M25P128 datasheet, PDF - EEWORLD Datasheet

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M25P128: Description16M X 8 FLASH 2.7V PROM, PDSO16; Categorystorage; File Size211KB，41 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M25P128 Overview

16M X 8 FLASH 2.7V PROM, PDSO16

M25P128 Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	3.6 V
Minimum supply/operating voltage	2.7 V
Rated supply voltage	3 V
maximum clock frequency	50 MHz
Processing package description	0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-16
state	TRANSFERRED
packaging shape	Rectangle
Package Size	SMALL OUTLINE
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	1.27 mm
terminal coating	MATTE Tin/Nickel Palladium
Terminal location	pair
Packaging Materials	Plastic/Epoxy
Temperature level	INDUSTRIAL
memory width	8
organize	16M × 8
storage density	1.34E8 deg
operating mode	Synchronize
Number of digits	1.68E7 words
Number of digits	16M
Memory IC type	FLASH 2.7V programmable read-only memory
serial parallel	serial

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M25P128

128 Mbit (Multilevel), Low Voltage, Serial Flash Memory

With 50MHz SPI Bus Interface

PRELIMINARY DATA

Feature summary

■

128 Mbit of Flash Memory

Page Program (up to 256 Bytes) in 2.5ms

(typical)

Sector Erase (2Mbit)

Bulk Erase (128Mbit)

2.7 to 3.6V Single Supply Voltage

SPI Bus Compatible Serial Interface

50MHz Clock Rate (maximum)

Electronic Signature

– JEDEC Standard Two-Byte Signature

(2018h)

More than 10000 Erase/Program Cycles per

Sector

More than 20-Year Data Retention

Packages

– ECOPACK® (RoHS compliant)

SO16 (MF)

300 mils width

VDFPN8 (ME)

8x6mm (MLP8)

■

January 2006

Rev. 1

1/41

www.st.com

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to

change without notice.

Contents

M25P128

Contents

Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

2.5

2.6

Serial data output (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial data input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial clock (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Hold (HOLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Write Protect (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

SPI modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Operating features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

4.1

4.2

4.3

4.4

4.5

4.6

4.7

Page programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Sector Erase and Bulk Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Polling during a write, program or erase cycle . . . . . . . . . . . . . . . . . . . . . 10

Active power and standby power modes . . . . . . . . . . . . . . . . . . . . . . . . . 10

Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Protection modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Hold condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.1

6.2

6.3

6.4

Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Write Disable (WRDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Read Identification (RDID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Read Status Register (RDSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

6.4.1

6.4.2

6.4.3

6.4.4

WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

BP2, BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

SRWD bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

6.5

2/41

Write Status Register (WRSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Rev. 1

List of tables

M25P128

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Protected Area Sizes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Read Identification (RDID) Data-Out Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Status Register Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Protection Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Power-Up Timing and VWI Threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

VDFPN8 (MLP8), 8-lead Very thin Dual Flat Package No lead, 8x6mm,

Package Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

SO16 wide – 16 lead Plastic Small Outline, 300 mils body width . . . . . . . . . . . . . . . . . . . . 38

Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

4/41

Rev. 1

M25P128

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Figure 19.

Figure 20.

Figure 21.

Figure 22.

Figure 23.

Figure 24.

Figure 25.

Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

VDFPN Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

SO Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Bus Master and Memory Devices on the SPI Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

SPI Modes Supported. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Hold Condition Activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Write Enable (WREN) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Write Disable (WRDI) Instruction Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Read Identification (RDID) Instruction Sequence and Data-Out Sequence . . . . . . . . . . . . 18

Read Status Register (RDSR) Instruction Sequence and Data-Out Sequence . . . . . . . . . 20

Write Status Register (WRSR) Instruction Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Read Data Bytes (READ) Instruction Sequence and Data-Out Sequence. . . . . . . . . . . . . 23

Read Data Bytes at Higher Speed (FAST_READ) Instruction and Data-Out Sequence . . 24

Page Program (PP) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Sector Erase (SE) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Bulk Erase (BE) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Power-up Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

AC Measurement I/O Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Serial Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Write Protect Setup and Hold Timing during WRSR when SRWD=1 . . . . . . . . . . . . . . . . . 35

Hold Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

VDFPN8 (MLP8), 8-lead Very thin Dual Flat Package No lead, 8x6mm, Package Outline 37

SO16 wide – 16 lead Plastic Small Outline, 300 mils body width . . . . . . . . . . . . . . . . . . . . 38

