|
DAC102S085CIMMX |
DAC102S085CISDX |
DAC102S085CISD |
DAC102S085CIMM |
DAC102S085EB |
| Description |
Digital to Analog Converters - DAC 10-Bit Micro Power DUAL Digital-to-Analog Converter with Rail-to-Rail Output 10-VSSOP -40 to 105 |
Digital to Analog Converters - DAC 10-Bit Micro Power DUAL Digital-to-Analog Converter with Rail-to-Rail Output 10-WSON -40 to 105 |
Digital to Analog Converters - DAC 10-Bit Micro Power DUAL Digital-to-Analog Converter with Rail-to-Rail Output 10-WSON -40 to 105 |
Digital to Analog Converters - DAC 10-Bit Micro Power DUAL Digital-to-Analog Converter with Rail-to-Rail Output 10-VSSOP -40 to 105 |
BOARD EVALUATION DAC102S085 |
| Number of digits |
10 |
10 |
10 |
10 |
10 |
| Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
- |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
- |
| Parts packaging code |
MSOP |
SON |
SOIC |
MSOP |
- |
| package instruction |
TSSOP, TSSOP10,.19,20 |
HVSON, SOLCC10,.11,20 |
HVSON, SOLCC10,.11,20 |
TSSOP, TSSOP10,.19,20 |
- |
| Contacts |
10 |
10 |
10 |
10 |
- |
| Reach Compliance Code |
_compli |
_compli |
_compli |
_compli |
- |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
- |
| Maximum analog output voltage |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
- |
| Converter type |
D/A CONVERTER |
D/A CONVERTER |
D/A CONVERTER |
D/A CONVERTER |
- |
| Enter bit code |
BINARY |
BINARY |
BINARY |
BINARY |
- |
| Input format |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
- |
| JESD-30 code |
S-PDSO-G10 |
S-PDSO-N10 |
S-PDSO-N10 |
S-PDSO-G10 |
- |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
- |
| length |
3 mm |
3 mm |
3 mm |
3 mm |
- |
| Maximum linear error (EL) |
0.1953% |
0.1953% |
0.1953% |
0.1953% |
- |
| Humidity sensitivity level |
1 |
1 |
1 |
1 |
- |
| Number of functions |
1 |
1 |
1 |
1 |
- |
| Number of terminals |
10 |
10 |
10 |
10 |
- |
| Maximum operating temperature |
105 °C |
105 °C |
105 °C |
105 °C |
- |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
- |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
| encapsulated code |
TSSOP |
HVSON |
HVSON |
TSSOP |
- |
| Encapsulate equivalent code |
TSSOP10,.19,20 |
SOLCC10,.11,20 |
SOLCC10,.11,20 |
TSSOP10,.19,20 |
- |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
- |
| Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
- |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
- |
| power supply |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
- |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
| Maximum seat height |
1.09 mm |
0.8 mm |
0.8 mm |
1.09 mm |
- |
| Maximum stabilization time |
6 µs |
6 µs |
6 µs |
6 µs |
- |
| Nominal settling time (tstl) |
4.5 µs |
4.5 µs |
4.5 µs |
4.5 µs |
- |
| Maximum slew rate |
0.41 mA |
0.41 mA |
0.41 mA |
0.41 mA |
- |
| Nominal supply voltage |
3 V |
3 V |
3 V |
3 V |
- |
| surface mount |
YES |
YES |
YES |
YES |
- |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
- |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
- |
| Terminal form |
GULL WING |
NO LEAD |
NO LEAD |
GULL WING |
- |
| Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
- |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
- |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| width |
3 mm |
3 mm |
3 mm |
3 mm |
- |
| Base Number Matches |
1 |
1 |
1 |
1 |
- |