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EMIF03-SIM02F1

Description
3 FUNCTIONS, DATA LINE FILTER
CategoryPassive components   
File Size107KB,7 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric View All

EMIF03-SIM02F1 Overview

3 FUNCTIONS, DATA LINE FILTER

EMIF03-SIM02F1 Parametric

Parameter NameAttribute value
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Number of functions3
Processing package descriptionLEAD FREE, FLIP CHIP-8
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
Installation typeSURFACE MOUNT
terminal coatingNOT SPECIFIED
DimensionsL1.42XB1.42XH0.65 (mm)/L0.056XB0.056XH0.026 (inch)
Manufacturer Series
capacitance20 pF
filter typeDATA LINE FILTER
®
EMIF03-SIM02F2
3 LINE EMI FILTER
INCLUDING ESD PROTECTION
IPAD™
MAIN PRODUCT APPLICATIONS:
EMI filtering and ESD protection for:
SIM Interface (Subscriber Identify Module)
UIM Interface (Universal Identify Module)
DESCRIPTION
The EMIF03-SIM02F2 is a highly integrated
device designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic interfer-
ence. The EMIF03 flip chip packaging means the
package size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents the device from destruction when
subjected to ESD surges up 15kV.
BENEFITS
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Lead free package
Very low PCB space consuming:
1.42mm x 1.42mm
Very thin package: 0.65 mm
High efficiency in ESD suppression
High reliability offered by monolithic integration
High reducing of parasitic elements through
integration & wafer level packaging.
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4 on external & V
cc
pins:
15kV(air discharge)
8kV (contact discharge)
Level 1 on internal pins: 2kV (air discharge)
2kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3
Figure 2: Configuration
V
CC
100
RST in
R1
47
CLK in
R2
100
Data in
R3
Data ext
CLK ext
RST ext
Flip-Chip
(8 Bumps)
Table 1: Order Code
Part Number
EMIF03-SIM02F2
Marking
GJ
Figure 1: Pin Configuration (Ball side)
3
RST
in
2
RST
ext
1
A
CLK
ext
CLK
in
Gnd
B
C
Data
in
V
CC
Data
ext
Cline = 20pF max.
GND
TM:
IPAD is a trademark of STMicroelectronics.
September 2005
REV. 5
1/7
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