*** Resistance value measured with ≤10 % rated current at 25 °C ambient.
**** Melting I
2
t calculated at 0.001 second pre-arcing time.
Reliability Testing
No.
1
2
3
4
5
6
7
8
9
Test
Reflow and bend
Solderability
Soldering heat
resistance
Moisture resistance
Salt spray
Mechanical vibration
Mechanical shock
Thermal Shock
Life
Requirement
Test Condition
DCR change ≤ 20 % (≤ 10 % for ≤1 A) 3 reflows at 245 °C followed by a
No mechanical damage
2 mm bend
Minimum 90 % coverage
One dip at 245 °C for 5 seconds
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Rated Current
(Amps)
0.50
0.63
0.80
1.00
1.25
1.60
2.00
*R
oH
S
C
OM
Open within
120 sec. at
200 % rated
current
LE
AD
Agency Recognition
UL File Number .................................................... E198545
http://www.ul.com/ Follow link to Online Certificates Directory,
then enter UL File No. E198545, or
click here
Asia-Pacific:
Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA:
Tel: +36 88 520 390 • Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and
Chlorine (Cl) content is 1500 ppm or less.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
H
SF-2410SPxxxW Series - Time Lag Wire Core Surface Mount Fuses
Fusing Time
Resistance
Rated
(Ω) Typ.***
Voltage
0.206
0.148
0.109
0.084
AC 250 V
0.065
0.049
0.038
Voltage Drop
Typical
2
Max. (mV)
I t (A
2
s) ****
166
0.11
144
0.20
139
0.35
AC 250 V 100 A
129
0.62
DC 125 V 50 A
128
1.00
127
1.80
123
3.00
Interrupting
Rating
Test Reference
Refer to STP
document
MIL-STD-202
Method 208
MIL-STD-202
Method 210
MIL-STD-202
Method 106
DCR change ≤ 20 % (≤ 10 % for ≤1 A)
One dip at 260 °C for 10 seconds
New solder coverage ≤ 75 %
DCR change ≤ ±15 %
No excessive corrosion
DCR change ≤ ±10 %
No excessive corrosion
10 cycles
48 hour exposure, 5 % salt solution
0.4 inch D.A. or 30 G between
5-3000 Hz
1500 G, 0.5 ms, half-sine shocks
100 cycles between -65 °C and +125 °C
DCR change ≤ ±10 %
No mechanical damage
DCR change ≤ ±10 %
No mechanical damage
DCR change ≤ ±10 %
No mechanical damage
No electrical “opens” during testing
Voltage drop change shall be less
than ±20 % of initial value
MIL-STD-202
Method 213
MIL-STD-202
Method 107
MIL-STD-202
Method 204
MIL-STD-202
Method 101
80 % rated current (75 % for < 1 A fuses) Refer to STP
for 2000 hours at ambient temperature document
+25 °C
SinglFuse
™
SF-2410SPxxxW Series Applications
n
White goods
n
Lighting ballasts
n
LED drivers
n
Medical equipment (excluding
critical life
n
Power chargers
n
Power adapters
n
Industrial equipment
support)
n
DC/DC converters
SF-2410SPxxxW Series - Time Lag Wire Core Surface Mount Fuses
Environmental Characteristics
Operating Temperature................................................................................................................................................................ -55 °C to +125 °C
Storage Conditions
Temperature .............................................................................................................................................................................. +5 °C to +35 °C
Humidity.........................................................................................................................................................................................40 % to 75 %
Shelf Life..........................................................................................................................................................2 years from manufacturing date
ESD Classification (HBM)............................................................................................................................................................................ Class 6
Typical Part Marking
Represents total content. Layout may
vary.
How to Order
SinglFuse™
Product Designator
SF - 2410 SP 100 W - 2
Construction
FR4 PCB
TERMINAL
Cu/Ni/Sn
S
RATED CURRENT (A)
C = 0.50
F = 1.25
S = 0.63
T = 1.60
H = 0.80
I = 2.00
E = 1.00
SMD Footprint
2410 = 6125 (EIA 2410) size
Fuse Blow Type
SP = Time Lag
Rated Current
050 ~ 200 (0.5 A ~ 2.0 A)
Structure Type
W = Wire Core
FUSE ELEMENT
(Cu or Cu alloy)
Packaging Type
- 2 = Tape & Reel
Packaging Quantity
2,000 pieces per 7-inch reel
Product Dimensions
6.10 ± 0.15
6.10 ± 0.15
(.240 ± .006)
(.240 ± .006)
Recommended Pad Layout
DIMENSIONS:
MM
(INCHES)
2.16 ± 0.20
2.16 ± 0.20
(.085 ± .008)
(.085 ± .008)
3.00
3.00
(.118)
(.118)
2.49 ± 0.15
2.49 ± 0.15
(.098 ± .006)
(.098 ± .006)
8.60
8.60
(.338)
(.338)
2.80
2.80
(.110)
(.110)
1.35 ± 0.38
1.35 ± 0.38
(.053 ± .015)
(.053 ± .015)
1.35 ± 0.38
1.35 ± 0.38
(.053 ± .015)
(.053 ± .015)
1.35 ± 0.38
1.35 ± 0.38
(.053 ± .015)
(.053 ± .015)
Current Rating Thermal Derating Curve
110
105
100
95
90
85
80
75
70
65
60
55
50
-55
DERATING (%)
-35
-15
5
25
45
65
85
105
125
MAXIMUM OPERATING TEMPERATURE (°C)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-2410SPxxxW Series - Time Lag Wire Core Surface Mount Fuses
Solder Reflow Recommendations
Profile Feature
Preheat / Soak:
Temperature Min. (T
smin
)
Temperature Max. (T
smax
)
Time (t
s
) from (T
smin
to T
smax
)
Ramp Up Rate (T
L
to T
p
)
Liquidous Temperature (T
L
)
Time (t
L
) maintained above T
L
Peak Package Body
Temperature (T
p
)
Pb-Free Assembly
150 °C
200 °C
60~120 seconds
3 °C / second max.
