• Ultra-reliable start up and greater immunity from interfer-
ence
• 50% + board saving space
• More cost effective than quartz oscillators, quartz crystals
and clock ICs.
• Completely quartz-free
Applications
•
•
•
•
•
•
•
•
•
•
•
Communications and Networking Applications
Consumer Electronics Applications
Automotive Applications
Industrial Applications
Gigabit Ethernet
10 Gigabit Ethernet
Fiber Channel
Ethernet
SATA/SAS
USB 2.0
PCI-Express
Block Diagram
VDD
OUT
Pinout
ST/OE
M EM S
R eson ator
H igh
P erform ance
S ynthesizer
1
4
VDD
GND
2
3
OUT
S T/O E
GND
Pin Description
Pin No. Name
1
2
3
4
ST/OE
GND
OUT
VDD
Pin Description
Standby/ Output Enable
Connect to Ground
1 to 200 MHz Programmed Clock
output
Connect to 1.8V / 2.5V / 2.8V / 3.3V
Pin1
Pin #1 Functionality
OE
H or Open; specified frequency output
L: output is high impedance
ST
H or Open; specified frequency output
L: output is low level (weak pull down) oscillation stops
SiTime Corporation
Rev. 1.08
990 Almanor Avenue, Suite 200
Sunnyvale, CA 94085
(408) 328-4400
www.sitime.com
Revised December 08, 2008
SiT8102
Description
The SiT8102 is the next generation of the SiT8002 program-
mable oscillator with lower phase noise, lower jitter, and a
higher frequency range. SiTime oscillators are the smallest,
high-performance programmable oscillator available and are
suitable for use in high speed serial communications,
consumer, portable, industrial, automotive and computation.
This oscillator is packaged in standard low-cost plastic and
chip-scale IC packages.
System reliability is also increased with the SiT8102 by elimi-
nating the quartz crystal and improved immunity to the
environmental effects of vibration, shock, strain, and humidity.
To order samples, go to www.sitime.com and click on Request
Sample” link.
Absolute Maximum Ratings
Attempted operation outside the absolute maximum ratings of the part may cause permanent damage to the part. Actual
performance of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings.
Ab
solute Maximum Table
Parameter
Storage Temperature
VDD
Electrostatic Discharge
Theta JA ( with copper plane on VDD and GND)
Theta JC (with PCB traces of 0.010 inch to all pins)
Soldering Temperature (follow standard Pb free soldering guidelines)
Number of Program Writes
Program Retention over -40 to 125 °C, Process, VDD (0 to 3.65V)
Min.
-65
-0.5
–
–
–
–
–
–
Max.
150
+3.65
6000
75
24
260
1
1,000+
Unit
°C
V
V
°C/W
°C/W
°C
NA
years
Operating Conditions
Parameter
Supply Voltages,
VDD
[1]
Min.
2.97
2.25
2.52
1.7
Extended Commercial OperatingTemperature
Industrial Operating Temperature
Maximum Load Capacitance
[2]
-20
-40
–
Typ.
3.3
2.5
2.8
1.8
–
–
–
Max.
3.63
2.75
3.08
1.9
70
85
15
Unit
V
V
V
V
°C
°C
pF
Environmental Compliance
Parameter
Mechanical Shock
Mechanical Vibration
Temperature Cycle
Solderability
Moisture Sensibility Level
Condition/Test Method
MIL-STD-883F, Method 2002
MIL-STD-883F, Method 2007
JESD22, Method A104
MIL-STD-883F, Method 2003
MSL1 @ 260°C
Notes:
1. The 2.5V device can operate from 2.25V to 3.63V with higher output drive, however, the data sheet specifications cannot be guaranteed. Please contact factory
for this option.
2. The output driver strength can be programmed to drive up to 30pF load. Please contact factory for this option.
[size=6][color=red]I would like to ask a question about pointers in IAR as follows: int *p1,*p2,*p3; char temp[8]; p1 = (int *)&temp[0]; p2 = (int *)&temp[4]; /**The above two sentences pass during de...
[align=left]According to national planning, China's new energy vehicles will reach 5 million in 2020, and the number of charging stations and charging piles will reach 12,000 and 4.8 million respectiv...
if(mpu_dmp_get_data(&pitch,&roll,&yaw)==0) { temp = MPU_Get_Temperature(); MPU_Get_Accelerometer(&aacx,&aacy,&aacz); MPU_Get_Gyroscope(&gyrox,&gyroy,&gyroz); My project uses angle measurement with an ...
How to set copper before laying copper in Altium Designer? 238)][font=sans-serif]It cannot be set before copper is laid[/font][/backcolor][/color][color=#222222][backcolor=rgb(238, 238, 238)][font=san...
Hello everyone! I am a rookie, and I have to do some experiments because I have to write a graduation thesis recently. What I want to achieve is to store a set of waveforms (dozens of waveforms) as a ...
I bought an RFIC development board and built a board, STM8S103F3, which should have been flashed with firmware. I have never used STM8, and I only have Nucleo STM32. It is said that a blank STM8 can b...
1. Equipment Overview
Shell-and-tube heat exchangers are a common heat exchange device used in chemical evaporation and heating equipment. Currently, the tubesheets of shell-and-tube heat exch...[Details]
Wave soldering is a crucial electronic component soldering technique used in the production of a wide range of electronic devices, from home appliances to computers to avionics. The process is wide...[Details]
Nios II is a configurable 16-/32-bit RISC processor. Combined with a rich set of peripheral-specific instructions and hardware acceleration units, it provides a highly flexible and powerful SOPC sy...[Details]
A parallel inverter consists of two thyristors (T1 and T2), a capacitor, a center-tapped transformer, and an inductor. The thyristors provide a current path, while the inductor L maintains a consta...[Details]
In recent years, many people have switched to new energy vehicles, and this type of vehicle has indeed been highly sought after and is considered the future direction of automobile development, and...[Details]
Since the beginning of this year, price wars have intensified, new models have been launched one after another, used cars with zero kilometers have become a hot topic, and the industry's internal c...[Details]
Since its invention in the mid-1940s, the microwave oven has evolved from a humble beginning to commercial use, entering homes in the 1960s and rapidly gaining popularity. Its basic functionality a...[Details]
While the current industry consensus is that autonomous vehicles are robots and that their systems are managed using robotics-developed thinking, there are also cases where autonomous driving is ac...[Details]
On August 22, the Wall Street Journal reported on the 21st local time that the new US government does not plan to acquire equity in semiconductor wafer foundry giant TSMC and Micron, one of the thr...[Details]
With growing environmental awareness, the continuous improvement of three-electric technology and the increasing deployment of infrastructure such as charging stations, the electrification of new e...[Details]
Tires are a very important component for cars. They are related to the driving experience of the vehicle. We are almost inseparable from cars in our daily lives. For tires, according to the role of...[Details]
Puttshack's Trackaball uses the Nordic nRF54L15 system-on-chip (SoC) to monitor sensors and enable Bluetooth low energy connectivity, while the nPM2100 power management integrated circuit (PMIC) ...[Details]
introduction
As core electronic components used in vastly different fields, automotive-grade chips and mobile/consumer-grade chips exhibit significant differences in their...[Details]
introduction
With the development and widespread use of integrated circuits in power electronics design, electronic products are trending towards smaller sizes, more components, and greater fu...[Details]
On August 20, it was reported that the specifications of Intel's upcoming Panther Lake mobile processor appeared on the Intel GFX CI website, which mainly focuses on Intel's open source Linux drive...[Details]
stm32/stm8
京公网安备 11010802033920号
EEWORLD
