B30931D7020Y918 datasheet, PDF

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B30931D7020Y918: DescriptionWiFi / 802.11 Modules RO78 (TI WL1837) WLAN BT/BLE; CategoryWireless rf/communication Telecom circuit; File Size2MB，51 Pages; ManufacturerEPCOS (TDK)

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B30931D7020Y918 Overview

WiFi / 802.11 Modules RO78 (TI WL1837) WLAN BT/BLE

B30931D7020Y918 Parametric

Parameter Name	Attribute value
Maker	EPCOS (TDK)
package instruction	BGA,
Reach Compliance Code	unknown
JESD-30 code	R-XBGA-B168
length	10.5 mm
Number of functions	1
Number of terminals	168
Maximum operating temperature	85 °C
Minimum operating temperature	-30 °C
Package body material	UNSPECIFIED
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Maximum seat height	1.4 mm
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	WIRELESS LAN CIRCUIT
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.7 mm
Terminal location	BOTTOM
width	9.3 mm

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Complementary wireless module WLAN / BT

Standard Laminate SiP Module

Series/Type:

Ordering code:

Date:

Version:

R078 (WL1837) / D7020

B30931D7020Y918

2014-12-9

1.3

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SAW IT

2014-12-9

1.3

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020



EPCOS AG 2014. Reproduction, publication and dissemination of this publication, enclosures hereto and the information

contained therein without EPCOS' prior express consent is prohibited.

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

1. Overview

This document details the specifications and features of R078 (WL1837) / D7020 SiP module. The R078

(WL1837) / D7020 SiP module is based on Texas Instruments WL1837 IC, specifically WL183x Data Sheet

version 1.4, such that the SiP module specification is subject to any subsequent changes in applicable Texas

Instruments documentation and software.

The R078 (WL1837) / D7020 contains the WL1837 SoC, 2.4GHz and 5 GHz SPDT switches, 2.4GHz and 5GHz

band pass filters / diplexer and necessary passive components for WLAN and BT in a highly integrated solution.

1.1



Features

WLAN, BT, BLE on a single chip provide universal connectivity in small PCB footprint.

Provides efficient direct connection to battery by employing several integrated switched mode power

supplies (DC2DC).

Based on 45nm CMOS technology using proven core technology.

Seamless integration with TI OMAP™ Application Processors.

WLAN and Bluetooth cores software and hardware are compatible with prior WL127x and WL128x

offerings, for smooth migration to Device.

Shared HCI transport for BT/BLE over UART and SDIO for WLAN.

Downloadable patches and firmware enables new features to be added for all functional block's.

Temperature detection and compensation mechanism ensures minimal variation in the RF performance

over the entire temperature range.

Bluetooth 4.0, BLE and all audio processing features work in parallel and include full coexistence with

WLAN

1.2

1.3

Applications

General Description

Mobile phone and mobile computer device applications.

The R078 (WL1837) / D7020 is a highly integrated WLAN, BT, BLE device that forms a complete standalone

communication system. The WL1837 is a highly integrated single-chip CMOS (45-nm process) incorporates the

core functionality of the WL1271/3 and WL1281/3 devices.

The device is the 8th-generation WLAN/BT/BLE devices from Texas Instruments. As such, the WL1837 is

based upon proven core technology and complements the TI integrated devices for connectivity portfolio.

R078 (WL1837) / D7020 is ideal for use in mobile phone and mobile computer device applications due to its low

current, small area and cellular phone coexistence-friendly features.

SAW IT

Please read

Cautions and warnings

and

Important notes

at the end of this document.

Page 2 of 51

2014-12-9

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