SOT-86 packages. A SOT-89 version is also available as
the EC1019B. All devices are 100% RF and DC tested.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the EC1019Cwill work for other various applications
within the DC to 6 GHz frequency range such as CATV
and fixed wireless.
Functional Diagram
GND
4
RF In
1
RF Out
3
2
x
Internally matched to 50
:
GND
EC1019C
GND
4
Applications
x
x
x
x
x
x
Mobile Infrastructure
CATV / DBS
W-LAN / ISM
RFID
Defense / Homeland Security
Fixed Wireless
RF In
1
RF Out
3
2
GND
EC1019C-G
Specifications
(1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
(2)
Noise Figure
Device Voltage
Device Current
Typical Performance
(3)
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
Min
DC
15
Typ
2000
17
19
12
+19
+31
3.0
4.7
70
Max
6000
19
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3
(2)
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
500
20.5
-26.9
-24.4
+19
+34
2.9
Typical
900
19.7
-25.5
-17.2
+19
+34
2.9
1900
17.2
-19.9
-11.3
+19.5
+31
3.0
¡
14.5
2140
16.7
-15.4
-12.2
+19
+31
3.0
System.
¡
4.2
5.2
¡
¡
3. Test conditions: T = 25º C, Supply Voltage = +6 V, Device Voltage = +4.7V, R
bias
= 16.5 , 50
1. Test conditions unless otherwise noted: 25 ºC, Supply Voltage = +6V, Rbias = 16.5 , 50 system.
2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
Device Current
RF Input Power (continuous)
Junction Temperature
-40 to +85
qC
-55 to +150
qC
130 mA
+12 dBm
+250
qC
Ordering Information
Part No.
EC1019C*
EC1019C-G
EC1019C-PCB
Rating
Description
(lead-tin SOT-86 Pkg)
InGaP HBT Gain Block
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-86 Pkg)
Operation of this device above any of these parameters may cause permanent damage.
* This package is being phased out in favor of the green package type which is backward compatible for
existing designs.
Specifications and information are subject to change without notice
700 – 2400 MHz Fully Assembled Eval. Board
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 1 of 5
January 2006
EC1019C
InGaP HBT Gain Block
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
MHz
dB
dB
dB
dBm
dBm
dB
100
21.0
-32.0
-23
+19.4
+33
3.3
500
20.5
-26.9
-24.4
+19.4
+33.2
2.9
¡
The Communications Edge
TM
Product Information
Typical Device RF Performance
Supply Bias = +6 V, R
bias
= 15
:,
I
cc
= 70 mA
900
19.7
-25.5
-17.2
+19.4
+33.6
2.9
1900
17.2
-19.9
-11.3
+19.5
+31
3.0
¡
2140
16.7
-15.4
-12.2
+19.0
+31
3.0
2400
16.2
-12.7
-13.8
+18.8
+30.7
3.1
3500
13.8
-12.0
-12.2
+16.2
5800
10.7
-9.9
-11.3
1. Test conditions: T = 25º C, Supply Voltage = +6 V, Device Voltage = 4.7 V, Rbias = 16.5 , Icc = 70 mA typical, 50 System.
