less Communications, Public Safety Radio, Avionics, Telecom, WiMAX,
Microwave Communication Systems and Satellite Systems.
Typical circuit applications: High RF Power Filter Networks, Combiners,
Couplers, Matching Networks, Output Coupling, Antenna Coupling, and
DC Blocking and Bypassing.
ELECTRICAL AND MECHANICAL
SPECIFICATIONS
QUALITY FACTOR (Q):
.
2000 @ 1 MHz
TEMPERATURE COEFFICIENT OF CAPACITANCE (TCC):
0 ±30 PPM/°C (-55°C to +125°C)
INSULATION RESISTANCE (IR):
0.1 pF to 1000 pF:
10
5
Megohms min. @ +25°C at rated WVDC
10
4
Megohms min. @ +125°C at rated WVDC
WORKING VOLTAGE (WVDC):
See Capacitance Values Table, page 2
DIELECTRIC WITHSTANDING VOLTAGE (DWV):
Case B: 250% of rated WVDC for 5 secs
RETRACE:
Less than ±(0.02% or 0.02 pF), whichever is greater
AGING EFFECTS:
None
PIEZOELECTRIC EFFECTS:
None
(No capacitance variation with voltage or pressure)
CAPACITANCE DRIFT:
±(0.02% or 0.02 pF), whichever is greater
OPERATING TEMPERATURE RANGE:
From -55°C to +125°C (No derating of working voltage)
TERMINATION STYLES:
RoHS Compliant and Solder Plate
See Mechanical Configurations, page 3
TERMINAL STRENGTH:
Terminations for chips withstand a pull of
5 lbs. min., 15 lbs. typical, for 5 seconds in direction perpendicular
to the termination surface of the capacitor. Test per MIL-STD-202,
method 211.
ENVIRONMENTAL TESTS
ATC 800 B Series Capacitors are designed and manufactured to meet and
exceed the requirements of EIA-198, MIL-PRF-55681 and MIL-PRF-123.
THERMAL SHOCK:
MIL-STD-202, Method 107, Condition A
MOISTURE RESISTANCE:
MIL-STD-202, Method 106
LOW VOLTAGE HUMIDITY:
MIL-STD-202, Method 103, Condition A, with 1.5 Volts DC applied
while subjected to an environment of 85°C with 85% relative
humidity for 240 hours min.
LIFE TEST:
MIL-STD-202, Method 108, for 2000 hours, at 125°C
200% WVDC applied
American
Technical
Ceramics
THE ENGINEERS’ CHOICE
®
w w w. atcer ami cs.com
ATC # 001-1033 Rev. J, 1/18
ATC 800 B Capacitance Values
CAP. CAP.
CODE (pF) TOL.
0R1
0R2
0R3
0R4
0R5
0R6
0R7
0R8
0R9
1R0
1R1
1R2
1R3
1R4
1R5
1R6
1R7
1R8
1R9
2R0
2R1
2R2
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
B
B, C
RATED
WVDC
CAP.
CODE
2R4
2R7
3R0
3R3
3R6
3R9
4R3
4R7
5R1
5R6
6R2
6R8
7R5
8R2
9R1
100
110
120
130
150
160
180
CAP.
(pF)
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
TOL.
RATED
WVDC
CAP.
CODE
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
CAP.
(pF)
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
TOL.
RATED
WVDC
CAP.
CODE
151
161
181
201
221
241
271
301
331
361
391
431
471
511
561
621
681
751
821
911
102
CAP.
(pF)
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1000
TOL.
RATED
WVDC
300
B, C,
D
500
F, G,
J, K,
M
200
F, G,
J, K,
M
500
B, C,
D
500
B, C,
J, K,
M
100
F, G,
J, K,
M
50
300
VRMS = 0.707 X WVDC
• SPECIAL VALUES, TOLERANCES AND MATCHING AVAILABLE. PLEASE CONSULT FACTORY.
ATC PART NUMBER CODE
ATC800 B 91 0
Series
Case Size
Capacitance Code:
First 2 significant digits for capacitance.
R=Decimal Point
Indicates number of zeros following digits
of capacitance in picofarads except for decimal values.
Capacitance Tolerance
J T
500 X
T
Packaging
T - Tape & Reel: 500 and 1000 pc. qty. std.*
TV - Vertical Orientation of Product,
Tape & Reel: 500 and 1000 pc. qty. std.*
I - Special Packaging. Consult Factory.
*
Consult ATC for other quantities
CAPACITANCE TOLERANCE
Code
B
C
D
F
G
J
K
M
Laser Marking
WVDC
Termination Code
Tol.