217 °C
60~150 seconds
260 °C
Tp
TP
T
MAX. RAMP UP RATE = 3 °C/s
MAX. RAMP DOWN RATE = 6 °C/s
L
Tsmax
PREHEAT AREA
UP RATE = 3 °C/s
MAX. RAMP
tp
tL
tp
Tc -5 °C
TC -5 °C
TEMPERATURE (°C)
MAX. RAMP DOWN RATE = 6 °C/s
PREHEAT AREA
ts
TL
Tsmin
Tsmax
tL
TEMPERATURE (°C)
Tsmin
25
Ts
TIME 25 °C TO PEAK
Time (t
p
)* within 5 °C of the
specified classification temperature 30 seconds*
(T
c
)
Ramp Down Rate (T
p
to T
L
)
Time 25 °C to Peak Temperature
25
TIME
TIME 25 °C TO PEAK
6 °C / second max.
8 minutes max.
TIME
260
Recommended Temperature Profile for Wave Soldering
10 sec. max.
* Tolerance for peak profile temperature (Tp ) is defined as a
supplier minimum and a user maximum.
TEMPERATURE (°C)
260
150
PREHEATING
10 sec. max.
Wave soldering is suitable for 2410 size models.
TEMPERATURE (°C)
150
PREHEATING
120 seconds
TIME
120 seconds
TIME
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-2410SPxxxW Series - Time Lag Wire Core Surface Mount Fuses
3312 - 2 mm SMD Trimming Potentiometer
Average Pre-Arcing Time vs. Current Curves
1.00
1.00 A
A
0.80
0.80 A
A
0.63
0.63 A
A
0.50
0.50 A
A
1.25
1.25 A
A
1.60
1.60 A
A
2.00
2.00 A
A
Average I
2
t vs. t Curves
10
10
100
100
2.00 A
2.00 A
1.60 A
1.60 A
1.25 A
1.25 A
1.00 A
1.00 A
0.80 A
0.80 A
0.63 A
0.63 A
0.50 A
0.50 A
1
1
10
10
PRE-ARCING TIME (SECONDS)
PRE-ARCING TIME (SECONDS)
I
2
t (A
2
s)
I
2
t (A
2
s)
1
0.1
0.1
1
0.01
0.01
0.1
0.1
0.001
0.001
0.0001
0.0001
0.1
0.1
1
1
10
10
100
100
0.01
0.01
0.0001
0.0001
0.001
0.001
0.01
0.01
0.1
0.1
1
1
10
10
CURRENT (A)
(A)
CURRENT
TIME (SECONDS)
TIME (SECONDS)
REV. A 04/18
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-2410SPxxxW Series Tape and Reel Packaging Specifications
3312 - 2 mm SMD Trimming Potentiometer
Tape Dimensions
W
P0
P1
P2
A0
B0
F
E
D0
D1
K0
T
PACKAGING: Plastic tape, 2,000 pcs. per reel
13.40 ± 0.50
(.539 ± .020)
0.8
0.6
0.4
0.2
SF-2410SPxxxW Series
per EIA 481-2
12.00 ± 0.10
(.48 ± .004)
4.0 ± 0.10
(.157 ± .004)
4.0 ± 0.10
(.157 ± .004)
2.0 ± 0.05
(.079 ± .002)
2.85 ± 0.10
(.114 ± .004)
6.40 ± 0.10
(.256 ± .004)
5.50 ± 0.10
(.220 ± .004)
1.75 ± 0.10
(.069 ± .004)
1.55 ± 0.10
(.059 ± .004)
1.55 ± 0.10
(.059 ± .004)
2.35 ± 0.10
(.094 ± .004)
0.25 ± 0.05
(.010 ± .002)
2.20 ± 0.30
(.087 ± .012)
178.00 ± 1.00
(7.008 ± .039)
DIA.
60.20 ± 0.50
(2.370 ± .020)
DIA.
13.20 +0.3/-0.2
(.520 +.012/-.008)
DIA.
E
F
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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