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GS8322Z72GC-166EV

Description
SRAM 1.8/2.5V 512K x 72 36M
Categorystorage   
File Size419KB,28 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance
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GS8322Z72GC-166EV Overview

SRAM 1.8/2.5V 512K x 72 36M

GS8322Z72GC-166EV Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerGSI Technology
Product CategorySRAM
RoHSDetails
Memory Size36 Mbit
Organization512 k x 72
Access Time8 ns
Maximum Clock Frequency166 MHz
Interface TypeParallel
Supply Voltage - Max2.7 V
Supply Voltage - Min1.7 V
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 125 C
Mounting StyleSMD/SMT
Package / CaseBGA-209
PackagingTray
Memory TypeSDR
TypeNBT
Moisture SensitiveYes
Factory Pack Quantity14
GS8322Z2(C)-xxxV
09 BGA
Commercial Temp
Industrial Temp
Features
• NBT (No Bus Turn Around) functionality allows zero wait
Read-Write-Read bus utilization; fully pin-compatible with
both pipelined and flow through NtRAM™, NoBL™ and
ZBT™ SRAMs
• 1.8 V or 2.5 V core power supply
• 1.8 V or 2.5 V I/O supply
• User-configurable Pipeline and Flow Through mode
• ZQ mode pin for user-selectable high/low output drive
• IEEE 1149.1 JTAG-compatible Boundary Scan
• LBO pin for Linear or Interleave Burst mode
• Pin-compatible with 2Mb, 4Mb, 8Mb, and 16Mb devices
• Byte write operation (9-bit Bytes)
• 3 chip enable signals for easy depth expansion
• ZZ Pin for automatic power-down
• JEDEC-standard 209-Bump BGA package
• RoHS-compliant package available
36Mb Pipelined and Flow Through
Synchronous NBT SRAM
250 MHz–133 MHz
1.8 V or 2.5 V V
DD
1.8 V or 2.5 V I/O
Because it is a synchronous device, address, data inputs, and
read/write control inputs are captured on the rising edge of the
input clock. Burst order control (LBO) must be tied to a power
rail for proper operation. Asynchronous inputs include the
Sleep mode enable (ZZ) and Output Enable. Output Enable can
be used to override the synchronous control of the output
drivers and turn the RAM's output drivers off at any time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex off-
chip write pulse generation required by asynchronous SRAMs
and simplifies input signal timing.
The GS8322Z72-xxxV may be configured by the user to
operate in Pipeline or Flow Through mode. Operating as a
pipelined synchronous device, in addition to the rising-edge-
triggered registers that capture input signals, the device
incorporates a rising edge triggered output register. For read
cycles, pipelined SRAM output data is temporarily stored by
the edge-triggered output register during the access cycle and
then released to the output drivers at the next rising edge of
clock.
The GS8322Z72-xxxV is implemented with GSI's high
performance CMOS technology and is available in a JEDEC-
standard 209-bump BGA package.
Functional Description
The GS8322Z72-xxxV is a 36Mbit Synchronous Static
SRAM. GSI's NBT SRAMs, like ZBT, NtRAM, NoBL or
other pipelined read/double late write or flow through read/
single late write SRAMs, allow utilization of all available bus
bandwidth by eliminating the need to insert deselect cycles
when the device is switched from read to write cycles.
Parameter Synopsis
Pipeline
3-1-1-1
Flow
Through
2-1-1-1
t
KQ
tCycle
Curr
(x72)
t
KQ
tCycle
Curr
(x72)
-250 -225 -200 -166 -150 -133 Unit
3.0 3.0 3.0 3.5 3.8 4.0 ns
4.0 4.4 5.0 6.0 6.7 7.5 ns
415
6.5
6.5
300
385 340 305 285 255 mA
7.0 7.5 8.0 8.5 8.5 ns
7.0 7.5 8.0 8.5 8.5 ns
280 255 245 230 225 mA
Rev: 1.07 10/2014
1/28
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS8322Z72GC-166EV Related Products

GS8322Z72GC-166EV GS8322Z72GC-150EV GS8322Z72GC-225EV GS8322Z72GC-250EV GS8322Z72GC-133EV
Description SRAM 1.8/2.5V 512K x 72 36M SRAM 1.8/2.5V 512K x 72 36M SRAM 1.8/2.5V 512K x 72 36M Static random access memory 1.8/2.5V 512K x 72 36M Static random access memory 1.8/2.5V 512K x 72 36M
Product Category SRAM SRAM SRAM static random access memory static random access memory
Interface Type Parallel Parallel Parallel Parallel Parallel
Product Attribute Attribute Value Attribute Value Attribute Value - -
Manufacturer GSI Technology GSI Technology GSI Technology - -
RoHS Details Details Details - -
Memory Size 36 Mbit 36 Mbit 36 Mbit - -
Organization 512 k x 72 512 k x 72 512 k x 72 - -
Access Time 8 ns 8.5 ns 7 ns - -
Maximum Clock Frequency 166 MHz 150 MHz 225 MHz - -
Supply Voltage - Max 2.7 V 2.7 V 2.7 V - -
Supply Voltage - Min 1.7 V 1.7 V 1.7 V - -
Minimum Operating Temperature - 40 C - 40 C - 40 C - -
Maximum Operating Temperature + 125 C + 125 C + 125 C - -
Mounting Style SMD/SMT SMD/SMT SMD/SMT - -
Package / Case BGA-209 BGA-209 BGA-209 - -
Packaging Tray Tray Tray - -
Memory Type SDR SDR SDR - -
Type NBT NBT NBT - -
Moisture Sensitive Yes Yes Yes - -
Factory Pack Quantity 14 14 14 - -
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