±0.1 pF ±0.25 pF ±0.5 pF ±1% ±2% ±5% ±10% ±20%
The above part number refers to a 800 B Series (case size B) 91 pF capacitor,
J tolerance (±5%), 500 WVDC, with T termination (Tin Plated over Nickel Barrier Termination, RoHS Compliant), laser marking and tape and reel packaging.
ATC accepts orders for our parts using designations
with
or
without
the
“ATC” prefix. Both methods of defining the part number are equivalent,
i.e., part numbers referenced with the “ATC” prefix are interchangeable
to parts referenced without the “ATC” prefix. Customers are free to use
either in specifying or procuring parts from American Technical Ceramics.
For additional information and catalogs contact your ATC
representative or call direct at (+1-631) 622-4700.
Consult factory for additional performance data.
A M E R I C A N
ATC North America
sales@atceramics.com
T E C H N I C A L
ATC Europe
saleseur@atceramics.com
C E R A M I C S
ATC Asia
sales@atceramics-asia.com
2
w w w.a t c e r am ic s .c o m
ATC 800 B Capacitors: Mechanical Configurations
ATC
ATC
SERIES
TERM.
& CASE
CODE
SIZE
CASE SIZE
& TYPE
OUTLINES
W/T IS A
TERMINATION SURFACE
Y
BODY DIMENSIONS
Inches (mm)
LENGTH
(L)
.110
+.020 -.010
(2.79
+0.51 -0.25)
LEAD AND TERMINATION
DIMENSIONS AND MATERIALS
OVERLAP
(Y)
MATERIAL
WIDTH
(W)
THICKNESS
(T)
800B
T
Nickel Barrier
Y
B
Solderable
W
L
T
.110 ±.015 .070 (1.78)
(2.79 ±0.38)
max.
.015 (0.38)
±.010 (0.25)
RoHS Compliant
Tin Plated over
Nickel Barrier Termination
800B
W
B
Solder Plate
L
W
T
.110
+.020 -.010 .110 ±.015 .070 (1.78)
(2.79
(2.79 ±0.38)
max.
+0.51 -0.25)
.015 (0.38)
±.010 (0.25)
Tin /Lead Solder Plated over
Nickel Barrier Termination
ATC 800 B Capacitors: Non-Magnetic Mechanical Configurations
ATC
ATC
SERIES
TERM.
& CASE
CODE
SIZE
CASE SIZE
& TYPE
OUTLINES
W/T IS A
TERMINATION SURFACE
Y
W
L
T
BODY DIMENSIONS
Inches (mm)
LENGTH
(L)
.110
+.020 -.010
(2.79
+0.51 -0.25)
LEAD AND TERMINATION
DIMENSIONS AND MATERIALS
OVERLAP
(Y)
MATERIAL
WIDTH
(W)
THICKNESS
(T)
B
800B
TN
Non-Mag
Solderable
Barrier
.110 ±.015 .070 (1.78)
(2.79 ±0.38)
max.
.015 (0.38)
±.010 (0.25)
RoHS Compliant
Tin Plated over
Non-Magnetic Barrier Termination
Suggested Mounting Pad Dimensions
Case B Vertical Mount
Cap
Pad Size
Value.43)
All
Values
Normal
High
Density
A Min
.090
(2.29)
.070
(1.78)
B Min
.050
(1.27)
.030
(.762)
C Min
.075
(1.91)
.075
(1.91)
D Min
.175
(4.45)
.135
(3.43)
Case B Horizontal Mount
Cap
Pad Size
Value.43)
All
Values
Normal
High
Density
A Min
.130
(3.30)
.110
(2.79)
B Min
.050
(1.27)
.030
(.762)
C Min
.075
(1.91)
.075
(1.91)
D Min
.175
(4.45)
.135
(3.43)
inches (mm)
A M E R I C A N
ATC North America
sales@atceramics.com
T E C H N I C A L
ATC Europe
saleseur@atceramics.com
C E R A M I C S
ATC Asia
sales@atceramics-asia.com
w w w.a t c e r am ic s .c o m
3
ATC 800 B Performance Data
1.00
800 B ESR vs. Frequency
1.0 pF
ESR (Ohms)
3.3 pF
10 pF
0.10
39 pF
100 pF
200 pF
1000 pF
(Typical)
0.01
100
1000
10000
Frequency (MHz)
100.0
800 B FSR & FPR vs. Capacitance
10.0
Fpr
Frequency (GHz)
Fsr
1.0
0.1
1
10
100
1000
Capacitance (pF)
ATC 800 B Series Data Sheet Test Condition Description
Capacitors vertically mounted in series microstrip configuration on 23.3-mil thick Rogers RO4350
®
softboard, 52-mils wide 1/2 oz. Cu traces.
