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55755-201LF

Description
Board to Board & Mezzanine Connectors MEG ARRAY
CategoryThe connector   
File Size93KB,2 Pages
ManufacturerFCI / Amphenol
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55755-201LF Overview

Board to Board & Mezzanine Connectors MEG ARRAY

55755-201LF Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerFCI / Amphenol
Product CategoryBoard to Board & Mezzanine Connectors
ProductReceptacles
Number of Positions240 Position
Current Rating450 mA
Voltage Rating200 V
PackagingCut Tape
PackagingReel
Contact PlatingGold
Housing MaterialLiquid Crystal Polymer (LCP)
Contact MaterialCopper Alloy
Insulation Resistance1000 MOhms
Maximum Operating Temperature+ 85 C
Minimum Operating Temperature- 40 C
Stack Height6 mm
Factory Pack Quantity200
PDS: Rev :H
STATUS:Released
Printed: May 24, 2013

55755-201LF Related Products

55755-201LF 55755-191LF 55755-101LF 55755-001LF 55755-191
Description Board to Board & Mezzanine Connectors MEG ARRAY Board to Board & Mezzanine Connectors 240P RCPT 6MM W/CAP Board to Board & Mezzanine Connectors 200 POS RECEPTACLE .76 GOLD Board to Board & Mezzanine Connectors 200 POS RECEPTACLE .38 GOLD Board to Board & Mezzanine Connectors 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
Product Attribute Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value
Manufacturer FCI / Amphenol FCI / Amphenol FCI / Amphenol FCI / Amphenol FCI / Amphenol
Product Category Board to Board & Mezzanine Connectors Board to Board & Mezzanine Connectors Board to Board & Mezzanine Connectors Board to Board & Mezzanine Connectors Board to Board & Mezzanine Connectors
Factory Pack Quantity 200 200 200 200 200
Product Receptacles - Receptacles Receptacles -
Number of Positions 240 Position - 240 Position 240 Position -
Current Rating 450 mA - 450 mA 450 mA -
Voltage Rating 200 V - 200 V 200 V -
Packaging Reel Reel Reel Reel Reel
Contact Plating Gold - Gold Gold -
Housing Material Liquid Crystal Polymer (LCP) - Liquid Crystal Polymer (LCP) Liquid Crystal Polymer (LCP) -
Contact Material Copper Alloy - Copper Alloy Copper Alloy -
Insulation Resistance 1000 MOhms - 1000 MOhms 1000 MOhms -
Maximum Operating Temperature + 85 C - + 85 C + 85 C -
Minimum Operating Temperature - 40 C - - 40 C - 40 C -
Stack Height 6 mm - 6 mm 6 mm -
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