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CR0402-FX-2702GLF

Description
Thick Film Resistors - SMD 27K OHM 1%
CategoryPassive components    The resistor   
File Size268KB,3 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Environmental Compliance
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CR0402-FX-2702GLF Overview

Thick Film Resistors - SMD 27K OHM 1%

CR0402-FX-2702GLF Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instructionSMT, 0402
Reach Compliance Codecompliant
ECCN codeEAR99
structureRECTANGULAR PACKAGE
JESD-609 codee3
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.35 mm
Package length1 mm
Package formSMT
Package width0.5 mm
method of packingTR, PAPER, 7 INCH
Rated power dissipation(P)0.0625 W
Rated temperature70 °C
resistance27000 Ω
Resistor typeFIXED RESISTOR
size code0402
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage50 V
Base Number Matches1
PL
IA
NT
Features
n
Small package dimensions
n
RoHS compliant*
n
Power rating at 70 °C = 1/16 W
n
Tight dimensional tolerances
n
Three layer termination process with
n
Suitable for most types of soldering
processes
n
Standard packaging on paper tape and reel
*R
oH
S
C
O
M
LE
AD
F
RE
E
nickel barrier prevents leaching and
provides excellent solderability
CR0402 - Chip Resistor
Derating Curve
100
Rated Power (%)
80
60
40
20
0
-55
0
70
155
Electrical Characteristics
Power Rating @ 70 °C ................1/16 W
Operating Temperature Range
................................-55 °C to +155 °C
Derated to 0 Load at ..................+155 °C
Maximum Working Voltage ..............50 V
Maximum Overload Voltage ..........100 V
Resistance Range
1 %, E-96
and E-24...... 10 ohms to 10 megohms
5 %, E-24 ........ 1 ohm to 20 megohms
Zero Ohm Jumper ............ <0.05 ohms
Temperature Coefficient
1 %
........10 Ω ≤ R ≤ 1 MΩ ±100 ppm/℃
5 %
......10 Ω ≤ R ≤ 10 MΩ ±200 ppm/℃
AEC-Q200 ..................... Contact Bourns
to confirm availability
10 MΩ < R ≤ 20 MΩ ±400 ppm/℃
1 Ω ≤ R < 10 Ω -200 to +500 ppm/°C
1 MΩ < R ≤ 10 MΩ ±200 ppm/℃
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Ambient Temperature (°C)
Standard Values
For Standard Values Used in Capac-
itors, Inductors, and Resistors,
click
here.
Part Marking System
No Marking on the CR0402 Chip
Resistors.
Dimensional Drawings
0.20 ± 0.10
(0.008 ± 0.004)
0.35 ± 0.05
(0.014 ± 0.002)
0.20 ± 0.10
(0.008 ± 0.004)
Resistor (Ru0
2
)
(Jumper chip is
a conductor)
Overcoat
0.25 ± 0.10
(0.010 ± 0.004)
0.25 ± 0.10
(0.010 ± 0.004)
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.05
(0.020 ± 0.002)
Alumina Substrate
DIMENSIONS:
MM
(INCHES)
Internal Electrode (Ag)
Secondary Electrode (Nickel Plated)
External Electrode
(tin-plated)
Performance Characteristics
Test
Thermal Shock
Short Time Overload
Resistance to Solder Heat
Resistance to Dry Heat
Load Life
Load Life with Humidity
Solderability
Bending
Dielectric Withstanding
Voltage
Insulation Resistance
Procedure
-55 ℃ for 30 minutes, +155 ℃ for 30 minutes,
5 cycles
2.5 X rated voltage for 5 seconds
270 ±5 ℃ for 10 ±1 seconds
125 ±5 ℃ for 96 ±4 hours
Rated voltage for 1000 hours, 70 ℃,
1.5 hours “ON“, 0.5 hours “OFF”
Rated voltage for 1000 hours, 40 ±2 ℃,
90~95 % RH, 1.5 hours “ON“, 0.5 hours “OFF”
245 ±5 ℃, 2 ±0.5 seconds
3 mm
--
100 V
Method
IEC60115-1-4.19
IEC60115-1-4.13
IEC60115-1-4.18
IEC60115-1-4.23.2
IEC60115-1-4.25.1
IEC60115-1-4.24
IEC60115-1-4.17
IEC60115-1-4.33
IEC60115-1-4.7
IEC60115-1-4.6
1%
Test Limits
DR
5%
≤±(0.5 % + 0.05 Ω)
≤±(1 % + 0.05 Ω)
≤±(2 % + 0.1 Ω)
≤±(0.5 % + 0.05 Ω)
≤±(1 % + 0.05 Ω)
≤±(1 % + 0.05 Ω)
≤±(2 % + 0.1 Ω)
≤±(3 % + 0.1 Ω)
≤±(3 % + 0.1 Ω)
≥95 % of area covered
≤±(0.5 % + 0.05 Ω)
≤±(1 % + 0.05 Ω)
>100 V
≥1 GΩ
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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