®
RF360 Europe GmbH
A Qualcomm – TDK Joint Venture
SAW Components
SAW RF filter
GPS
Series/type:
Ordering code:
Date:
Version:
B3521
B39162B3521U410
January 25, 2013
2.6
RF360 products mentioned within this document are offered by RF360 Europe GmbH and other subsidiaries of
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is a joint venture of Qualcomm Global Trading Pte. Ltd. and EPCOS AG. References in this documentation to
EPCOS AG should properly reference, and shall be read to reference, the RF360 Subsidiaries.
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SAW Components
SAW RF filter
Data sheet
Application
s
Low-loss RF filter for GPS application
s
No matching network required for operation at
B3521
1575.42 MHz
50
Ω
Features
s
s
s
s
s
s
s
s
s
Package size 3.0 x 3.0 x 1.1 mm
3
Package code DCC6C
RoHS compatible
Approximate weight 0.037 g
Package for
Surface Mount Technology
(SMT)
Ni, gold-plated terminals
Lead free soldering compatible with J - STD20C
AEC-Q200 qualified component family
Electrostatic Sensitive Device
(ESD)
Pin configuration
s
2
s
5
s
1, 3, 4, 6
Input
Output
Ground
Please read
cautions and warnings and
important notes
at the end of this document.
2
January 25, 2013
SAW Components
SAW RF filter
Data sheet
Characteristics
Temperature range for specification:
Terminating source impedance:
Terminating load impedance:
T = –40 ˚C to +85 ˚C
Z
S
=
50
Ω
Z
L
=
50
Ω
min.
Center frequency
f
C
—
typ.
@ 25 ˚C
1575.42
max.
—
B3521
1575.42 MHz
MHz
Maximum insertion attenuation
α
max
1574.42 ... 1576.42 MHz
Amplitude ripple
(p-p)
∆α
1574.42 ... 1576.42 MHz
Input VSWR
1574.42 ... 1576.42 MHz
Output VSWR
1574.42 ... 1576.42 MHz
Attenuation
100.00 ... 1000.00
1500.00
1535.42
1615.42
1640.00
1700.00
MHz
MHz
MHz
MHz
MHz
MHz
α
—
3.2
3.5
dB
—
0.5
1.0
dB
—
—
1.9
1.9
2.3
2.3
60
40
35
25
45
50
70
43
42
33
48
52
—
—
—
—
—
—
dB
dB
dB
dB
dB
dB
Maximum ratings
Operable temperature range
Storage temperature range
DC voltage
Source power
T
T
stg
V
DC
P
S
–45/+125
–45/+125
6
10
20
˚C
˚C
V
dBm
dBm
source impedance 50
Ω
824 MHz to 915 MHz,
1710 MHz to1785 MHz
Please read
cautions and warnings and
important notes
at the end of this document.
3
January 25, 2013
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