Data Sheet
FUJITSU Component Connector FCN-074B / 078B series
(DDR4 DIMM)
FUJITSU Component Connector
FCN-074B / 078B series
Card Edge Connector for DDR4 Memory Module
Not for New Designs
Overview
This is a 288-pin DIMM socket that conforms to JEDEC standards.
Features
■
Highly reliable contact
Contact reliability with a module substrate is improved by a Fujtisu proprietary
double-contact structure, which is resistant to dust and flux
■
Various terminal shapes to match with substrate design and mounting form
One surface mount type, one press fit type, and three through-hole types
having different terminal lengths are included in this lineup
■
Flame resistant UL94V-0
Flame resistant UL94V-0 LCP resin is used for the housing insulating material
■
Typical applications
DRAM-memory module connections for HPCs (servers, supercomputers),
communication measurement apparatuses and office equipment
RoHS compliant
DDR4 DIMM socket
Item
Operating temperature range
Max. current rating
Max. voltage rating
Contact resistance
Insulation resistance
Dielectric withstanding voltage
Substrate insertion force
Specification
-55°C to +85°C
0.75A
29VAC
40mΩ maximum (10mA, 20mVDC)
1MΩ minimum (500VDC)
500VAC for 1 minute
126.4N less than
Item
Insulation material
Conductor
Surface treatment
Ejector
Metal fitting
Contact
Terminal
Material, surface treatment
LCP resing (UL94V-0)
Copper alloy
Gold plating (PAGOS)
Gold coat
PA resin (UL94V-0)
Copper alloy (tin plating)
■
Part numbers and dimensions
Part number
FCN-074B288-G/0D
FCN-074B288-G/1D
FCN-074B288-G/2D
FCN-078B288-G/0
FCN-074B288-G/0P
Surface mount
Press fit
Terminal
shape
Through
hole
Substrate
thickness
1.6
2.4
3.2
-
1.6 min.
Number
of pins
288
288
288
288
288
Tray
Package
format
Min.
package unit
40 pieces
40 pieces
40 pieces
40 pieces
40 pieces
Min.
shipment unit
200 pieces
200 pieces
200 pieces
200 pieces
200 pieces
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Page 1 of 6
Data Sheet
FUJITSU Component Connector FCN-074B / 078B series
(DDR4 DIMM)
■
•
Dimensions
Through-hole type FCN-074B288-G/ D
Memory module conforms to JEDEC MO-309)
Z Z
No. 145
No. 221
No. 222
No. 288
No.1
No. 77
No. 78
(148 : ejector, in closed state)
129 maximum (*)
No. 144
Center line of (*)
4
21.3 max.
Polarity key center line
L
0.85
0.85×(77-1)=64.6±0.1
74.55
162 max.
5 min.
14.5 min.
21.3 max.
(141)
0.85×(67-1)=56.1±0.1
63.4
3- 0.4±0.1
2.5 min.
6.4 max.
1.4±0.03
3.9 min.
Part number
FCN-074B288-G/0D
FCN-074B288-G/1D
FCN-074B288-G/2D
Dimensions (mm)
L
2.67
3.18
4.00
Applicable substrate
thickness (mm)
1.6
2.4
3.2
3.65±0.05
10 min.
Ejector: 162 max. in open state
Unit: mm
Dimensions in ( )
is reference value.
•
Recommended printed circuIt board (Top view)
Φ2.45±0.05
No. 145
No. 146
64.6
56.1
A
No. 221
No. 288
Φ2.45±0.05
No. 222
No.1
No. 2
74.55
No. 77
No. 78
63.4
No. 144
5.95
4.3
288 -Φ0.66±0.08
0.85
1.1
2.7
2.45±0.08
1.2±0.05
Detailed view of A
Unit: mm
Dimensions in ( ) is reference value.
Page 2 of 6
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Data Sheet
FUJITSU Component Connector FCN-074B / 078B series
(DDR4 DIMM)
■
•
Dimensions
Surface mount type FCN-078B288-G/0
Memory module conforms to JEDEC MO-309)
25
Z
No. 145
Z
No.1
(145: ejector enclosed state)
128.6 minimum(*)
Polarity key center line
7
No.288
No.144
4
21.3 min.
