EEWORLDEEWORLDEEWORLD

Part Number

Search

GWCR2512-2R26FT4

Description
Thick Film Resistors - SMD
CategoryPassive components   
File Size397KB,2 Pages
ManufacturerTT Electronics
Download Datasheet Parametric View All

GWCR2512-2R26FT4 Overview

Thick Film Resistors - SMD

GWCR2512-2R26FT4 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics
Product CategoryThick Film Resistors - SMD
TechnologyThick Film
Mounting StylePCB Mount
Resistors
Green Thick-Film Chip Resistors
GWCR Series
Completely free of Pb and its compounds
RoHS compliant without exemption
Sizes 01005 to 2512
Values 1R0 to 10M
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
Electrical Data
01005
Power rating @ 70°C
Resistance range
Limiting element voltage
TCR
Resistance tolerance
Standard values
Ambient temperature range
Dielectric withstand
Insulation resistance
Zero-ohm jumper chip rating
Zero-ohm resistance
°C
volts
ohms
amps
milliohms
N/A
N/A
0.5
1
<50
100
watts
ohms
volts
0.031
10R-1M0
15
25
1R0 – 10R: ±400,
>10R: ±200
50
75
0201
0.05
0402
0.063
0603
0.1
0805
0.125
150
1206
0.25
1210
0.5
200
1812
2010
2512
1
250
0.75
1R0 – 10M
10R: ±600,
ppm/°C 10R2 - 100R: ±400,
>100R: ±250
%
1R0 – 10R: ±400, 10R2 - 100R: ±200, >100R: ±100
±1
E24 or E96
-55 to 155
300
≥1G0
2
500
Physical Data
Dimensions (mm) and Weight (mg)
L
W
01005
0.40 ± 0.02
0.2 ± 0.02
0201
0.6 ± 0.03
0.30 ± 0.03
0402
1.00 ± 0.10
0.50 ± 0.05
0603
1.60 ± 0.10
0.80 ± 0.10
0805
2.00 ± 0.15
1.25 ± 0.15
1206
3.10 ± 0.15
1.55 ± 0.15
1210
3.10 ± 0.15
2.60 ± 0.20
1812
4.50 ± 0.20
3.20 ± 0.20
2010
5.00 ± 0.10
2.50 ± 0.10
2515
6.35 ± 0.10
3.20 ± 0.10
T
0.13 ± 0.05
0.23 ± 0.05
0.35 ± 0.05
0.45 ± 0.10
0.55 ± 0.10
0.55 ± 0.10
0.55 ± 0.10
0.55 ± 0.10
0.55 ± 0.10
0.55 ± 0.10
C
0.10 ± 0.05
0.10 ± 0.05
0.20 ± 0.10
0.30 ± 0.20
0.40 ± 0.20
0.45 ± 0.20
0.50 ± 0.20
0.50 ± 0.20
0.60 ± 0.25
0.60 ± 0.25
A
0.10 ± 0.03
0.15 ± 0.05
0.25 ± 0.10
0.30 ± 0.20
0.40 ± 0.20
0.45 ± 0.20
0.50 ± 0.20
0.50 ± 0.20
0.50 ± 0.20
0.50 ± 0.20
Wt (nom.)
0.2
0.3
0.5
2.2
4.7
8.5
17.2
29.5
24.8
34.3
C
T
A
L
A
W
Wrap-around terminations
(3 faces)
Construction
The chips have a high alumina substrate (96% minimum) with a
ruthenium oxide resistance element and silver palladium, nickel and tin
plated terminations. A glazed protection coat is applied to the resistive
element (see fig1)
Terminations
Solderability
Strength
The terminations meet the requirements of IEC 115-1, Clause 4.17.3.2
The terminations meet requirements of IEC 68.2.21
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
© TT Electronics plc
04.17
Gaofen asks about the use of 2D graphics acceleration chips under Wince
The software runs under Wince system, and there are a lot of drawing work, mainly GDI drawing, but now the system CPU occupies too much space, and I hope to use a dedicated graphics acceleration chip ...
wy123wy123 Embedded System
NB-IoT Development History
When promoting M2M services (IoT applications), operators found that the business needs of enterprises for M2M are different from those of individual users.Enterprises hope to build a centralized info...
Jacktang RF/Wirelessly
EEWORLD University Hall----Tesla electric truck debuts: range up to 800 kilometers
Tesla electric truck debuts: range up to 800 kilometers : https://training.eeworld.com.cn/course/4293Since April this year, Musk has been announcing the release date of the truck, but after three dela...
抛砖引玉 Automotive Electronics
[RVB2601 Creative Application Development] + Summary of development experience
[i=s]This post was last edited by symic on 2022-5-12 22:25[/i]As a novice in Pingtou Ge development, I am still in the stage of exploring Jianchi CDK and AOS operating system. Through learning during ...
symic XuanTie RISC-V Activity Zone
【MSP430 Sharing】Embedded USB Reader/Writer Interface Technology and System Design
Embedded USB Reader/Writer Interface Technology and System Design [[i] This post was last edited by Xinhai Baby on 2011-10-12 09:09 [/i]]...
鑫海宝贝 Microcontroller MCU
Ended: The 2nd Infineon Silicon Carbide Application Technology Development Forum
Live Topic: The Second Infineon Silicon Carbide Application Technology Development ForumLive Time: 8:30-16:30, April 17, 2019Live Content:With the rapid development of the times, in the face of growin...
EEWORLD社区 Power technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2908  1834  1262  1613  1304  59  37  26  33  27 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号