C0201C758C4PAC datasheet, PDF - EEWORLD Datasheet

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C0201C758C4PAC: DescriptionCERAMIC CHIP CAPACITORS; File Size1MB，9 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

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C0201C758C4PAC Overview

CERAMIC CHIP CAPACITORS

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CERAMIC CHIP CAPACITORS

FEATURES

• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics

• 10, 16, 25, 50, 100 and 200 Volts

• Standard End Metalization: Tin-plate over nickel

barrier

• Available Capacitance Tolerances: ±0.10 pF; ±0.25

pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and

+80%-20%

• Tape and reel packaging per EIA481-1. (See page

92 for specific tape and reel information.) Bulk

Cassette packaging (0402, 0603, 0805 only) per

IEC60286-6 and EIAJ 7201.

• RoHS Compliant

CAPACITOR OUTLINE DRAWINGS

ELECTRODES

TIN PLATE

NICKEL PLATE

CONDUCTIVE

METALLIZATION

DIMENSIONS—MILLIMETERS AND (INCHES)

SIZE CODE

EIA

SIZE

CODE

METRIC

(Ref only)

CODE

SIZE CODE

0402*

1005

EIA

METRIC

L - LENGTH

0.6 (.024) ± .03 (.001)

1.0 (.04) ± .05 (.002)

1.6 (.063) ± .15 (.006)

2.0 (.079) ± .20 (.008)

3.2 (.126) ± .20 (.008)

4.5 (.177) ± .30 (.012)

5.6 (.220) ± .40 (.016)

W - WIDTH

0.3 ± (.012) ± .03 (.001)

0.5 (.02) ± .05 (.002)

0.8 (.032) ± .15 (.006)

1.25 (.049) ± .20 (.008)

1.6 (.063) ± .20 (.008)

2.5 (.098) ± .20 (.008)

3.2 (.126) ± .30 (.012)

6.4 (.252) ± .40 (.016)

5.0 (.197) ± .40 (.016)

6.3 (.248) ± .40 (.016)

THICKNESS

B - BANDWIDTH

0.15 (.006) ± .05 (.002)

0.20 (.008) -.40 (.016)

0.35 (.014) ± .15 (.006)

0.50 (.02) ± .25 (.010)

0.60 (.024) ± .35 (.014)

SEPARATION

minimum

N/A

0.3 (.012)

0.7 (.028)

0.75 (.030)

N/A

MOUNTING

TECHNIQUE

Solder Reflow

0201*

0603*

0402*

0805*

0603

1206*

0805*

1210*

1206*

1812

2220

2225

1812

0603

1608

1005

2012

1608

3216

2012

3225

3216

4532

4564

5650

5664

4532

4564

5650

5664

1210*

1825*

2220

2225

3225

See page 78

for thickness

dimensions.

Solder Wave +

Solder Reflow

Solder

Reflow

Solder Reflow

* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)

+ For extended value 1210 case size - solder reflow only.

CAPACITOR ORDERING INFORMATION

(Standard Chips - For

C 0805 C 103 K 5 R A C*

CERAMIC

SIZE CODE

SPECIFICATION

C - Standard

CAPACITANCE CODE

Expressed in Picofarads (pF)

First two digits represent significant figures.

Third digit specifies number of zeros. (Use 9

for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)

(Example: 2.2pF = 229 or 0.50 pF = 508)

CAPACITANCE TOLERANCE

B – ±0.10pF J – ±5%

C – ±0.25pF K – ±10%

D – ±0.5pF

M – ±20%

F – ±1%

P – (GMV) – special order only

G – ±2%

Z – +80%, -20%

Military see page

87)

END METALLIZATION

C-Standard (Tin-plated nickel barrier)

FAILURE RATE LEVEL

A- Not Applicable

TEMPERATURE CHARACTERISTIC

Designated by Capacitance

Change Over Temperature Range

G – C0G (NP0) (±30 PPM/°C)

R – X7R (±15%) (-55°C + 125°C)

P– X5R (±15%) (-55°C + 85°C)

U – Z5U (+22%, -56%) (+10°C + 85°C)

V – Y5V (+22%, -82%) (-30°C + 85°C)

VOLTAGE

1 - 100V

3 - 25V

2 - 200V

4 - 16V

5 - 50V

8 - 10V

* Part Number Example: C0805C103K5RAC (14 digits - no spaces)

7 - 4V

9 - 6.3V

Ceramic Surface Mount

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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