Center line of (*)
5.575
0.85×(77-1)=64.6±0.05
74.55
(141)
1.4±0.03
3.9 min.
162 min.
5 min
14.5 min
21.3 min
0.85×(67-1)=56.1±0.05
63.4
3 -0.4±0.1
2.5 min.
6.5 min.
3.65±0.05
10 min
(Ejector: 162 max. in open state)
Unit: mm
Dimensions in ( )
is reference value.
•
Recommended printed circuIt board pattern (Top view)
64.6
A
No. 221
No. 222
56.1
No. 288
Φ
2.45±0.05
No.1
74.55
No. 77
No. 78
63.4
No. 144
No.145
Φ
2.45±0.05
0.57±0.03
5.95
4.3
1.8±0.03
2.45±0.08
1.2±0.05
2.3 2.3
Detail A
Unit: mm
Dimensions in ( ) is reference value.
Page
3
of 6
http://us.fujitsu.com/connectors
Data Sheet
FUJITSU Component Connector FCN-074B / 078B series
(DDR4 DIMM)
■
•
Dimensions
Press fit type FCN-074B288-G/0P
Memory module conforms to JEDEC MO-309)
25
No. 145
Z
Z
No. 1
(145: ejector, in closed state)
minimum 128.6 (*)
5.575
Polarity key center line
7
No. 288
No. 144
Center line of (*)
21.3 max.
0.85
φ2.1±0.08
2.4±0.2
4.3
0.85×(77-1)=64.6±0.1
74.55
141
1.4±0.03
162 max.
0.85×(67-1)=56.1±0.1
2.2
5.4
6.5 max.
3.9 max.
3.65±0.05
5 min.
14.5 min.
21.3 max.
10 min.
Ejector in opened state
Z-Z
Applicable substrate
thickness (mm): 1.6 min.
Unit: mm
Dimensions in ( )
is reference value.
Ejector in opened state Maximum 162
•
Recommended printed circuIt board pattern (Top view)
A
64.6
No. 145
φ2.45±0.05
No. 221
No. 222
56.1
No. 288
No. 1
No. 77
No. 78
No. 144
5.95
0.85
1.6
2.2
288 -φ0.9±0.05 PAD
288 -φ0.6±0.01 DRILL
288 -φ0.5±0.05 PTH
1.6
Detail A
Unit: mm
Dimensions in ( ) is reference value.
Page 4 of 6
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Data Sheet
FUJITSU Component Connector FCN-074B / 078B series
(DDR4 DIMM)
■
Recommended soldering conditions (surface mount type)
Infrared reflow (IRS) conditions
Peak temperature 260°C max.
•
•
rc
ai
The temperature profile indicates a temperature indicated on the
printed circuit board surface.
Set the metal mask thickness of the solder paste to 120µm.
t
Na
220°C
al
ur
l
oo
4°C/sec. max.
g
in
or
4°
C/
m
c.
se
4°C/sec. max.
ax
.
255 to 260°C
Actual heating
10 sec. max.
160 to 170°C
Pre-heating
220°C min.
40 sec. min.
■
Reference: Recommended memory module terminal shape (applicable to both surface mount/through hole/press fit)
Variation A
Variation B
18.75±0.15
Component area
(front face)
31.25±0.15
0.5
5.575
B
2.5 min
2.1
1.45 min
8
11
14.6
17.6
C
5.575
Component area
(front face)
2.8 min
2.1
1.45 min
0.5
28.05
(11.05)
25.5
64.6
5.95
22.95
(11.05)
22.1
56.1
1.4±0.1
28.05
(11.05)
25.5
64.6
5.95
22.95
(11.05)
22.1
56.1
0.5
1.4±0.1
(3.35)
133.35±0.15
133.35±0.15
64.6
5.95
56.1
(3.35)
64.6
5.95
56.1
4.3
2.6
3.85±0.1
3.85±0.1
1.5±0.1
1.5±0.1
2.6
Component area
(rear face)
Component area
(rear face)
4.3
(For details see JEDEC MO-309)
PAGOS is a trademark of Fujitsu Component Limited
Dimensions in ( )
is reference value.
Page 5 of 6
http://us.fujitsu.com/connectors
8
11
14.6
0.5
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