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GS8640FZ36GT-6.5VI

Description
SRAM 2.5 or 3.3V 2M x 36 72M
Categorystorage   
File Size162KB,21 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance
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GS8640FZ36GT-6.5VI Overview

SRAM 2.5 or 3.3V 2M x 36 72M

GS8640FZ36GT-6.5VI Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerGSI Technology
Product CategorySRAM
RoHSDetails
Memory Size72 Mbit
Organization2 M x 36
Access Time6.5 ns
Interface TypeParallel
Supply Voltage - Max3.6 V
Supply Voltage - Min2.3 V
Supply Current - Max275 mA
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT
Package / CaseTQFP-100
PackagingTray
Memory TypeSDR
TypeNBT Flow Through
Moisture SensitiveYes
Factory Pack Quantity18
GS8640FZ18/36T-5.5/6.5/7.5/8
100-Pin TQFP
Commercial Temp
Industrial Temp
Features
• NBT (No Bus Turn Around) functionality allows zero wait
read-write-read bus utilization; Fully pin-compatible with
Flow Through NtRAM™, NoBL™ and ZBT™ SRAMs
• 2.5 V or 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• Flow Through mode
• LBO pin for Linear or Interleave Burst mode
• Pin compatible with 4Mb, 9Mb, 18Mb and 36Mb devices
• Byte write operation (9-bit Bytes)
• 3 chip enable signals for easy depth expansion
• ZZ Pin for automatic power-down
• JEDEC-standard 100-lead TQFP package
• RoHS-compliant 100-lead TQFP package available
72Mb Flow Through
Synchronous NBT SRAM
5.5 ns–8 ns
2.5 V or 3.3 V V
DD
2.5 V or 3.3 V I/O
available bus bandwidth by eliminating the need to insert
deselect cycles when the device is switched from read to write
cycles.
Because it is a synchronous device, address, data inputs, and
read/ write control inputs are captured on the rising edge of the
input clock. Burst order control (LBO) must be tied to a power
rail for proper operation. Asynchronous inputs include the
Sleep mode enable (ZZ) and Output Enable. Output Enable can
be used to override the synchronous control of the output
drivers and turn the RAM's output drivers off at any time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex off-
chip write pulse generation required by asynchronous SRAMs
and simplifies input signal timing.
The GS8640FZ18/36T is configured to operate in Flow
Through mode.
The GS8640FZ18/36T is implemented with GSI's high
performance CMOS technology and is available in a JEDEC-
standard 100-pin TQFP package.
Functional Description
The GS8640FZ18/36T is a 72Mbit Synchronous Static SRAM.
GSI's NBT SRAMs, like ZBT, NtRAM, NoBL or other flow
through read/single late write SRAMs, allow utilization of all
Parameter Synopsis
-5.5
Flow
Through
2-1-1-1
t
KQ
tCycle
Curr
(x18)
Curr
(x36)
5.5
5.5
285
330
-6.5
6.5
6.5
245
280
-7.5
7.5
7.5
220
250
-8
8.0
8.0
210
240
Unit
ns
ns
mA
mA
Packages listed with the additional “G” designator are 6/6 RoHS compliant.
Rev: 1.01 10/2013
1/21
© 2006, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8640FZ36GT-6.5VI Related Products

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Description SRAM 2.5 or 3.3V 2M x 36 72M SRAM 2.5 or 3.3V 4M x 18 72M SRAM 2.5 or 3.3V 4M x 18 72M SRAM 2.5 or 3.3V 2M x 36 72M SRAM 2.5 or 3.3V 4M x 18 72M SRAM 2.5 or 3.3V 2M x 36 72M SRAM 2.5 or 3.3V 2M x 36 72M Static random access memory 2.5 or 3.3V 2M x 36 72M Static random access memory 2.5 or 3.3V 4M x 18 72M
Product Category SRAM SRAM SRAM SRAM SRAM SRAM SRAM static random access memory static random access memory
Interface Type Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel
Product Attribute Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value - -
Manufacturer GSI Technology GSI Technology GSI Technology GSI Technology GSI Technology GSI Technology GSI Technology - -
RoHS Details Details Details Details Details Details Details - -
Memory Size 72 Mbit 72 Mbit 72 Mbit 72 Mbit 72 Mbit 72 Mbit 72 Mbit - -
Organization 2 M x 36 4 M x 18 4 M x 18 2 M x 36 4 M x 18 2 M x 36 2 M x 36 - -
Access Time 6.5 ns 8 ns 8 ns 8 ns 6.5 ns 7.5 ns 8 ns - -
Supply Voltage - Max 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V - -
Supply Voltage - Min 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V - -
Supply Current - Max 275 mA 215 mA 215 mA 220 mA 250 mA 250 mA 240 mA - -
Minimum Operating Temperature - 40 C - 40 C - 40 C 0 C - 40 C - 40 C - 40 C - -
Maximum Operating Temperature + 85 C + 85 C + 85 C + 70 C + 85 C + 85 C + 85 C - -
Mounting Style SMD/SMT SMD/SMT SMD/SMT SMD/SMT SMD/SMT SMD/SMT SMD/SMT - -
Package / Case TQFP-100 TQFP-100 TQFP-100 TQFP-100 TQFP-100 TQFP-100 TQFP-100 - -
Packaging Tray Tray Tray Tray Tray Tray Tray - -
Memory Type SDR SDR SDR SDR SDR SDR SDR - -
Type NBT Flow Through NBT Flow Through NBT Flow Through NBT Flow Through NBT Flow Through NBT Flow Through NBT Flow Through - -
Moisture Sensitive Yes Yes Yes Yes Yes Yes Yes - -
Factory Pack Quantity 18 18 18 18 18 18 18 - -
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