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BYG20J F3G

Description
Rectifiers 1.5 AMPS, 600V High Efficient
Categorysemiconductor    Discrete semiconductor   
File Size361KB,4 Pages
ManufacturerTaiwan Semiconductor
Websitehttp://www.taiwansemi.com/
Environmental Compliance
Download Datasheet Parametric View All

BYG20J F3G Overview

Rectifiers 1.5 AMPS, 600V High Efficient

BYG20J F3G Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTaiwan Semiconductor
Product CategoryRectifiers
RoHSDetails
PackagingReel
ProductRectifiers
Factory Pack Quantity1800
BYG20D - BYG20J
Taiwan Semiconductor
CREAT BY ART
1.5A, 200V - 600V High Efficient Surface Mount Rectifiers
FEATURES
- Glass passivated junction chip
- Ideal for automated placement
- Fast switching for high efficiency
- High surge current capability
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21
DO-214AC (SMA)
MECHANICAL DATA
Case:
DO-214AC (SMA)
Molding compound: UL flammability classification rating 94V-0
Part No. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound (halogen-free)
Moisture sensitivity level: level 1, per J-STD-020
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity:
Indicated by cathode band
Weight:
0.064 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25°C unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Maximum instantaneous forward voltage
(Note 1)
Maximum reverse current @ rated V
R
Pulse energy in avalanche mode, non repetitive
(Inductive load switch off ), L=120mH
Maximum reverse recovery time (Note 2)
Typical thermal resistance (Note 3)
Operating junction temperature range
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Mount on PC board with 5mm x 5mm copper pads as heatsink.
I
F
=1.0A
I
F
=1.5A
T
J
=25°C
T
J
=100°C
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
E
RSM
t
rr
R
θJL
R
θJA
T
J
T
STG
BYG20D
200
140
200
BYG20G
400
280
400
1.5
30
1.3
1.4
1
10
20
75
25
100
- 55 to +150
- 55 to +150
BYG20J
600
420
600
UNIT
V
V
V
A
A
V
μA
mJ
ns
°C/W
°C
°C
Document Number: DS_D0000075
Version: E15

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