Rev. 1

5/41

M25P128 Related Products

	M25P128	M25P128-VME6P	M25P128-VMF6TG	M25P128-VME6TP	M25P128-VMF6G	M25P128-VME6TG	M25P128-VME6G
Description	16M X 8 FLASH 2.7V PROM, PDSO16	16M X 8 FLASH 2.7V PROM, PDSO16	16M X 8 FLASH 2.7V PROM, PDSO16	16M X 8 FLASH 2.7V PROM, PDSO16	16M X 8 FLASH 2.7V PROM, PDSO16	16M X 8 FLASH 2.7V PROM, PDSO8	16M X 8 FLASH 2.7V PROM, PDSO8
Number of functions	1	1	1	1	1	1	1
Number of terminals	16	8	16	8	16	8	8
Maximum operating temperature	85 Cel	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 Cel	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
surface mount	Yes	YES	YES	YES	YES	YES	YES
Terminal form	GULL WING	NO LEAD	GULL WING	NO LEAD	GULL WING	NO LEAD	NO LEAD
Terminal location	pair	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
memory width	8	8	8	8	8	8	8
organize	16M × 8	16MX8	16MX8	16MX8	16MX8	16MX8	16MX8
Is it Rohs certified?	-	conform to	conform to	conform to	conform to	conform to	conform to
Maker	-	STMicroelectronics	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	STMicroelectronics
Parts packaging code	-	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC
package instruction	-	8 X 6 MM, ROHS COMPLIANT, MLP-8	0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-16	8 X 6 MM, ROHS COMPLIANT, MLP-8	0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-16	8 X 6 MM, ROHS COMPLIANT, MLP-8	8 X 6 MM, ROHS COMPLIANT, MLP-8
Contacts	-	8	16	8	16	8	8
Reach Compliance Code	-	compli	compli	compli	compli	compli	compli
ECCN code	-	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Other features	-	MORE THAN 10000 ERASE/PROGRAM CYCLES MORE THAN 20-YEAR DATA RETENTION	MORE THAN 10000 ERASE/PROGRAM CYCLES MORE THAN 20-YEAR DATA RETENTION	MORE THAN 10000 ERASE/PROGRAM CYCLES MORE THAN 20-YEAR DATA RETENTION	MORE THAN 10000 ERASE/PROGRAM CYCLES MORE THAN 20-YEAR DATA RETENTION	MORE THAN 10000 ERASE/PROGRAM CYCLES MORE THAN 20-YEAR DATA RETENTION	MORE THAN 10000 ERASE/PROGRAM CYCLES MORE THAN 20-YEAR DATA RETENTION
Maximum clock frequency (fCLK)	-	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz
Data retention time - minimum	-	20	20	20	20	20	20
Durability	-	10000 Write/Erase Cycles	10000 Write/Erase Cycles	10000 Write/Erase Cycles	10000 Write/Erase Cycles	10000 Write/Erase Cycles	10000 Write/Erase Cycles
JESD-30 code	-	R-PDSO-N8	R-PDSO-G16	R-PDSO-N8	R-PDSO-G16	R-PDSO-N8	R-PDSO-N8
length	-	8 mm	10.3 mm	8 mm	10.3 mm	8 mm	8 mm
memory density	-	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi
Memory IC Type	-	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
word count	-	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
character code	-	16000000	16000000	16000000	16000000	16000000	16000000
Operating mode	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	VSON	SOP	VSON	SOP	VSON	VSON
Encapsulate equivalent code	-	SOLCC8,.3	SOP16,.4	SOLCC8,.3	SOP16,.4	SOLCC8,.3	SOLCC8,.3
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE
Parallel/Serial	-	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	260	NOT SPECIFIED	260	NOT SPECIFIED	NOT SPECIFIED
power supply	-	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Programming voltage	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	1 mm	2.65 mm	1 mm	2.65 mm	1 mm	1 mm
Serial bus type	-	SPI	SPI	SPI	SPI	SPI	SPI
Maximum standby current	-	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	-	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA
Maximum supply voltage (Vsup)	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	-	3 V	3 V	3 V	3 V	3 V	3 V
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal pitch	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Maximum time at peak reflow temperature	-	NOT SPECIFIED	30	NOT SPECIFIED	30	NOT SPECIFIED	NOT SPECIFIED
type	-	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	-	6 mm	7.5 mm	6 mm	7.5 mm	6 mm	6 mm
write protect	-	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE

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