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PWR5322W3300FE

Description
Wirewound Resistors - SMD RESISTOR, FIXED, POWER
CategoryPassive components    The resistor   
File Size382KB,2 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Environmental Compliance
Download Datasheet Parametric View All

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PWR5322W3300FE Overview

Wirewound Resistors - SMD RESISTOR, FIXED, POWER

PWR5322W3300FE Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerBourns
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time16 weeks
structureRectangular
JESD-609 codee3
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height5.65 mm
Package length13.5 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width5.5 mm
method of packingTR, 13 INCH
Rated power dissipation(P)3 W
Rated temperature75 °C
resistance330 Ω
Resistor typeFIXED RESISTOR
size code5322
surface mountYES
technologyWIRE WOUND
Temperature Coefficient20 ppm/°C
Terminal surfaceMatte Tin (Sn)
Terminal shapeWRAPAROUND
Tolerance1%
PL
IA
N
T
Features
n
Power ratings from 0.5 - 3 watts
n
Large terminals and optimized body shape
Applications
n
Telecommunications
n
Audio equipment
n
Medical equipment
n
Base stations
n
Industrial equipment
*R
oH
S
C
OM
LE
AD
F
RE
E
for power dissipation
n
Excellent surge capabilities
n
Low TCR
n
Non-inductive versions available
n
RoHS compliant*
PWR2010/3014/4318/5322
-
Surface Mount Wirewound Resistors
General Information
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
The PWR2010/3014/4318/5322 Series surface mount wirewound resistors boast a high power density and excellent pulse power
characteristics. They can be used in a wide range of applications where surge voltages or inrush currents are present.
Electrical Characteristics
Parameter
Power
Resistance Range
1 % Based on E24+E96 Series
5 % Based on E24 Series
Resistance Range
(Non-inductive Versions)
Based on E24 Series
Tolerance
Temperature Coefficient
0.1 - 0.99
Ω
1.0 - 10
Ω
>10
Ω
Operating Temperature
Maximum Voltage
PWR2010
0.5 W
0.005
Ω
- 1.2K
Ω
0.1
Ω
- 200
Ω
PWR3014
1.0 W
0.005
Ω
- 5K
Ω
0.1
Ω
- 1K
Ω
PWR4318
2.0 W
0.005
Ω
- 12K
Ω
0.1
Ω
- 2.4K
Ω
PWR5322
3.0 W
0.01
Ω
- 20K
Ω
0.1
Ω
- 4K
Ω
0.5 % / 1 % / 5 %
±90 PPM/˚C
±50 PPM/˚C
±20 PPM/˚C
-55 ˚ to 155 ˚C
√P*R
Environmental Characteristics
Test
Thermal Shock
Short Time Overload
Solderability
Resistance to Solder Heat
Description
-55 +0 °C/-3 °C to 150 °C +3 °C/-0 °C, 5 cycles,
with minimum 15 minutes at each cycle
Specification
ΔR
±(2.0 % +0.05
Ω)
ΔR
±(0.5 % +0.05
Ω)
90 % of contact covered in solder
ΔR
±(0.5 % +0.05
Ω)
Pass
>1000 GΩ
ΔR
±(2.0 % +0.05
Ω)
ΔR
±(2.0 % +0.05
Ω)
ΔR
±(2.0 % +0.05
Ω)
Dielectric Strength
Insulation Resistance
High Temperature Exposure
Low Temperature Exposure
Load Life
Five times rated power for 5 seconds
Immersion in solder 260 °C ±5 ˚C for 5 ±0.5 seconds
Immersion in solder 260 °C ±5 ˚C for 5 ±0.5 seconds
Test voltage >500 Vrms for greater than 1 minute
Test voltage greater than 500 Vrms for one minute
Ambient temperature of 175 °C +5 ˚C/-0 ˚C for 250 ±8 hours
Ambient Temperature of -65C ±2C for 24 hours ±4 hours
Rated continuous voltage for 1000 hours (1 hour on and 0.5 hours
off) at a test temperature of 70°C ±2 °C
150
Environmental Characteristics
(Cont’d)
125
Temperature Rise (°C)
Power Derating Curve
120
100
Temperature Rise
150
125
Temperature Rise (°C)
100
75
50
25
0
0
0.5
1
POWER (W)
2
3
Moisture Sensitivity Level .....................1
ESD Classification (HBM) .................N/A
100
Power (%)
75
80
60
40
20
0
0
50
75
100
125
150
175
200
Physical Characteristics
50
Body Material....................... Epoxy resin
25
Lead Frame .... 100 % Sn Plated Copper
0
Flammability ....... Conforms to UL 94V-0
0
0.5
1
2
3
POWER (W)
Ambient Temperature (°C)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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