list for changes and additions.

Compliance Statement for DRC Conflict Free products.

Reference:

Dodd-Frank Wall Street Reform and Consumer Protection Act, Section 1502, reporting requirements for users of conflict

minerals.

“Conflict minerals,” are Columbite-tantalite (coltan), cassiterite, gold, wolframite, or their derivatives; or any other mineral

or its derivatives determined by the Secretary of State to be financing conflict in the Democratic Republic of the Congo

(DRC) or an adjoining country. Metals derived from these minerals are tin, tantalum, tungsten, and gold. By this definition,

the only minerals of concern that may be found in Mill-Max products are tin and gold.

Mill-Max Mfg.Corp. hereby certifies that its products are manufactured with tin and gold that is derived from material that

is considered DRC Conflict Free. Mill-Max provides this assurance as a result of a due diligence process that includes

traceability to the source and in some cases the identification of recycled and scrap materials included in the subject

material.

Mill-Max Mfg. Corp. Datasheet — Last Modified 1/10/2017

Page 3 of 3

Recommended Resources

Series improved oscillation circuit

Improved servo power supply circuit diagram

New switching power supply circuit diagram using MAX761

Photoelectric isolation fast switch circuit diagram

Telephone indicator circuit

Optical fiber controlled bidirectional thyristor AC switch circuit

Looking for arm development board: Because I have borrowed my original tq2440, I am now looking for a cheaper second-hand arm development board. ARM9 or ARM11 development board is fine. QQ295133956. Thank you!...; lonerzf Buy&Sell

I'm very annoyed recently so I'll share a joke for your entertainment: Woman: "Do you have a three-bedroom apartment?" Man: "No." Woman: "Do you have an Accord?" Man: "No." Woman (stands up): "I have something to do, so I'm leaving now." Man (mutters to himself): "I have...; huayang1118 Talking

Given the current development status of Linux in China, more than 90% of the questions can be answered in one sentence.: 0001 [color=red]Change the host name (Chen Xu)[/color] vi /etc/sysconfig/network, change the HOSTNAME line to "HOSTNAME=hostname" (if there is no such line, then add it), and then run the command " ho...; 黑衣人 Linux and Android

[Share your experience] STM32F03 development board--system clock setting SysTick: [align=center]【Share your experience】STM32F03[/font][font=宋体]development board[/font][font=宋体]--System clock setting[/font][/align][align=left]First, let me analyze the[font=Times New Roman]startup_st...; qinkaiabc stm32/stm8

Weird problem, external RAM reading and writing are always wrong: I use the ADUC7026 chip to sample the AD data and write it to the external RAM. I find that the written data is always wrong. I don't know why the single-step execution is correct, but the full-speed ...; PWP1013 Embedded System

How does the BUCK circuit control the output constant voltage?: The theoretical waveform of BUCK output voltage is a square wave. How can we make the output voltage constant? Is it feasible to increase the capacitance?...; 喜鹊王子 Analogue and Mixed Signal

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components