IC,MICROPROCESSOR SLICE,LS-TTL,DIP,48PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP48,.6 |
| Reach Compliance Code | not_compliant |
| JESD-30 code | R-PDIP-T48 |
| Number of terminals | 48 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP48,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| uPs/uCs/peripheral integrated circuit type | BIT-SLICE MICROPROCESSOR |
| Base Number Matches | 1 |
| SN74LS481NP1 | SN74LS481JQP4 | SN74LS481JQ4 | SN74LS481JQ | SN74LS481N3 | SN74LS481NP3 | SN74LS481N1 | SN54LS481JQ | |
|---|---|---|---|---|---|---|---|---|
| Description | IC,MICROPROCESSOR SLICE,LS-TTL,DIP,48PIN,PLASTIC | IC,MICROPROCESSOR SLICE,LS-TTL,QUIP,48PIN,CERAMIC | IC,MICROPROCESSOR SLICE,LS-TTL,QUIP,48PIN,CERAMIC | IC,MICROPROCESSOR SLICE,LS-TTL,QUIP,48PIN,CERAMIC | IC,MICROPROCESSOR SLICE,LS-TTL,DIP,48PIN,PLASTIC | IC,MICROPROCESSOR SLICE,LS-TTL,DIP,48PIN,PLASTIC | IC,MICROPROCESSOR SLICE,LS-TTL,DIP,48PIN,PLASTIC | IC,MICROPROCESSOR SLICE,LS-TTL,QUIP,48PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP48,.6 | QIP, QUIP48A,.6/.8 | QIP, QUIP48A,.6/.8 | QIP, QUIP48A,.6/.8 | DIP, DIP48,.6 | DIP, DIP48,.6 | DIP, DIP48,.6 | QIP, QUIP48A,.6/.8 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 code | R-PDIP-T48 | R-XQIP-P48 | R-XQIP-P48 | R-XQIP-P48 | R-PDIP-T48 | R-PDIP-T48 | R-PDIP-T48 | R-XQIP-P48 |
| Number of terminals | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | QIP | QIP | QIP | DIP | DIP | DIP | QIP |
| Encapsulate equivalent code | DIP48,.6 | QUIP48A,.6/.8 | QUIP48A,.6/.8 | QUIP48A,.6/.8 | DIP48,.6 | DIP48,.6 | DIP48,.6 | QUIP48A,.6/.8 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal form | THROUGH-HOLE | PIN/PEG | PIN/PEG | PIN/PEG | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | PIN/PEG |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD |
| uPs/uCs/peripheral integrated circuit type | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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