SILICON, STABISTOR DIODE, DO-35
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DO-41 |
| package instruction | O-PALF-W2 |
| Contacts | 2 |
| Reach Compliance Code | _compli |
| ECCN code | EAR99 |
| Shell connection | ISOLATED |
| Configuration | SINGLE |
| Diode component materials | SILICON |
| Diode type | STABISTOR DIODE |
| Maximum forward voltage (VF) | 0.71 V |
| Minimum forward voltage (VF) | 0.63 V |
| JEDEC-95 code | DO-41 |
| JESD-30 code | O-PALF-W2 |
| JESD-609 code | e0 |
| Number of components | 1 |
| Number of terminals | 2 |
| Package body material | PLASTIC/EPOXY |
| Package shape | ROUND |
| Package form | LONG FORM |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| surface mount | NO |
| Terminal surface | TIN LEAD |
| Terminal form | WIRE |
| Terminal location | AXIAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |

| CMZ2360 | 1N816 | C1N4156 | CMPD200 | CMPD300 | CSTB568 | CN4156 | CN4157 | CN5179 | CMZ2361 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | SILICON, STABISTOR DIODE, DO-35 | SILICON, STABISTOR DIODE, DO-35 | SILICON, STABISTOR DIODE, DO-35 | SILICON, STABISTOR DIODE, DO-35 | SILICON, STABISTOR DIODE, DO-35 | SILICON, STABISTOR DIODE, DO-35 | SILICON, STABISTOR DIODE, DO-35 | SILICON, STABISTOR DIODE, DO-35 | SILICON, STABISTOR DIODE, DO-35 | SILICON, STABISTOR DIODE, DO-35 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DO-41 | DO-35 | DO-35 | DO-35 | DO-35 | DO-35 | DO-35 | DO-35 | DO-35 | DO-35 |
| package instruction | O-PALF-W2 | O-PALF-W2 | O-PALF-W2 | DO-35, 2 PIN | O-XALF-W2 | DO-35, 2 PIN | PLASTIC PACKAGE-2 | PLASTIC PACKAGE-2 | PLASTIC PACKAGE-2 | O-PALF-W2 |
| Contacts | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Reach Compliance Code | _compli | not_compliant | _compli | unknow | _compli | _compli | unknow | unknow | unknow | compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Shell connection | ISOLATED | ISOLATED | - | - | ISOLATED | ISOLATED | - | ISOLATED | ISOLATED | - |
| Configuration | SINGLE | SINGLE | - | - | SINGLE | SINGLE | - | SINGLE | SINGLE | - |
| Diode component materials | SILICON | SILICON | - | - | SILICON | SILICON | - | SILICON | SILICON | - |
| Diode type | STABISTOR DIODE | STABISTOR DIODE | - | - | STABISTOR DIODE | STABISTOR DIODE | - | STABISTOR DIODE | STABISTOR DIODE | - |
| Maximum forward voltage (VF) | 0.71 V | 0.7 V | - | - | 2.65 V | 2.31 V | - | 2.66 V | 3.7 V | - |
| Minimum forward voltage (VF) | 0.63 V | 0.58 V | - | 1.6 V | 2.4 V | 2.09 V | - | 2.36 V | 3 V | - |
| JEDEC-95 code | DO-41 | DO-35 | - | - | DO-35 | DO-35 | - | DO-35 | DO-35 | - |
| JESD-30 code | O-PALF-W2 | O-PALF-W2 | - | - | O-XALF-W2 | O-PALF-W2 | - | O-PALF-W2 | O-PALF-W2 | - |
| JESD-609 code | e0 | e0 | - | e0 | e0 | e0 | - | e0 | e0 | - |
| Number of components | 1 | 1 | - | - | 1 | 1 | - | 1 | 1 | - |
| Number of terminals | 2 | 2 | - | - | 2 | 2 | - | 2 | 2 | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | UNSPECIFIED | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| Package shape | ROUND | ROUND | - | - | ROUND | ROUND | - | ROUND | ROUND | - |
| Package form | LONG FORM | LONG FORM | - | - | LONG FORM | LONG FORM | - | LONG FORM | LONG FORM | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - |
| surface mount | NO | NO | - | - | NO | NO | - | NO | NO | - |
| Terminal surface | TIN LEAD | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | WIRE | WIRE | - | - | WIRE | WIRE | - | WIRE | WIRE | - |
| Terminal location | AXIAL | AXIAL | - | - | AXIAL | AXIAL | - | AXIAL | AXIAL | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| Base Number Matches | 1 | 1 | 1 | - | 1 | 1 | - | - | - | 1 |
| Maker | - | Central Semiconductor | - | Central Semiconductor | - | - | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor |