C1210C223F3GAC datasheet, PDF - EEWORLD Datasheet

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C1210C223F3GAC: DescriptionCAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.1 uF, SURFACE MOUNT, 1206; CategoryPassive components capacitor; File Size46KB，2 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com; Environmental Compliance; Related ProductsFound3parts with similar functions to C1210C223F3GAC

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C1210C223F3GAC Overview

CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.1 uF, SURFACE MOUNT, 1206

C1210C223F3GAC Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	KEMET
package instruction	, 1210
Reach Compliance Code	compli
ECCN code	EAR99
capacitance	0.022 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	0.78 mm
JESD-609 code	e3
length	3.2 mm
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	1%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	TR, EMBOSSED PLASTIC, 7/13 INCH
positive tolerance	1%
Rated (DC) voltage (URdc)	25 V
size code	1210
surface mount	YES
Temperature characteristic code	C0G
Temperature Coefficient	-/+30ppm/Cel ppm/°C
Terminal surface	Matte Tin (Sn) - with Nickel (Ni) barrie
Terminal shape	WRAPAROUND
width	2.5 mm

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Product Bulletin

Surface Mount Ceramic Chip Capacitors – C0G Dielectric

Outline Drawing

ELECTRODES

NICKEL PLATE

CONDUCTIVE METALLIZATION

TIN PLATE

Dimensions - Millimeters (Inches)

EIA SIZE

CODE

0402

0603

0805

1206

1210

METRIC

SIZE CODE

1005

1608

2012

3216

3225

L - LENGTH

W - WIDTH

B - BANDWIDTH

SEPARATION

minimum

0.3 (.012)

0.7 (.028)

0.75 (.030)

N/A

Solder Wave +

Solder Reflow

MOUNTING

TECHNIQUE

Solder Reflow

1.0 (.04) ± .05 (.002)

1.6 (.063) ± .15 (.006)

2.0 (.079) ± .20 (.008)

3.2 (.126) ± .20 (.008)

0.5 (.02) ± .05 (.002)

0.8 (.032) ± .15 (.006)

1.25 (.049) ± .20 (.008)

1.6 (.063) ± .20 (.008)

2.5 (.098) ± .20 (.008)

0.20 (.008) -.40 (.016)

0.35 (.014) ± .15 (.006)

0.50 (.02) ± .25 (.010)

See Capacitance Value Chart below for thickness dimension.

+ For extended values 1210 case sizes - solder reflow only.

Electrical Parameters

As detailed in the KEMET Surface Mount Catalog F3102 for C0G, with following specific requirements based on room

temperature (25°C) parameters:

• Operating Range: -55°C to +125°C, with no-bias capacitance shift limited to ± 30 PPM/°C over that range.

• Insulation Resistance (IR) measured after 2 minutes at rated voltage @ 25°C: Limit is 1000 megohm microfarads or

100GΩ, whichever is less.

• Capacitance and Dissipation Factor (DF) measured at the following conditions.

Capacitance - 1 kHz and 1 vrms if capacitance >1000 pF

1 MHz and 1 vrms if capacitance

≤

1000 pF

DF Limit is 0.1%.

Soldering Process

These components are suitable for wave and reflow soldering. All parts incorporate the standard KEMET

barrier layer of pure nickel, with an overplate of pure tin to provide excellent solderability as well as resist-

ance to leaching.

Marking

These chips will be supplied unmarked. However, marking is available as an extra cost option.

Qualification/Certification

AEC-Q200 Rev. C - Automotive

RoHS 6 - 100% tin termination

F9126 5/07

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C1210C223F3GAC Similar Products

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C1210C223F3GAC7025	KEMET(基美)	Ceramic Capacitor, Multilayer, Ceramic, 25V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.022uF, Surface Mount, 1210, CHIP
C1210C223F3GAC3325	KEMET(基美)	Ceramic Capacitor, Multilayer, Ceramic, 25V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.022uF, Surface Mount, 1210, CHIP
C1210C223F3GAC7215	KEMET(基美)	Ceramic Capacitor, Multilayer, Ceramic, 25V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.022uF, Surface Mount, 1210, CHIP

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