FSR
= lowest frequency at which S11 response, referenced at capacitor edge, crosses real axis on Smith Chart.
FPR
= lowest frequency at which there is a notch in S21 magnitude response.
A M E R I C A N
ATC North America
sales@atceramics.com
T E C H N I C A L
ATC Europe
saleseur@atceramics.com
C E R A M I C S
ATC Asia
sales@atceramics-asia.com
4
w w w.a t c e r am ic s .c o m
ATC 800 B Performance Data
800B Capacitance Change vs. Temperature
TCC= 0 ±30 PPM/C
1
0.8
0.6
0.4
% Change in Capacitance
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
-55
-35
-15
5
25
45
65
85
105
125
Temperature (Degrees C)
Sales of ATC products are subject to the terms and conditions contained in American Technical Ceramics Corp. Terms and Conditions of Sale (ATC document #001-992). Copies of these terms
and conditions will be provided upon request. They may also be viewed on ATC’s website at www.atceramics.com/productfinder/default.asp. Click on the link for Terms and Conditions of Sale.
ATC has made every effort to have this information as accurate as possible. However, no responsibility is assumed by ATC for its use, nor for any infringements of rights of third parties which
may result from its use. ATC reserves the right to revise the content or modify its product without prior notice.
Basic knowledge: The difference between io430.h and msp430.h The header files in the new version of IAR are similar to io430.h and msp430.h. Do you know the difference? Can you explain it in detail?...
Could you please help me check if what I wrote is correct? Why does it feel like it is not written in? void SPI_send(unsigned char dat) { unsigned short i=0; for(i=0;i0;i--) { SPI_send(opcode.byte[i-1...
For those who have been working for more than one year, your learning of MCU is directly for the boss to increase your salary, but the premise is that you have absolute confidence that you can improve...
I know that global variables and static local variables are usually stored in the .DATA section. However, local variables do not exist in the PE file and cannot be found in the PE file (for example, i...
Send command string to 430 through PC and realize baud rate 115200 through receive interrupt. However, after each receive interrupt, the last byte of the last string is received. Solution: Attached co...
Wave soldering is a crucial electronic component soldering technique used in the production of a wide range of electronic devices, from home appliances to computers to avionics. The process is wide...[Details]
Reflow soldering, a common soldering method in modern electronics manufacturing, primarily melts solder paste and pads to form solder joints. With technological advancements, soldering equipment ha...[Details]
A parallel inverter consists of two thyristors (T1 and T2), a capacitor, a center-tapped transformer, and an inductor. The thyristors provide a current path, while the inductor L maintains a consta...[Details]
In recent years, many people have switched to new energy vehicles, and this type of vehicle has indeed been highly sought after and is considered the future direction of automobile development, and...[Details]
On August 25th, TSMC, the world's leading contract chip manufacturer, attracted significant attention for its decision to build a chip manufacturing facility in Arizona. TSMC primarily manufactures...[Details]
On August 21, WeRide officially launched WePilot AiDrive, a one-stage end-to-end assisted driving solution developed in cooperation with Bosch. This comes only half a year after the two parties' "t...[Details]
Overview
As handheld voice communication devices become more and more popular, they are increasingly used in noisy environments, such as airports, busy roads, crowded bars, etc. In such noisy ...[Details]
Electric vehicles are powered by electricity, and charging is a device that supplements the vehicle's energy source. It is common to need to recharge the vehicle when driving. But can you charge th...[Details]
Intel®
Xeon®
6
-
core processors now support the new Amazon EC2 R8i and R8i-flex instances on Amazon Web Services (AWS).
These new instances offer superior performance and fast...[Details]
Today,
the Intel®
Universal
Quick Connector (UQD) Interchangeability Alliance was officially established
. At the inaugural ceremony, Intel and its first certified partners—Invicta...[Details]
Blackfin® 16-/32-bit embedded processors offer high performance, low power consumption, flexible software features, and scalability, making them suitable for converged applications such as multi-fo...[Details]
The motor is a very important component for new energy vehicles. In terms of vehicle power, pure electric vehicles use electric motors instead of traditional diesel/gasoline engines. For electric v...[Details]
At the 2025 KeyBanc Investor Conference,
ON
Semiconductor CEO Hassane S. El-Khoury, framing global industrial transformation as the basis for
his strategic layout in two high-growth sect...[Details]
Arm helps automakers bring new models to market at least a year earlier.
Zena CSS accelerates software and silicon development, enabling faster and more efficient delivery of AI cap...[Details]
Yongxin Technology's BCL603S2H chipset integrates the nRF54L15 system-on-chip for monitoring various sensors and achieving seamless wireless connectivity.
Oslo, Norway – August 19, 2...[Details]
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