2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
S v F qec
21 s. re u n y
2
5
S11,S22 (dB)
0
-5
S11, S22 vs. Frequency
160
120
Icc vs. Vde
2
0
S21 (dB)
1
5
1
0
5
0
0
1
2
3
F q e c (G z)
re u n y H
OIP3 vs. Frequency
40
35
-15
-20
-25
-30
S11
Icc (mA)
-10
S22
80
40
25°
C
0
4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0
+ °
25 C
4
5
6
0
1
2
3
4
5
6
Frequency (GHz)
Noise Figure vs. Frequency
Vde (V)
P1dB vs. Frequency
24
5
4
3
2
1
25°
C
1000
1500
85°
C
2000
-40°
C
2500
3000
OIP3 (dBm)
30
25
20
500
0
0
500
1000
1500
2000
Frequency (MHz)
NF
P1dB (dBm)
NF (dB)
20
16
25°
C
1000
85°
C
-40°
C
2500
3000
2500
Frequency (MHz)
12
500
1500
2000
Frequency (MHz)
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 2 of 5
January 2006
EC1019C
InGaP HBT Gain Block
Vcc
Icc = 70 mA
The Communications Edge
TM
Product Information
Recommended Application Circuit
R4
Bias
Resistor
C4
Bypass
Capacitor
C3
0.018 µF
L1
RF Choke
RF IN
EC1019C
C1
Blocking
Capacitor
C2
Blocking
Capacitor
RF OUT
Reference
Designator
L1
C1, C2, C4
50
820 nH
.018 µF
Recommended Component Values
Frequency (MHz)
500
900
1900
2200
220 nH
68 nH
27 nH
22 nH
1000 pF
100 pF
68 pF
68 pF
Recommended Bias Resistor Values
2500
18 nH
56 pF
3500
15 nH
39 pF
Supply
Voltage
6V
7V
8V
9V
10 V
12 V
R1 value
16.4 ohms
30.7 ohms
45 ohms
59 ohms
74 ohms
102 ohms
Size
0805
1210
1210
2010
2010
2512
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig.
L1
C1, C2
C3
C4
R4
Value / Type
39 nH wirewound inductor
56 pF chip capacitor
0.018
PF
chip capacitor
Do Not Place
15
:
1% tolerance
Size
0603
0603
0603
0805
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +6 V. A
1% tolerance resistor is recommended.
S-Parameters (V
device
= +4.7, I
CC
= 70 mA, T = 25 C, calibrated to device leads)
Freq (MHz)
S11 (dB)
S11 (ang)
Typical Device S-Parameters
¢
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
-24.85
-27.17
-23.41
-19.49
-16.60
-11.88
-12.89
-11.92
-8.69
-8.09
-10.55
-11.17
-9.71
-7.98
-60.24
-46.18
-28.53
-74.75
-105.49
-134.51
-151.23
-134.38
-135.74
-168.37
156.03
159.92
20.43
20.09
19.25
18.19
17.15
16.21
15.41
14.26
13.03
12.56
12.38
11.61
10.74
176.75
153.21
129.05
107.82
89.07
71.51
55.02
39.14
27.44
15.99
-0.44
-16.12
-27.95
-22.76
-22.63
-22.38
-22.09
-21.57
-20.87
-20.02
-19.68
-19.34
-18.43
-17.23
-16.81
-16.53
0.42
1.05
1.04
0.58
0.00
-2.16
-6.13
-10.34
-12.21
-14.58
-23.37
-32.14
-37.03
-19.95
-24.50
-18.46
-12.87
-12.94
-15.63
-21.87
-13.98
-10.61
-11.00
-18.32
-13.00
-9.89
-3.26
-34.64
-90.44
-100.14
-95.63
-78.47
-147.92
-165.49
-125.29
-108.79
-156.08
142.07
159.16
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 3 of 5
January 2006
EC1019C
InGaP HBT Gain Block
The Communications Edge
TM
Product Information
EC1019C (SOT-86 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The component will be marked with a two-
digit numeric lot code (shown as “xx”)
followed by an “A” designator on the top
surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
¢
Land Pattern
MSL Rating: Level 1 at +235 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device.
Vias should use
a .35mm (#80 / .0135” ) diameter drill and have a
final plated thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC
board in the region where the board contacts the
heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles
are in degrees.
Specifications and information are subject to change without notice
£
£
£
£
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 4 of 5
January 2006
EC1019C
InGaP HBT Gain Block
The Communications Edge
TM
Product Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded
(maximum 245qC reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper.
EC1019C-G (Green / Lead-free Sot-86 Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with a two-
digit numeric lot code (shown as “ XX” )
followed by a “ B” designator on the top
surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
¢
MSL Rating: Level 3 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135” )
diameter drill and have a final plated thru diameter of .25 mm
(.010” ).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
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