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PCA9514AD

Description
Hot swappable I2C-bus and SMBus bus buffer
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size133KB,25 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Environmental Compliance
Download Datasheet Parametric Compare View All

PCA9514AD Overview

Hot swappable I2C-bus and SMBus bus buffer

PCA9514AD Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionSOP, SOP8,.25
Reach Compliance Codeunknow
Interface integrated circuit typeINTERFACE CIRCUIT
JESD-30 codeR-PDSO-G8
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
power supply3/5 V
Certification statusNot Qualified
Maximum slew rate6 mA
surface mountYES
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
PCA9513A; PCA9514A
Hot swappable I
2
C-bus and SMBus bus buffer
Rev. 01 — 11 October 2005
Product data sheet
1. General description
The PCA9513A and PCA9514A are hot swappable I
2
C-bus and SMBus buffers that allow
I/O card insertion into a live backplane without corrupting the data and clock buses.
Control circuitry prevents the backplane from being connected to the card until a stop
command or bus idle occurs on the backplane without bus contention on the card. When
the connection is made, the PCA9513A and PCA9514A provides bidirectional buffering,
keeping the backplane and card capacitances isolated.
Rise time accelerator circuitry allows the use of weaker DC pull-up currents while still
meeting rise time requirements. The PCA9513A and PCA9514A incorporates a digital
ENABLE input pin, which enables the device when asserted HIGH and forces the device
into a Low current mode when asserted LOW, and an open-drain READY output pin,
which indicates that the backplane and card sides are connected together (HIGH) or not
(LOW).
The PCA9513A supplies a 92
µA
current source to SCLIN and SDAIN pins in lieu of using
pull-up resistors which is ideal for multidrop bus applications. Including the current source
in the device provides for a consistent RC time constant as cards are removed and
inserted into the backplane. The current source is high-impedance whenever the pin
voltage is greater than the part V
CC
.
The PCA9513A and PCA9514A rise time accelerator threshold is 0.8 V to provide better
noise margin over the PCA9511A which is set to 0.6 V.
Remark:
The dynamic offset design of the PCA9510A/11A/12A/13A/14A I/O drivers allow
them to be connected to another PCA9510A/11A/12A/13A/14A device in series or in
parallel and to the A side of the PCA9517. The PCA9510A/11A/12A/13A/14A
cannot
connect to the static offset I/Os used on the PCA9515/15A/16/16A/18 or PCA9517 B side
or P82B96 Sx/y side.
2. Features
s
Bidirectional buffer for SDA and SCL lines increases fanout and prevents SDA and
SCL corruption during live board insertion and removal from multi-point backplane
systems
s
Compatible with I
2
C-bus Standard mode, I
2
C-bus Fast mode, and SMBus standards
s
Built-in
∆V/∆t
rise time accelerators on all SDA and SCL lines (0.8 V threshold)
s
Rise time accelerator threshold moved from 0.6 V to 0.8 V for improved noise margin
s
Active HIGH ENABLE input
s
Active HIGH READY open-drain output
s
High-impedance SDAn and SCLn pins for V
CC
= 0 V

PCA9514AD Related Products

PCA9514AD PCA9513ADP PCA9513AD PCA9514A PCA9514ADP PCA9513A
Description Hot swappable I2C-bus and SMBus bus buffer Hot swappable I2C-bus and SMBus bus buffer Hot swappable I2C-bus and SMBus bus buffer Hot swappable I2C-bus and SMBus bus buffer Hot swappable I2C-bus and SMBus bus buffer Hot swappable I2C-bus and SMBus bus buffer
Is it Rohs certified? conform to conform to conform to - conform to -
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.) -
package instruction SOP, SOP8,.25 TSSOP, TSSOP8,.19 SOP, SOP8,.25 - TSSOP, TSSOP8,.19 -
Reach Compliance Code unknow unknow unknow - unknow -
Interface integrated circuit type INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT - INTERFACE CIRCUIT -
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 - R-PDSO-G8 -
Number of terminals 8 8 8 - 8 -
Maximum operating temperature 85 °C 85 °C 85 °C - 85 °C -
Minimum operating temperature -40 °C -40 °C -40 °C - -40 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY -
encapsulated code SOP TSSOP SOP - TSSOP -
Encapsulate equivalent code SOP8,.25 TSSOP8,.19 SOP8,.25 - TSSOP8,.19 -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR -
Package form SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH -
power supply 3/5 V 3/5 V 3/5 V - 3/5 V -
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified -
Maximum slew rate 6 mA 6 mA 6 mA - 6 mA -
surface mount YES YES YES - YES -
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL - INDUSTRIAL -
Terminal form GULL WING GULL WING GULL WING - GULL WING -
Terminal pitch 1.27 mm 0.635 mm 1.27 mm - 0.635 mm -
Terminal location DUAL DUAL DUAL - DUAL -
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