2048-word x 8bit Erasable and Electrically Programmable Only Memory
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Hitachi (Renesas ) |
| package instruction | DIP, DIP24,.6 |
| Reach Compliance Code | unknow |
| Is Samacsys | N |
| Maximum access time | 450 ns |
| I/O type | COMMON |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| memory density | 16384 bi |
| memory width | 8 |
| Number of terminals | 24 |
| word count | 2048 words |
| character code | 2000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Programming voltage | 25 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | MOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| HN462716 | HN2716 | HN462716G | |
|---|---|---|---|
| Description | 2048-word x 8bit Erasable and Electrically Programmable Only Memory | 2048-word x 8bit Erasable and Electrically Programmable Only Memory | 2048-word x 8bit Erasable and Electrically Programmable Only Memory |
| Is it Rohs certified? | incompatible | - | incompatible |
| Maker | Hitachi (Renesas ) | - | Hitachi (Renesas ) |
| package instruction | DIP, DIP24,.6 | - | DIP, DIP24,.6 |
| Reach Compliance Code | unknow | - | unknow |
| Is Samacsys | N | - | N |
| Maximum access time | 450 ns | - | 450 ns |
| I/O type | COMMON | - | COMMON |
| JESD-30 code | R-XDIP-T24 | - | R-XDIP-T24 |
| JESD-609 code | e0 | - | e0 |
| memory density | 16384 bi | - | 16384 bi |
| memory width | 8 | - | 8 |
| Number of terminals | 24 | - | 24 |
| word count | 2048 words | - | 2048 words |
| character code | 2000 | - | 2000 |
| Maximum operating temperature | 70 °C | - | 70 °C |
| organize | 2KX8 | - | 2KX8 |
| Output characteristics | 3-STATE | - | 3-STATE |
| Package body material | CERAMIC | - | CERAMIC |
| encapsulated code | DIP | - | DIP |
| Encapsulate equivalent code | DIP24,.6 | - | DIP24,.6 |
| Package shape | RECTANGULAR | - | RECTANGULAR |
| Package form | IN-LINE | - | IN-LINE |
| power supply | 5 V | - | 5 V |
| Programming voltage | 25 V | - | 25 V |
| Certification status | Not Qualified | - | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | - | 5 V |
| surface mount | NO | - | NO |
| technology | MOS | - | MOS |
| Temperature level | COMMERCIAL | - | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | - | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | - | 2.54 mm |
| Terminal location | DUAL | - | DUAL |
| Base Number Matches | 1 | - | 1 |